* Please refer to the English Version as our Official Version.
Image |
Part Number |
Manufacturer |
Description |
Package |
Stock |
Quantity |
Package |
Series |
Diode Type |
Voltage - DC Reverse (Vr) (Max) |
Current - Average Rectified (Io) |
Voltage - Forward (Vf) (Max) @ If |
Speed |
Reverse Recovery Time (trr) |
Current - Reverse Leakage @ Vr |
Capacitance @ Vr, F |
Mounting Type |
Package / Case |
Supplier Device Package |
Operating Temperature - Junction |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
DIODE SCHOTTKY 650V 20A TO220-2
|
Package: TO-220-2 |
Stock5,232 |
|
TO-220-2 |
thinQ!? |
Silicon Carbide Schottky |
650V |
20A (DC) |
1.7V @ 20A |
No Recovery Time > 500mA (Io) |
0ns |
700µA @ 650V |
590pF @ 1V, 1MHz |
Through Hole |
TO-220-2 |
PG-TO220-2 |
-55°C ~ 175°C |
||
Infineon Technologies |
DIODE SCHOTTKY 600V 6A TO220-2FP
|
Package: TO-220-2 Full Pack |
Stock6,640 |
|
TO-220-2 Full Pack |
thinQ!? |
Silicon Carbide Schottky |
600V |
6A (DC) |
1.7V @ 6A |
No Recovery Time > 500mA (Io) |
0ns |
80µA @ 600V |
280pF @ 1V, 1MHz |
Through Hole |
TO-220-2 Full Pack |
PG-TO220-2 Full Pack |
-55°C ~ 175°C |
||
Infineon Technologies |
DIODE GEN PURP 600V 10A WAFER
|
Package: Die |
Stock7,616 |
|
Die |
- |
Standard |
600V |
10A (DC) |
1.25V @ 10A |
Standard Recovery >500ns, > 200mA (Io) |
- |
27µA @ 600V |
- |
Surface Mount |
Die |
Sawn on foil |
-55°C ~ 150°C |
||
Infineon Technologies |
DIODE GEN PURP 600V 75A WAFER
|
Package: Die |
Stock7,056 |
|
Die |
- |
Standard |
600V |
75A (DC) |
1.9V @ 75A |
Standard Recovery >500ns, > 200mA (Io) |
- |
27µA @ 600V |
- |
Surface Mount |
Die |
Sawn on foil |
-40°C ~ 175°C |
||
Infineon Technologies |
DIODE GEN PURP 600V 30A WAFER
|
Package: Die |
Stock7,696 |
|
Die |
- |
Standard |
600V |
30A (DC) |
1.95V @ 30A |
Standard Recovery >500ns, > 200mA (Io) |
- |
27µA @ 600V |
- |
Surface Mount |
Die |
Sawn on foil |
-40°C ~ 175°C |
||
Infineon Technologies |
DIODE SCHOTTKY 650V 6A TO220-2
|
Package: TO-220-2 |
Stock6,256 |
|
TO-220-2 |
thinQ!? |
Silicon Carbide Schottky |
650V |
6A (DC) |
1.7V @ 6A |
No Recovery Time > 500mA (Io) |
0ns |
110µA @ 650V |
190pF @ 1V, 1MHz |
Through Hole |
TO-220-2 |
PG-TO220-2-1 |
-55°C ~ 175°C |
||
Infineon Technologies |
DIODE GEN PURP 600V 15A WAFER
|
Package: Die |
Stock6,208 |
|
Die |
- |
Standard |
600V |
15A (DC) |
1.25V @ 15A |
Standard Recovery >500ns, > 200mA (Io) |
- |
250µA @ 600V |
- |
Surface Mount |
Die |
Sawn on foil |
-55°C ~ 150°C |
||
Infineon Technologies |
DIODE GEN PURP 1.2KV 75A WAFER
|
Package: Die |
Stock7,184 |
|
Die |
- |
Standard |
1200V |
75A (DC) |
1.6V @ 75A |
Standard Recovery >500ns, > 200mA (Io) |
- |
27µA @ 1200V |
- |
Surface Mount |
Die |
Sawn on foil |
-55°C ~ 150°C |
||
Infineon Technologies |
DIODE SCHOTTKY 600V 6A D2PAK
|
Package: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB |
Stock3,376 |
|
TO-263-3, D2Pak (2 Leads + Tab), TO-263AB |
thinQ!? |
Silicon Carbide Schottky |
600V |
6A (DC) |
1.7V @ 6A |
No Recovery Time > 500mA (Io) |
0ns |
80µA @ 600V |
280pF @ 1V, 1MHz |
Surface Mount |
TO-263-3, D2Pak (2 Leads + Tab), TO-263AB |
D2PAK |
-55°C ~ 175°C |
||
Infineon Technologies |
DIODE GEN PURP 1.2KV 7A WAFER
|
Package: Die |
Stock7,920 |
|
Die |
- |
Standard |
1200V |
7A (DC) |
2.1V @ 7A |
Standard Recovery >500ns, > 200mA (Io) |
- |
27µA @ 1200V |
- |
Surface Mount |
Die |
Sawn on foil |
-55°C ~ 150°C |
||
Infineon Technologies |
DIODE GEN PURP 80V 250MA SOT23-3
|
Package: TO-236-3, SC-59, SOT-23-3 |
Stock7,712 |
|
TO-236-3, SC-59, SOT-23-3 |
- |
Standard |
80V |
250mA (DC) |
1.25V @ 150mA |
Fast Recovery =< 500ns, > 200mA (Io) |
4ns |
1µA @ 70V |
1.5pF @ 0V, 1MHz |
Surface Mount |
TO-236-3, SC-59, SOT-23-3 |
PG-SOT23-3 |
-65°C ~ 150°C |
||
Infineon Technologies |
DIODE SCHOTTKY 600V 5A WAFER
|
Package: Die |
Stock7,184 |
|
Die |
- |
Silicon Carbide Schottky |
600V |
5A (DC) |
1.7V @ 5A |
No Recovery Time > 500mA (Io) |
0ns |
200µA @ 600V |
170pF @ 1V, 1MHz |
Surface Mount |
Die |
Sawn on foil |
-55°C ~ 175°C |
||
Infineon Technologies |
DIODE SCHOTTKY 600V 4A TO252-3
|
Package: TO-252-3, DPak (2 Leads + Tab), SC-63 |
Stock12,000 |
|
TO-252-3, DPak (2 Leads + Tab), SC-63 |
thinQ!? |
Silicon Carbide Schottky |
600V |
4A (DC) |
1.9V @ 4A |
No Recovery Time > 500mA (Io) |
0ns |
200µA @ 600V |
150pF @ 0V, 1MHz |
Surface Mount |
TO-252-3, DPak (2 Leads + Tab), SC-63 |
P-TO252-3 |
-55°C ~ 175°C |
||
Infineon Technologies |
DIODE SIC 600V 4A SAWN WAFER
|
Package: Die |
Stock2,544 |
|
Die |
thinQ!? |
Silicon Carbide Schottky |
600V |
4A (DC) |
1.9V @ 4A |
No Recovery Time > 500mA (Io) |
0ns |
50µA @ 600V |
130pF @ 1V, 1MHz |
Surface Mount |
Die |
Die |
-55°C ~ 175°C |
||
Infineon Technologies |
DIODE GEN PURP 600V 50A WAFER
|
Package: Die |
Stock7,136 |
|
Die |
- |
Standard |
600V |
50A (DC) |
1.25V @ 50A |
Standard Recovery >500ns, > 200mA (Io) |
- |
27µA @ 600V |
- |
Surface Mount |
Die |
Sawn on foil |
-55°C ~ 150°C |
||
Infineon Technologies |
DIODE SHOCTTKY
|
Package: - |
Stock3,744 |
|
- |
* |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
||
Infineon Technologies |
DIODE SCHOTTKY 300V 10A TO220-3
|
Package: TO-220-3 |
Stock3,568 |
|
TO-220-3 |
thinQ!? |
Silicon Carbide Schottky |
300V |
10A (DC) |
1.7V @ 10A |
No Recovery Time > 500mA (Io) |
0ns |
200µA @ 300V |
600pF @ 0V, 1MHz |
Through Hole |
TO-220-3 |
PG-TO220-3 |
-55°C ~ 175°C |
||
Infineon Technologies |
DIODE SCHOTTKY 70V 70MA SOT23-3
|
Package: TO-236-3, SC-59, SOT-23-3 |
Stock3,328 |
|
TO-236-3, SC-59, SOT-23-3 |
- |
Schottky |
70V |
70mA (DC) |
1V @ 15mA |
Small Signal =< 200mA (Io), Any Speed |
100ps |
100nA @ 50V |
2pF @ 0V, 1MHz |
Surface Mount |
TO-236-3, SC-59, SOT-23-3 |
PG-SOT23-3 |
-55°C ~ 125°C |
||
Infineon Technologies |
DIODE SCHOTTKY 30V 200MA SOT23-3
|
Package: TO-236-3, SC-59, SOT-23-3 |
Stock98,682 |
|
TO-236-3, SC-59, SOT-23-3 |
- |
Schottky |
30V |
200mA (DC) |
800mV @ 100mA |
Small Signal =< 200mA (Io), Any Speed |
5ns |
2µA @ 25V |
10pF @ 1V, 1MHz |
Surface Mount |
TO-236-3, SC-59, SOT-23-3 |
PG-SOT23-3 |
150°C (Max) |
||
Infineon Technologies |
DIODE CHIP EMITTER CONTROLLED
|
Package: - |
Stock3,328 |
|
- |
* |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
||
Infineon Technologies |
DIODE GEN PURP 1.7KV 100A WAFER
|
Package: Die |
Stock6,528 |
|
Die |
- |
Standard |
1700V |
100A (DC) |
2.15V @ 100A |
Standard Recovery >500ns, > 200mA (Io) |
- |
27µA @ 1700V |
- |
Surface Mount |
Die |
Sawn on foil |
-40°C ~ 175°C |
||
Infineon Technologies |
DIODE SCHOTTKY 650V 10A TO263-2
|
Package: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB |
Stock3,312 |
|
TO-263-3, D2Pak (2 Leads + Tab), TO-263AB |
thinQ!? |
Silicon Carbide Schottky |
650V |
10A (DC) |
1.8V @ 10A |
No Recovery Time > 500mA (Io) |
0ns |
1.7mA @ 650V |
300pF @ 1V, 1MHz |
Surface Mount |
TO-263-3, D2Pak (2 Leads + Tab), TO-263AB |
PG-TO263-2 |
-55°C ~ 175°C |
||
Infineon Technologies |
DIODE GEN PURP 200V 250MA SOD323
|
Package: SC-76, SOD-323 |
Stock5,808 |
|
SC-76, SOD-323 |
- |
Standard |
200V |
250mA (DC) |
1.25V @ 200mA |
Fast Recovery =< 500ns, > 200mA (Io) |
50ns |
100nA @ 200V |
5pF @ 0V, 1MHz |
Surface Mount |
SC-76, SOD-323 |
PG-SOD323-2 |
150°C (Max) |
||
Infineon Technologies |
DIODE GEN PURP 650V 8A TO220-2
|
Package: TO-220-2 |
Stock7,500 |
|
TO-220-2 |
- |
Standard |
650V |
8A |
2.3V @ 3A |
Fast Recovery =< 500ns, > 200mA (Io) |
40ns |
40µA @ 650V |
- |
Through Hole |
TO-220-2 |
TO-220-2 |
-40°C ~ 175°C |
||
Infineon Technologies |
DIODE GEN PURP 80V 200MA TSLP-2
|
Package: SOD-882 |
Stock4,672 |
|
SOD-882 |
- |
Standard |
80V |
200mA (DC) |
1.25V @ 150mA |
Small Signal =< 200mA (Io), Any Speed |
4ns |
1µA @ 75V |
2pF @ 0V, 1MHz |
Surface Mount |
SOD-882 |
PG-TSLP-2 |
150°C (Max) |
||
Infineon Technologies |
DIODE SCHOTTKY 30V 200MA SC79-2
|
Package: SC-79, SOD-523 |
Stock3,264 |
|
SC-79, SOD-523 |
- |
Schottky |
30V |
200mA (DC) |
800mV @ 100mA |
Small Signal =< 200mA (Io), Any Speed |
5ns |
2µA @ 25V |
10pF @ 1V, 1MHz |
Surface Mount |
SC-79, SOD-523 |
PG-SC79-2 |
150°C (Max) |
||
Infineon Technologies |
DIODE SCHOTTKY 650V 4A TO220-2
|
Package: TO-220-2 |
Stock7,888 |
|
TO-220-2 |
thinQ!? |
Silicon Carbide Schottky |
650V |
4A (DC) |
1.7V @ 4A |
No Recovery Time > 500mA (Io) |
0ns |
70µA @ 650V |
130pF @ 1V, 1MHz |
Through Hole |
TO-220-2 |
PG-TO220-2-1 |
-55°C ~ 175°C |
||
Infineon Technologies |
DIODE GEN PURP 1.2KV 35A WAFER
|
Package: Die |
Stock4,832 |
|
Die |
- |
Standard |
1200V |
35A (DC) |
1.9V @ 35A |
Standard Recovery >500ns, > 200mA (Io) |
- |
27µA @ 1200V |
- |
Surface Mount |
Die |
Sawn on foil |
-55°C ~ 150°C |
||
Infineon Technologies |
DIODE GEN PURP 1.2KV 5A WAFER
|
Package: Die |
Stock2,704 |
|
Die |
- |
Standard |
1200V |
5A (DC) |
1.9V @ 5A |
Standard Recovery >500ns, > 200mA (Io) |
- |
27µA @ 1200V |
- |
Surface Mount |
Die |
Sawn on foil |
-55°C ~ 150°C |
||
Infineon Technologies |
DIODE SCHOTTKY 650V 10A VSON-4
|
Package: 4-PowerTSFN |
Stock4,496 |
|
4-PowerTSFN |
thinQ!? |
Silicon Carbide Schottky |
650V |
10A (DC) |
1.7V @ 10A |
No Recovery Time > 500mA (Io) |
0ns |
180µA @ 650V |
300pF @ 1V, 1MHz |
Surface Mount |
4-PowerTSFN |
PG-VSON-4 |
-55°C ~ 150°C |