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* Please refer to the English Version as our Official Version.
* Please refer to the English Version as our Official Version.
Image |
Part Number |
Manufacturer |
Description |
Package |
Stock |
Quantity |
Package |
Series |
Type |
Number of Positions or Pins (Grid) |
Pitch - Mating |
Contact Finish - Mating |
Contact Finish Thickness - Mating |
Contact Material - Mating |
Mounting Type |
Features |
Termination |
Pitch - Post |
Contact Finish - Post |
Contact Finish Thickness - Post |
Contact Material - Post |
Housing Material |
Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 14POS GOLD
|
Package: - |
Stock23,484 |
|
- |
299 |
DIP, 0.3" (7.62mm) Row Spacing |
14 (2 x 7) |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole, Right Angle, Horizontal |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
|
|
Aries Electronics |
CONN SOCKET SIP 20POS TIN
|
Package: - |
Stock32,364 |
|
- |
511 |
SIP |
20 (1 x 20) |
0.100" (2.54mm) |
Tin |
50µin (1.27µm) |
Phosphor Bronze |
Through Hole |
- |
Solder |
0.100" (2.54mm) |
Tin |
50µin (1.27µm) |
Phosphor Bronze |
Polyamide (PA46), Nylon 4/6, Glass Filled |
-55°C ~ 105°C |
|
|
|
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 12POS GOLD
|
Package: - |
Stock6,246 |
|
- |
299 |
DIP, 0.3" (7.62mm) Row Spacing |
12 (2 x 6) |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole, Right Angle, Horizontal |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin-Lead |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
|
|
TE Connectivity AMP Connectors |
CONN SOCKET SIP 10POS GOLD
|
Package: - |
Stock28,044 |
|
- |
510 |
SIP |
10 (1 x 10) |
0.100" (2.54mm) |
Gold |
20µin (0.51µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
20µin (0.51µm) |
Copper |
Thermoplastic, Polyester |
- |
|
|
|
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 40POS GOLD
|
Package: - |
Stock26,556 |
|
- |
115 |
DIP, 0.6" (15.24mm) Row Spacing |
40 (2 x 20) |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
|
|
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 40POS GOLD
|
Package: - |
Stock16,362 |
|
- |
210 |
DIP, 0.6" (15.24mm) Row Spacing |
40 (2 x 20) |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
|
|
Aries Electronics |
CONN SOCKET SIP 40POS GOLD
|
Package: - |
Stock53,592 |
|
- |
518 |
SIP |
40 (1 x 40) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
|
|
|
Aries Electronics |
CONN SOCKET SIP 25POS GOLD
|
Package: - |
Stock22,092 |
|
- |
0513 |
SIP |
25 (1 x 25) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
- |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
|
|
|
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 40POS GOLD
|
Package: - |
Stock13,284 |
|
- |
110 |
DIP, 0.6" (15.24mm) Row Spacing |
40 (2 x 20) |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin-Lead |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
|
|
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 40POS GOLD
|
Package: - |
Stock21,972 |
|
- |
110 |
DIP, 0.6" (15.24mm) Row Spacing |
40 (2 x 20) |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET 40POS GOLD
|
Package: - |
Stock24,552 |
|
- |
518 |
DIP, 0.6" (15.24mm) Row Spacing |
40 (2 x 20) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
|
|
|
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 32POS GOLD
|
Package: - |
Stock20,538 |
|
- |
210 |
DIP, 0.6" (15.24mm) Row Spacing |
32 (2 x 16) |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
|
|
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 32POS TIN
|
Package: - |
Stock14,388 |
|
- |
214 |
DIP, 0.6" (15.24mm) Row Spacing |
32 (2 x 16) |
0.100" (2.54mm) |
Tin |
100µin (2.54µm) |
Beryllium Copper |
Surface Mount |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET 32POS GOLD
|
Package: - |
Stock51,420 |
|
- |
518 |
DIP, 0.6" (15.24mm) Row Spacing |
32 (2 x 16) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
|
|
|
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 28POS GOLD
|
Package: - |
Stock20,328 |
|
- |
210 |
DIP, 0.6" (15.24mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
|
|
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 32POS GOLD
|
Package: - |
Stock18,780 |
|
- |
110 |
DIP, 0.6" (15.24mm) Row Spacing |
32 (2 x 16) |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
|
|
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 40POS GOLD
|
Package: - |
Stock17,394 |
|
- |
110 |
DIP, 0.6" (15.24mm) Row Spacing |
40 (2 x 20) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
|
|
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 28POS GOLD
|
Package: - |
Stock13,788 |
|
- |
110 |
DIP, 0.3" (7.62mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin-Lead |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
|
|
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 28POS GOLD
|
Package: - |
Stock20,790 |
|
- |
110 |
DIP, 0.6" (15.24mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
|
|
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 28POS GOLD
|
Package: - |
Stock27,792 |
|
- |
110 |
DIP, 0.3" (7.62mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
|
|
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 16POS GOLD
|
Package: - |
Stock15,624 |
|
- |
110 |
DIP, 0.3" (7.62mm) Row Spacing |
16 (2 x 8) |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
|
|
Mill-Max Manufacturing Corp. |
CONN SOCKET PLCC 84POS TIN
|
Package: - |
Stock16,740 |
|
- |
940 |
PLCC |
84 (4 x 21) |
0.100" (2.54mm) |
Tin |
150µin (3.81µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
|
|
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 28POS GOLD
|
Package: - |
Stock53,868 |
|
- |
110 |
DIP, 0.6" (15.24mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
|
|
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 14POS GOLD
|
Package: - |
Stock30,606 |
|
- |
110 |
DIP, 0.3" (7.62mm) Row Spacing |
14 (2 x 7) |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
|
|
Mill-Max Manufacturing Corp. |
CONN SOCKET PLCC 32POS TIN
|
Package: - |
Stock58,236 |
|
- |
540 |
PLCC |
32 (2 x 7, 2 x 9) |
0.050" (1.27mm) |
Tin |
150µin (3.81µm) |
- |
Surface Mount |
Closed Frame |
Solder |
0.050" (1.27mm) |
Tin |
150µin (3.81µm) |
- |
Polyphenylene Sulfide (PPS) |
- |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET 10POS GOLD
|
Package: - |
Stock12,156 |
|
- |
Lo-PRO?file, 513 |
DIP, 0.3" (7.62mm) Row Spacing |
10 (2 x 5) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
|
|
|
Assmann WSW Components |
CONN IC DIP SOCKET 40POS TIN
|
Package: - |
Stock45,570 |
|
- |
- |
DIP, 0.6" (15.24mm) Row Spacing |
40 (2 x 20) |
0.100" (2.54mm) |
Tin |
- |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Thermoplastic, Polyester |
-40°C ~ 105°C |
|
|
|
Amphenol FCI |
CONN SOCKET PLCC 44POS TIN
|
Package: - |
Stock45,306 |
|
- |
- |
PLCC |
44 (4 x 11) |
0.050" (1.27mm) |
Tin |
100µin (2.54µm) |
Copper Alloy |
Through Hole |
Closed Frame |
Solder |
0.050" (1.27mm) |
Tin |
100µin (2.54µm) |
Copper Alloy |
Polyphenylene Sulfide (PPS) |
-40°C ~ 105°C |
|
|
|
Mill-Max Manufacturing Corp. |
CONN TRANSIST TO-5 4POS GOLD
|
Package: - |
Stock30,186 |
|
- |
917 |
Transistor, TO-5 |
4 (Round) |
- |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
- |
Tin |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET 20POS GOLD
|
Package: - |
Stock27,030 |
|
- |
518 |
DIP, 0.3" (7.62mm) Row Spacing |
20 (2 x 10) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
