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Sockets for ICs, Transistors

Records 11083
Page  364/370
Image
Part Number
Manufacturer
Description
Package
Stock
Quantity
Package
Series
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
Assmann WSW Components
CONN SOCKET PLCC 28POS TIN
Package: -
Stock27,972
-
-
PLCC
28 (4 x 7)
0.050" (1.27mm)
Tin
160µin (4.06µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
160µin (4.06µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT)
-40°C ~ 105°C
On Shore Technology Inc.
CONN IC DIP SOCKET 20POS GOLD
Package: -
Stock34,614
-
SA
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Thermoplastic, Polyester, Glass Filled
-40°C ~ 105°C
3M
CONN IC DIP SOCKET 40POS TIN
Package: -
Stock21,156
-
4800
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Polyester, Glass Filled
-25°C ~ 85°C
Assmann WSW Components
IC PLCC SOCKET 32POS TIN SMD
Package: -
Stock102,438
-
-
PLCC
32 (4 x 8)
0.050" (1.27mm)
Tin
160µin (4.06µm)
Phosphor Bronze
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
160µin (4.06µm)
Phosphor Bronze
Polyamide (PA9T), Nylon 9T, Glass Filled
-40°C ~ 105°C
TE Connectivity AMP Connectors
40P,DIP SKT,600 CL,LDR,PB FREE
Package: -
Stock23,010
-
Diplomate DL
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
60µin (1.52µm)
Nickel
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
CNC Tech
CONN IC DIP SOCKET 18POS GOLD
Package: -
Stock87,918
-
-
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Gold
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polybutylene Terephthalate (PBT)
-40°C ~ 105°C
Preci-Dip
CONN IC DIP SOCKET 16POS GOLD
Package: -
Stock17,274
-
110
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
3M
CONN IC DIP SOCKET 40POS TIN
Package: -
Stock22,626
-
4800
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Polyester, Glass Filled
-25°C ~ 85°C
On Shore Technology Inc.
CONN IC DIP SOCKET 18POS GOLD
Package: -
Stock25,956
-
SA
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Thermoplastic, Polyester, Glass Filled
-40°C ~ 105°C
On Shore Technology Inc.
CONN IC DIP SOCKET 16POS GOLD
Package: -
Stock27,636
-
SA
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
80µin (2.03µm)
Brass
Thermoplastic, Polyester, Glass Filled
-40°C ~ 105°C
3M
CONN IC DIP SOCKET 28POS TIN
Package: -
Stock48,360
-
4800
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Polyester, Glass Filled
-25°C ~ 85°C
3M
CONN IC DIP SOCKET 24POS TIN
Package: -
Stock23,952
-
4800
DIP, 0.6" (15.24mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Polyester, Glass Filled
-25°C ~ 85°C
3M
CONN IC DIP SOCKET 24POS TIN
Package: -
Stock75,738
-
4800
DIP, 0.3" (7.62mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Polyester, Glass Filled
-25°C ~ 85°C
3M
CONN IC DIP SOCKET 28POS TIN
Package: -
Stock13,770
-
4800
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Polyester, Glass Filled
-25°C ~ 85°C
3M
CONN IC DIP SOCKET 32POS TIN
Package: -
Stock18,102
-
4800
DIP, 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Polyester, Glass Filled
-25°C ~ 85°C
On Shore Technology Inc.
CONN IC DIP SOCKET 14POS GOLD
Package: -
Stock22,764
-
SA
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
80µin (2.03µm)
Brass
Thermoplastic, Polyester, Glass Filled
-40°C ~ 105°C
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 8POS TIN-LEAD
Package: -
Stock36,330
-
110
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Tin-Lead
200µin (5.08µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 8POS TIN
Package: -
Stock36,348
-
110
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Tin
100µin (2.54µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
Assmann WSW Components
CONN IC DIP SOCKET 6POS GOLD
Package: -
Stock294,156
-
-
DIP, 0.3" (7.62mm) Row Spacing
6 (2 x 3)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Thermoplastic, Polyester
-40°C ~ 105°C
TE Connectivity AMP Connectors
28P,DIP SKT,600 CL,LDR,PB FREE
Package: -
Stock32,892
-
Diplomate DL
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
60µin (1.52µm)
Nickel
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
TE Connectivity AMP Connectors
28P,DIP SKT,300 CL,LDR,PB FREE
Package: -
Stock82,590
-
*
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Assmann WSW Components
CONN SOCKET PLCC 20POS TIN
Package: -
Stock20,430
-
-
PLCC
20 (4 x 5)
0.050" (1.27mm)
Tin
160µin (4.06µm)
Phosphor Bronze
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
160µin (4.06µm)
Phosphor Bronze
Polyamide (PA9T), Nylon 9T, Glass Filled
-40°C ~ 105°C
Assmann WSW Components
CONN IC DIP SOCKET 40POS TIN
Package: -
Stock43,266
-
-
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Polybutylene Terephthalate (PBT)
-55°C ~ 85°C
CNC Tech
CONN SOCKET PLCC 44POS TIN
Package: -
Stock67,212
-
-
PLCC
44 (4 x 11)
0.050" (1.27mm)
Tin
-
Phosphor Bronze
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
-
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
3M
CONN IC DIP SOCKET 20POS TIN
Package: -
Stock18,792
-
4800
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Polyester, Glass Filled
-25°C ~ 85°C
3M
CONN IC DIP SOCKET 20POS TIN
Package: -
Stock27,666
-
4800
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Polyester, Glass Filled
-25°C ~ 85°C
Preci-Dip
CONN IC DIP SOCKET 10POS GOLD
Package: -
Stock23,718
-
110
DIP, 0.2" (5.08mm) Row Spacing
10 (2 x 5)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
Preci-Dip
CONN IC DIP SOCKET 10POS GOLD
Package: -
Stock18,816
-
110
DIP, 0.3" (7.62mm) Row Spacing
10 (2 x 5)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
Harwin Inc.
CONN SOCKET SIP 6POS GOLD
Package: -
Stock14,814
-
D01-997
SIP
6 (1 x 6)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Tin
196.8µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
3M
CONN IC DIP SOCKET 16POS TIN
Package: -
Stock22,320
-
4800
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Polyester, Glass Filled
-25°C ~ 85°C