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Sockets for ICs, Transistors

Records 11083
Page  361/370
Image
Part Number
Manufacturer
Description
Package
Stock
Quantity
Package
Series
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
Mill-Max Manufacturing Corp.
CONN SOCKET PLCC 20POS TIN
Package: -
Stock8,688
-
540
PLCC
20 (4 x 5)
0.050" (1.27mm)
Tin
150µin (3.81µm)
-
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
150µin (3.81µm)
-
Polyphenylene Sulfide (PPS)
-
Assmann WSW Components
CONN IC DIP SOCKET 32POS GOLD
Package: -
Stock18,000
-
-
DIP, 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Thermoplastic, Polyester
-40°C ~ 105°C
Mill-Max Manufacturing Corp.
CONN SOCKET PLCC 44POS TIN
Package: -
Stock15,108
-
540
PLCC
44 (4 x 11)
0.050" (1.27mm)
Tin
150µin (3.81µm)
-
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
150µin (3.81µm)
-
Polyphenylene Sulfide (PPS)
-
Assmann WSW Components
CONN IC DIP SOCKET 16POS GOLD
Package: -
Stock22,332
-
-
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
-
Beryllium Copper
Through Hole
Open Frame
Wire Wrap
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Thermoplastic, Polyester
-40°C ~ 105°C
Mill-Max Manufacturing Corp.
CONN TRANSIST TO-5 8POS GOLD
Package: -
Stock20,010
-
917
Transistor, TO-5
8 (Round)
-
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
-
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
Assmann WSW Components
CONN IC DIP SOCKET 28POS GOLD
Package: -
Stock14,286
-
-
DIP, 0.3" (7.62mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Thermoplastic, Polyester
-40°C ~ 105°C
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 18POS GOLD
Package: -
Stock21,900
-
115
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 20POS GOLD
Package: -
Stock29,760
-
800
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
Flash
Copper
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 105°C
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 40POS TIN
Package: -
Stock13,176
-
110
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Tin
100µin (2.54µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
Harwin Inc.
CONN SOCKET SIP 32POS GOLD
Package: -
Stock13,488
-
D01-997
SIP
32 (1 x 32)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Tin
196.8µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 18POS TIN
Package: -
Stock30,540
-
214
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Tin
100µin (2.54µm)
Beryllium Copper
Surface Mount
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 22POS GOLD
Package: -
Stock12,318
-
110
DIP, 0.4" (10.16mm) Row Spacing
22 (2 x 11)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 16POS GOLD
Package: -
Stock16,722
-
110
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8), 8 Loaded
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 14POS GOLD
Package: -
Stock16,020
-
110
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7), 8 Loaded
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 10POS GOLD
Package: -
Stock17,844
-
110
DIP, 0.2" (5.08mm) Row Spacing
10 (2 x 5), 8 Loaded
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
3M
CONN SOCKET PLCC 68POS TIN
Package: -
Stock13,704
-
8400
PLCC
68 (4 x 17)
0.050" (1.27mm)
Tin
160µin (4.06µm)
Copper Alloy
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Tin
160µin (4.06µm)
Copper Alloy
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 16POS GOLD
Package: -
Stock16,548
-
111
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
Aries Electronics
CONN IC DIP SOCKET 18POS GOLD
Package: -
Stock15,558
-
518
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
3M
CONN SOCKET PLCC 68POS TIN
Package: -
Stock13,632
-
8400
PLCC
68 (4 x 17)
0.050" (1.27mm)
Tin
160µin (4.06µm)
Copper Alloy
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
160µin (4.06µm)
Copper Alloy
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
3M
CONN SOCKET PLCC 68POS TIN
Package: -
Stock16,626
-
8400
PLCC
68 (4 x 17)
0.050" (1.27mm)
Tin
160µin (4.06µm)
Copper Alloy
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
160µin (4.06µm)
Copper Alloy
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 20POS GOLD
Package: -
Stock18,942
-
110
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 16POS GOLD
Package: -
Stock16,026
-
115
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 14POS GOLD
Package: -
Stock15,354
-
115
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 14POS GOLD
Package: -
Stock22,956
-
115
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
Amphenol FCI
CONN SOCKET PLCC 44POS TIN
Package: -
Stock16,392
-
-
PLCC
44 (4 x 11)
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Polyphenylene Sulfide (PPS)
-55°C ~ 125°C
Amphenol FCI
CONN SOCKET PLCC 44POS TIN
Package: -
Stock36,744
-
-
PLCC
44 (4 x 11)
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Polyphenylene Sulfide (PPS)
-55°C ~ 125°C
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 14POS TIN
Package: -
Stock24,228
-
214
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Tin
100µin (2.54µm)
Beryllium Copper
Surface Mount
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
Mill-Max Manufacturing Corp.
CONN TRANSIST TO-5 3POS GOLD
Package: -
Stock34,284
-
917
Transistor, TO-5
3 (Round)
-
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
-
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
Assmann WSW Components
CONN SOCKET PLCC 52POS GOLD
Package: -
Stock24,876
-
-
PLCC
52 (4 x 13)
0.050" (1.27mm)
Gold
-
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
-
Phosphor Bronze
Polybutylene Terephthalate (PBT)
-40°C ~ 105°C
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 18POS GOLD
Package: -
Stock16,374
-
110
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C