* Please refer to the English Version as our Official Version.
Image |
Part Number |
Manufacturer |
Description |
Package |
Stock |
Quantity |
Package |
Series |
Type |
Number of Positions or Pins (Grid) |
Pitch - Mating |
Contact Finish - Mating |
Contact Finish Thickness - Mating |
Contact Material - Mating |
Mounting Type |
Features |
Termination |
Pitch - Post |
Contact Finish - Post |
Contact Finish Thickness - Post |
Contact Material - Post |
Housing Material |
Operating Temperature |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
TE Connectivity AMP Connectors |
CONN TRANSIST TO-5 3POS GOLD
|
Package: - |
Stock8,508 |
|
- |
8060 |
Transistor, TO-5 |
3 (Round) |
- |
Gold |
- |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
- |
Gold |
- |
Beryllium Copper |
Polytetrafluoroethylene (PTFE) |
-55°C ~ 125°C |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 28POS TIN
|
Package: - |
Stock6,588 |
|
- |
55 |
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS), Glass Filled |
- |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 40POS TIN
|
Package: - |
Stock9,540 |
|
- |
Lo-PRO?file, 526 |
DIP, ZIF (ZIP) |
40 (2 x 20) |
0.100" (2.54mm) |
Tin |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
10µin (0.25µm) |
Beryllium Copper |
Polyamide (PA46), Nylon 4/6, Glass Filled |
-55°C ~ 105°C |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 28POS TIN
|
Package: - |
Stock19,062 |
|
- |
Lo-PRO?file, 526 |
DIP, ZIF (ZIP) |
28 (2 x 14) |
0.100" (2.54mm) |
Tin |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
10µin (0.25µm) |
Beryllium Copper |
Polyamide (PA46), Nylon 4/6, Glass Filled |
-55°C ~ 105°C |
||
Aries Electronics |
CONN IC DIP SOCKET 12POS GOLD
|
Package: - |
Stock7,848 |
|
- |
Vertisockets? 800 |
DIP, 0.3" (7.62mm) Row Spacing |
12 (2 x 6) |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole, Right Angle, Vertical |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
||
Aries Electronics |
CONN IC DIP SOCKET 14POS GOLD
|
Package: - |
Stock9,156 |
|
- |
Vertisockets? 800 |
DIP, 0.3" (7.62mm) Row Spacing |
14 (2 x 7) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Phosphor Bronze |
Through Hole, Right Angle, Horizontal |
Closed Frame |
Solder |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Phosphor Bronze |
Polyamide (PA46), Nylon 4/6 |
- |
||
TE Connectivity AMP Connectors |
CONN TRANSIST TO-5 4POS GOLD
|
Package: - |
Stock8,820 |
|
- |
8060 |
Transistor, TO-5 |
4 (Round) |
- |
Gold |
- |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
- |
Gold |
- |
Beryllium Copper |
Polytetrafluoroethylene (PTFE) |
-55°C ~ 125°C |
||
Aries Electronics |
CONN IC DIP SOCKET 14POS GOLD
|
Package: - |
Stock6,480 |
|
- |
Vertisockets? 800 |
DIP, 0.3" (7.62mm) Row Spacing |
14 (2 x 7) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Phosphor Bronze |
Through Hole, Right Angle, Vertical |
Closed Frame |
Solder |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Phosphor Bronze |
Polyamide (PA46), Nylon 4/6 |
- |
||
Aries Electronics |
CONN IC DIP SOCKET 14POS TIN
|
Package: - |
Stock14,190 |
|
- |
Vertisockets? 800 |
DIP, 0.3" (7.62mm) Row Spacing |
14 (2 x 7) |
0.100" (2.54mm) |
Tin |
50µin (1.27µm) |
Phosphor Bronze |
Through Hole, Right Angle, Vertical |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
50µin (1.27µm) |
Phosphor Bronze |
Polyamide (PA46), Nylon 4/6 |
- |
||
Aries Electronics |
CONN IC DIP SOCKET 40POS GOLD
|
Package: - |
Stock6,444 |
|
- |
EJECT-A-DIP? |
DIP, 0.6" (15.24mm) Row Spacing |
40 (2 x 20) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
-55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN TRANSIST TO-5 3POS GOLD
|
Package: - |
Stock6,708 |
|
- |
8060 |
Transistor, TO-5 |
3 (Round) |
- |
Gold |
- |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
- |
Gold |
- |
Beryllium Copper |
Polytetrafluoroethylene (PTFE) |
-55°C ~ 125°C |
||
Aries Electronics |
CONN IC DIP SOCKET 10POS TIN
|
Package: - |
Stock41,598 |
|
- |
Vertisockets? 800 |
DIP, 0.2" (5.08mm) Row Spacing |
10 (2 x 5) |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Phosphor Bronze |
Through Hole, Right Angle, Vertical |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Phosphor Bronze |
Polyamide (PA46), Nylon 4/6 |
- |
||
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 40POS GOLD
|
Package: - |
Stock16,380 |
|
- |
123 |
DIP, 0.6" (15.24mm) Row Spacing |
40 (2 x 20) |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Wire Wrap |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN TRANSIST TO-5 3POS GOLD
|
Package: - |
Stock28,776 |
|
- |
8060 |
Transistor, TO-5 |
3 (Round) |
- |
Gold |
- |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
- |
Gold |
- |
Beryllium Copper |
Polytetrafluoroethylene (PTFE) |
-55°C ~ 125°C |
||
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 20POS GOLD
|
Package: - |
Stock6,132 |
|
- |
299 |
DIP, 0.3" (7.62mm) Row Spacing |
20 (2 x 10) |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole, Right Angle, Horizontal |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin-Lead |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN TRANSIST TO-5 3POS GOLD
|
Package: - |
Stock14,370 |
|
- |
8058 |
Transistor, TO-5 |
3 (Round) |
- |
Gold |
- |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
- |
Gold |
- |
Brass |
Polytetrafluoroethylene (PTFE) |
-55°C ~ 125°C |
||
Aries Electronics |
CONN IC DIP SOCKET 28POS GOLD
|
Package: - |
Stock21,612 |
|
- |
EJECT-A-DIP? |
DIP, 0.6" (15.24mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
-55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 16POS GOLD
|
Package: - |
Stock21,396 |
|
- |
500 |
DIP, 0.3" (7.62mm) Row Spacing |
16 (2 x 8) |
0.100" (2.54mm) |
Gold |
- |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
- |
- |
Brass |
- |
-55°C ~ 125°C |
||
Mill-Max Manufacturing Corp. |
CONN SOCKET SIP 21POS GOLD
|
Package: - |
Stock9,384 |
|
- |
317 |
SIP |
21 (1 x 21) |
0.070" (1.78mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
- |
Solder |
0.070" (1.78mm) |
Tin-Lead |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
||
Assmann WSW Components |
CONN IC DIP SOCKET 40POS GOLD
|
Package: - |
Stock6,960 |
|
- |
- |
DIP, 0.6" (15.24mm) Row Spacing |
40 (2 x 20) |
0.100" (2.54mm) |
Gold |
- |
Beryllium Copper |
Through Hole |
Open Frame |
Wire Wrap |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Thermoplastic, Polyester |
-40°C ~ 105°C |
||
Aries Electronics |
CONN SOCKET SIP 40POS GOLD
|
Package: - |
Stock9,552 |
|
- |
518 |
SIP |
40 (1 x 40) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
||
Harwin Inc. |
CONN SOCKET SIP 32POS GOLD
|
Package: - |
Stock7,260 |
|
- |
D01-995 |
SIP |
32 (1 x 32) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
- |
Wire Wrap |
0.100" (2.54mm) |
Tin |
196.8µin (5.00µm) |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
-55°C ~ 125°C |
||
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 40POS GOLD
|
Package: - |
Stock16,848 |
|
- |
110 |
DIP, 0.6" (15.24mm) Row Spacing |
40 (2 x 20) |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
||
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 14POS GOLD
|
Package: - |
Stock13,392 |
|
- |
299 |
DIP, 0.3" (7.62mm) Row Spacing |
14 (2 x 7) |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole, Right Angle, Horizontal |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin-Lead |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
||
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 12POS GOLD
|
Package: - |
Stock7,128 |
|
- |
299 |
DIP, 0.3" (7.62mm) Row Spacing |
12 (2 x 6) |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole, Right Angle, Horizontal |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
||
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 12POS GOLD
|
Package: - |
Stock16,980 |
|
- |
299 |
DIP, 0.3" (7.62mm) Row Spacing |
12 (2 x 6) |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole, Right Angle, Horizontal |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
||
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 12POS GOLD
|
Package: - |
Stock10,848 |
|
- |
299 |
DIP, 0.3" (7.62mm) Row Spacing |
12 (2 x 6) |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole, Right Angle, Horizontal |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin-Lead |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN SOCKET SIP 10POS GOLD
|
Package: - |
Stock6,300 |
|
- |
500 |
SIP |
10 (1 x 10) |
0.100" (2.54mm) |
Gold |
- |
Beryllium Copper |
Through Hole |
- |
Solder |
0.100" (2.54mm) |
Gold |
- |
Beryllium Copper |
Thermoplastic |
- |
||
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 20POS GOLD
|
Package: - |
Stock11,112 |
|
- |
110 |
DIP, 0.3" (7.62mm) Row Spacing |
20 (2 x 10) |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Open Frame, Decoupling Capacitor |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
||
Aries Electronics |
CONN IC DIP SOCKET 16POS GOLD
|
Package: - |
Stock16,512 |
|
- |
EJECT-A-DIP? |
DIP, 0.3" (7.62mm) Row Spacing |
16 (2 x 8) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
-55°C ~ 105°C |