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Sockets for ICs, Transistors

Records 11083
Page  358/370
Image
Part Number
Manufacturer
Description
Package
Stock
Quantity
Package
Series
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
Harwin Inc.
CONN IC DIP SOCKET 16POS GOLD
Package: -
Stock15,672
-
D2
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
196.8µin (5.00µm)
Brass
Plastic
-55°C ~ 125°C
CNC Tech
CONN IC DIP SOCKET 28POS GOLD
Package: -
Stock16,410
-
-
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polybutylene Terephthalate (PBT)
-40°C ~ 105°C
Mill-Max Manufacturing Corp.
CONN SOCKET PLCC 20POS TIN
Package: -
Stock18,426
-
940
PLCC
20 (4 x 5)
0.050" (1.27mm)
Tin
150µin (3.81µm)
Beryllium Copper
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
Preci-Dip
CONN IC DIP SOCKET 18POS GOLD
Package: -
Stock19,692
-
114
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
CNC Tech
CONN IC DIP SOCKET 20POS GOLD
Package: -
Stock14,742
-
-
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polybutylene Terephthalate (PBT)
-40°C ~ 105°C
Preci-Dip
CONN IC DIP SOCKET 14POS GOLD
Package: -
Stock13,998
-
115
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
CNC Tech
CONN IC DIP SOCKET 14POS GOLD
Package: -
Stock19,206
-
-
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polybutylene Terephthalate (PBT)
-40°C ~ 105°C
3M
CONN IC DIP SOCKET 24POS TIN
Package: -
Stock26,478
-
4800
DIP, 0.6" (15.24mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Polyester, Glass Filled
-25°C ~ 85°C
TE Connectivity AMP Connectors
24P,DIP SKT,300 CL,LDR,PB FREE
Package: -
Stock23,226
-
*
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Preci-Dip
CONN IC DIP SOCKET 12POS GOLD
Package: -
Stock16,284
-
114
DIP, 0.3" (7.62mm) Row Spacing
12 (2 x 6)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
CNC Tech
CONN IC DIP SOCKET 28POS TIN
Package: -
Stock13,794
-
-
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Through Hole, Kinked Pin
Open Frame
Solder
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
CNC Tech
CONN IC DIP SOCKET 18POS TIN
Package: -
Stock23,118
-
-
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Through Hole, Kinked Pin
Open Frame
Solder
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
CNC Tech
CONN IC DIP SOCKET 14POS TIN
Package: -
Stock34,410
-
-
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Through Hole, Kinked Pin
Open Frame
Solder
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
CNC Tech
CONN IC DIP SOCKET 18POS TIN
Package: -
Stock14,568
-
-
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
3M
CONN SOCKET PGA ZIF 625POS GOLD
Package: -
Stock7,506
-
Textool?
PGA, ZIF (ZIP)
625 (25 x 25)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polyethersulfone (PES)
-55°C ~ 150°C
3M
CONN SOCKET QFN 48POS GOLD
Package: -
Stock5,076
-
Textool?
QFN
48 (4 x 12)
0.020" (0.50mm)
Gold
-
Beryllium Copper
Through Hole
Closed Frame
Solder
-
Gold
-
Beryllium Copper
Polyethersulfone (PES)
-
3M
CONN SOCKET PGA ZIF 100POS GOLD
Package: -
Stock6,684
-
Textool?
PGA, ZIF (ZIP)
100 (10 x 10)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polyethersulfone (PES)
-55°C ~ 150°C
TE Connectivity AMP Connectors
RIGHT SIDE LGA3647-0 SOCKET-P0
Package: -
Stock8,748
-
-
LGA
1823
-
Gold
30µin (0.76µm)
Copper Alloy
Surface Mount
Open Frame
Solder
-
-
-
Copper Alloy
Liquid Crystal Polymer (LCP)
-
TE Connectivity AMP Connectors
SOCKET ASSY LGA2011-3
Package: -
Stock8,280
-
*
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
CONN TRANSIST TO-3 8POS GOLD
Package: -
Stock9,036
-
-
Transistor, TO-3
8 (Oval)
-
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
-
Tin
200µin (5.08µm)
Brass
Polyester, Glass Filled
-55°C ~ 150°C
TE Connectivity AMP Connectors
CONN TRANSIST TO-3 4POS GOLD
Package: -
Stock6,264
-
8080
Transistor, TO-3
4 (Round)
-
Gold
-
Beryllium Copper
Through Hole
Closed Frame
Solder
-
Gold
-
Beryllium Copper
Fluoropolymer (FP)
-55°C ~ 125°C
3M
CONN IC DIP SOCKET ZIF 24POS GLD
Package: -
Stock6,072
-
Textool?
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN IC DIP SOCKET ZIF 42POS GLD
Package: -
Stock8,004
-
Textool?
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
42 (2 x 21)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN IC DIP SOCKET ZIF 18POS GLD
Package: -
Stock7,488
-
Textool?
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN SOCKET CLCC 68POS GOLD
Package: -
Stock8,802
-
OEM
CLCC
68 (4 x 17)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
-55°C ~ 105°C
Aries Electronics
CONN IC DIP SOCKET ZIF 40POS GLD
Package: -
Stock6,972
-
55
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Gold
-
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
-
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
-
TE Connectivity AMP Connectors
CONN TRANSIST TO-5 3POS GOLD
Package: -
Stock6,648
-
8060
Transistor, TO-5
3 (Round)
-
Gold
-
Beryllium Copper
Through Hole
Closed Frame
Solder
-
Gold
-
Beryllium Copper
Polytetrafluoroethylene (PTFE)
-55°C ~ 125°C
Mill-Max Manufacturing Corp.
CONN SOCKET SIP 64POS GOLD
Package: -
Stock7,056
-
714
SIP
64 (1 x 64)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
3M
CONN IC DIP SOCKET ZIF 16POS GLD
Package: -
Stock6,312
-
OEM
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
250µin (6.35µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
250µin (6.35µm)
Beryllium Copper
Polyether Imide (PEI), Glass Filled
-55°C ~ 105°C
Aries Electronics
CONN SOCKET SIP 25POS GOLD
Package: -
Stock7,398
-
0503
SIP
25 (1 x 25)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
-
Wire Wrap
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA), Nylon, Glass Filled
-