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* Please refer to the English Version as our Official Version.
* Please refer to the English Version as our Official Version.
Image |
Part Number |
Manufacturer |
Description |
Package |
Stock |
Quantity |
Package |
Series |
Type |
Number of Positions or Pins (Grid) |
Pitch - Mating |
Contact Finish - Mating |
Contact Finish Thickness - Mating |
Contact Material - Mating |
Mounting Type |
Features |
Termination |
Pitch - Post |
Contact Finish - Post |
Contact Finish Thickness - Post |
Contact Material - Post |
Housing Material |
Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 40POS TINLEAD
|
Package: - |
Stock9,984 |
|
- |
214 |
DIP, 0.6" (15.24mm) Row Spacing |
40 (2 x 20) |
0.100" (2.54mm) |
Tin-Lead |
100µin (2.54µm) |
Beryllium Copper |
Surface Mount |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin-Lead |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
|
|
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 16POS GOLD
|
Package: - |
Stock17,622 |
|
- |
614 |
DIP, 0.3" (7.62mm) Row Spacing |
16 (2 x 8) |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
|
|
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 28POS GOLD
|
Package: - |
Stock15,864 |
|
- |
115 |
DIP, 0.3" (7.62mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
|
|
On Shore Technology Inc. |
CONN IC DIP SOCKET 20POS GOLD
|
Package: - |
Stock8,580 |
|
- |
BU-178HT |
DIP, 0.3" (7.62mm) Row Spacing |
20 (2 x 10) |
0.100" (2.54mm) |
Gold |
78.7µin (2.00µm) |
Beryllium Copper |
Surface Mount |
Open Frame |
Solder |
0.100" (2.54mm) |
Copper |
Flash |
Brass |
Polybutylene Terephthalate (PBT), Glass Filled |
-55°C ~ 125°C |
|
|
|
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 22POS GOLD
|
Package: - |
Stock14,658 |
|
- |
115 |
DIP, 0.4" (10.16mm) Row Spacing |
22 (2 x 11) |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
|
|
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 28POS GOLD
|
Package: - |
Stock7,104 |
|
- |
110 |
DIP, 0.3" (7.62mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
|
|
Mill-Max Manufacturing Corp. |
CONN SOCKET PLCC 28POS TIN
|
Package: - |
Stock16,884 |
|
- |
540 |
PLCC |
28 (4 x 7) |
0.050" (1.27mm) |
Tin |
150µin (3.81µm) |
- |
Surface Mount |
Closed Frame |
Solder |
0.050" (1.27mm) |
Tin |
150µin (3.81µm) |
- |
Polyphenylene Sulfide (PPS) |
- |
|
|
|
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 28POS GOLD
|
Package: - |
Stock8,244 |
|
- |
115 |
DIP, 0.3" (7.62mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin-Lead |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
|
|
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 28POS GOLD
|
Package: - |
Stock13,140 |
|
- |
115 |
DIP, 0.6" (15.24mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin-Lead |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
|
|
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 24POS GOLD
|
Package: - |
Stock9,012 |
|
- |
111 |
DIP, 0.6" (15.24mm) Row Spacing |
24 (2 x 12) |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
|
|
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 28POS GOLD
|
Package: - |
Stock17,940 |
|
- |
800 |
DIP, 0.6" (15.24mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Gold |
20µin (0.51µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Gold |
20µin (0.51µm) |
Copper |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 105°C |
|
|
|
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 28POS TIN
|
Package: - |
Stock12,432 |
|
- |
214 |
DIP, 0.6" (15.24mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Tin |
100µin (2.54µm) |
Beryllium Copper |
Surface Mount |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
|
|
Assmann WSW Components |
CONN IC DIP SOCKET 16POS GOLD
|
Package: - |
Stock7,344 |
|
- |
- |
DIP, 0.3" (7.62mm) Row Spacing |
16 (2 x 8) |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Thermoplastic, Polyester |
-40°C ~ 105°C |
|
|
|
Preci-Dip |
CONN IC DIP SOCKET 32POS GOLD
|
Package: - |
Stock6,732 |
|
- |
110 |
DIP, 0.6" (15.24mm) Row Spacing |
32 (2 x 16) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Surface Mount |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
|
|
Assmann WSW Components |
CONN IC DIP SOCKET 28POS GOLD
|
Package: - |
Stock9,324 |
|
- |
- |
DIP, 0.6" (15.24mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Thermoplastic, Polyester |
-40°C ~ 105°C |
|
|
|
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 20POS TIN
|
Package: - |
Stock28,152 |
|
- |
214 |
DIP, 0.3" (7.62mm) Row Spacing |
20 (2 x 10) |
0.100" (2.54mm) |
Tin |
100µin (2.54µm) |
Beryllium Copper |
Surface Mount |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
|
|
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 8POS GOLD
|
Package: - |
Stock15,678 |
|
- |
614 |
DIP, 0.3" (7.62mm) Row Spacing |
8 (2 x 4) |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
|
|
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 20POS TINLEAD
|
Package: - |
Stock20,436 |
|
- |
214 |
DIP, 0.3" (7.62mm) Row Spacing |
20 (2 x 10) |
0.100" (2.54mm) |
Tin-Lead |
100µin (2.54µm) |
Beryllium Copper |
Surface Mount |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin-Lead |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
|
|
3M |
CONN SOCKET PLCC 84POS TIN
|
Package: - |
Stock23,772 |
|
- |
8400 |
PLCC |
84 (4 x 21) |
0.050" (1.27mm) |
Tin |
160µin (4.06µm) |
Copper Alloy |
Surface Mount |
Closed Frame |
Solder |
0.050" (1.27mm) |
Tin |
160µin (4.06µm) |
Copper Alloy |
Polybutylene Terephthalate (PBT), Glass Filled |
-40°C ~ 105°C |
|
|
|
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 18POS GOLD
|
Package: - |
Stock26,046 |
|
- |
115 |
DIP, 0.3" (7.62mm) Row Spacing |
18 (2 x 9) |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin-Lead |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET 10POS GOLD
|
Package: - |
Stock17,850 |
|
- |
Lo-PRO?file, 513 |
DIP, 0.2" (5.08mm) Row Spacing |
10 (2 x 5) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
|
|
|
Mill-Max Manufacturing Corp. |
CONN TRANSIST TO-5 4POS GOLD
|
Package: - |
Stock18,636 |
|
- |
917 |
Transistor, TO-5 |
4 (Round) |
- |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Surface Mount |
Closed Frame |
Solder |
- |
Tin |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
|
|
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 14POS GOLD
|
Package: - |
Stock12,324 |
|
- |
110 |
DIP, 0.3" (7.62mm) Row Spacing |
14 (2 x 7), 4 Loaded |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
|
|
Preci-Dip |
CONN IC DIP SOCKET 32POS GOLD
|
Package: - |
Stock18,762 |
|
- |
117 |
DIP, 0.4" (10.16mm) Row Spacing |
32 (2 x 16) |
0.070" (1.78mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.070" (1.78mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
|
|
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 20POS GOLD
|
Package: - |
Stock18,588 |
|
- |
110 |
DIP, 0.3" (7.62mm) Row Spacing |
20 (2 x 10) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
|
|
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 14POS TINLEAD
|
Package: - |
Stock28,146 |
|
- |
214 |
DIP, 0.3" (7.62mm) Row Spacing |
14 (2 x 7) |
0.100" (2.54mm) |
Tin-Lead |
100µin (2.54µm) |
Beryllium Copper |
Surface Mount |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin-Lead |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
|
|
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 16POS TINLEAD
|
Package: - |
Stock20,694 |
|
- |
214 |
DIP, 0.3" (7.62mm) Row Spacing |
16 (2 x 8) |
0.100" (2.54mm) |
Tin-Lead |
100µin (2.54µm) |
Beryllium Copper |
Surface Mount |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin-Lead |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
|
|
Mill-Max Manufacturing Corp. |
CONN SOCKET PLCC 20POS TIN
|
Package: - |
Stock13,350 |
|
- |
940 |
PLCC |
20 (4 x 5) |
0.100" (2.54mm) |
Tin |
150µin (3.81µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
|
|
3M |
CONN SOCKET PLCC 32POS TIN
|
Package: - |
Stock13,734 |
|
- |
8400 |
PLCC |
32 (2 x 7, 2 x 9) |
0.050" (1.27mm) |
Tin |
160µin (4.06µm) |
Copper Alloy |
Surface Mount |
Closed Frame |
Solder |
0.050" (1.27mm) |
Tin |
160µin (4.06µm) |
Copper Alloy |
Polybutylene Terephthalate (PBT), Glass Filled |
-40°C ~ 105°C |
|
|
|
Preci-Dip |
CONN IC DIP SOCKET 28POS GOLD
|
Package: - |
Stock14,514 |
|
- |
110 |
DIP, 0.6" (15.24mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
Open Frame, No Center Bar |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
