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Sockets for ICs, Transistors

Records 11083
Page  367/370
Image
Part Number
Manufacturer
Description
Package
Stock
Quantity
Package
Series
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
3M
CONN SOCKET QFN 32POS GOLD
Package: -
Stock8,892
-
Textool?
QFN
32 (4 x 8)
-
Gold
-
Beryllium Copper
Through Hole
Closed Frame
Solder
-
Gold
-
Beryllium Copper
Polyethersulfone (PES)
-
Aries Electronics
CONN SOCKET PGA ZIF GOLD
Package: -
Stock7,284
-
PRS
PGA, ZIF (ZIP)
-
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Polyphenylene Sulfide (PPS)
-65°C ~ 125°C
Aries Electronics
CONN SOCKET PGA ZIF GOLD
Package: -
Stock7,488
-
PRS
PGA, ZIF (ZIP)
-
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Polyphenylene Sulfide (PPS)
-65°C ~ 125°C
Apex Microtechnology
CONN IC DIP SOCKET 12POS GOLD
Package: -
Stock6,858
-
Apex Precision Power?
DIP, 1.2" (30.48mm) Row Spacing
12 (2 x 6)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyester, Glass Filled
-
3M
CONN SOCKET PGA ZIF 121POS GOLD
Package: -
Stock9,084
-
Textool?
PGA, ZIF (ZIP)
121 (11 x 11)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polyethersulfone (PES)
-55°C ~ 150°C
3M
CONN SOCKET PGA ZIF 169POS GOLD
Package: -
Stock6,288
-
Textool?
PGA, ZIF (ZIP)
169 (13 x 13)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polyethersulfone (PES)
-55°C ~ 150°C
TE Connectivity AMP Connectors
CONN SOCKET PQFP 132POS TIN-LEAD
Package: -
Stock17,916
-
-
QFP
132 (4 x 33)
0.050" (1.27mm)
Tin-Lead
200µin (5.08µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Tin-Lead
200µin (5.08µm)
Phosphor Bronze
Liquid Crystal Polymer (LCP)
-
3M
CONN SOCKET SIP ZIF 20POS GOLD
Package: -
Stock7,932
-
Textool?
SIP, ZIF (ZIP)
20 (1 x 20)
0.100" (2.54mm)
Gold
-
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN SOCKET SOIC 28POS GOLD
Package: -
Stock6,360
-
Textool?
SOIC
28 (2 x 14)
-
Gold
-
Beryllium Copper
Through Hole
Closed Frame
Solder
-
Gold
30µin (0.76µm)
Beryllium Copper
Polyethersulfone (PES), Glass Filled
-55°C ~ 150°C
3M
CONN TRANSIST TO-3/TO-66 3POS
Package: -
Stock6,156
-
Textool?
Transistor, TO-3 and TO-66
3 (Rectangular)
-
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.234" (5.94mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
-55°C ~ 150°C
3M
CONN IC DIP SOCKET ZIF 40POS GLD
Package: -
Stock6,324
-
Textool?
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN IC DIP SOCKET ZIF 32POS GLD
Package: -
Stock7,884
-
Textool?
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
Apex Microtechnology
CONN TRANSIST TO-3 8POS GOLD
Package: -
Stock14,466
-
Apex Precision Power?
Transistor, TO-3
8 (Oval)
-
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
-
Tin
200µin (5.08µm)
Brass
Polyester, Glass Filled
-
3M
CONN SOCKET SOIC 16POS GOLD
Package: -
Stock6,012
-
Textool?
SOIC
16 (2 x 8)
-
Gold
-
Beryllium Copper
Through Hole
Closed Frame
Solder
-
Gold
30µin (0.76µm)
Beryllium Copper
Polyethersulfone (PES), Glass Filled
-55°C ~ 150°C
3M
CONN SOCKET SOIC 16POS GOLD
Package: -
Stock7,896
-
Textool?
SOIC
16 (2 x 8)
-
Gold
-
Beryllium Copper
Through Hole
Closed Frame
Solder
-
Gold
30µin (0.76µm)
Beryllium Copper
Polyethersulfone (PES), Glass Filled
-55°C ~ 150°C
3M
CONN IC DIP SOCKET ZIF 48POS GLD
Package: -
Stock13,524
-
Textool?
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
48 (2 x 24)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN SOCKET SOIC 14POS GOLD
Package: -
Stock7,404
-
Textool?
SOIC
14 (2 x 7)
-
Gold
-
Beryllium Copper
Through Hole
Closed Frame
Solder
-
Gold
30µin (0.76µm)
Beryllium Copper
Polyethersulfone (PES), Glass Filled
-55°C ~ 150°C
3M
CONN SOCKET SOIC 8POS GOLD
Package: -
Stock22,776
-
Textool?
SOIC
8 (2 x 4)
-
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
-
Gold
30µin (0.76µm)
Beryllium Copper
Polyethersulfone (PES), Glass Filled
-55°C ~ 150°C
3M
CONN IC DIP SOCKET ZIF 40POS GLD
Package: -
Stock7,584
-
Textool?
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
Aries Electronics
CONN IC DIP SOCKET ZIF 48POS GLD
Package: -
Stock15,528
-
55
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
48 (2 x 24)
0.100" (2.54mm)
Gold
-
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
-
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
-
3M
CONN IC DIP SOCKET ZIF 28POS GLD
Package: -
Stock8,406
-
Textool?
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN IC DIP SOCKET ZIF 16POS GLD
Package: -
Stock7,236
-
Textool?
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN IC DIP SOCKET ZIF 24POS GLD
Package: -
Stock7,224
-
Textool?
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN IC DIP SOCKET ZIF 20POS GLD
Package: -
Stock9,444
-
Textool?
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN IC DIP SOCKET ZIF 14POS GLD
Package: -
Stock23,460
-
Textool?
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
Aries Electronics
CONN IC DIP SOCKET ZIF 28POS GLD
Package: -
Stock25,212
-
55
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
-
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
-
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
-
Aries Electronics
CONN IC DIP SOCKET ZIF 40POS TIN
Package: -
Stock18,312
-
55
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
-
Aries Electronics
CONN IC DIP SOCKET ZIF 48POS TIN
Package: -
Stock21,324
-
55
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
48 (2 x 24)
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
-
Aries Electronics
CONN IC DIP SOCKET 10POS GOLD
Package: -
Stock16,848
-
Vertisockets? 800
DIP, 0.3" (7.62mm) Row Spacing
10 (2 x 5)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole, Right Angle, Vertical
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
Aries Electronics
CONN IC DIP SOCKET 10POS GOLD
Package: -
Stock13,494
-
Vertisockets? 800
DIP, 0.2" (5.08mm) Row Spacing
10 (2 x 5)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole, Right Angle, Vertical
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-