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Sockets for ICs, Transistors

Records 11083
Page  365/370
Image
Part Number
Manufacturer
Description
Package
Stock
Quantity
Package
Series
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
3M
CONN IC DIP SOCKET 18POS TIN
Package: -
Stock31,470
-
4800
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Polyester, Glass Filled
-25°C ~ 85°C
Amphenol FCI
CONN IC DIP SOCKET 40POS TIN
Package: -
Stock41,388
-
-
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Tin
100µin (2.54µm)
Copper Alloy
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
100µin (2.54µm)
Copper Alloy
Polyamide (PA), Nylon
-55°C ~ 105°C
Preci-Dip
CONN IC DIP SOCKET 8POS GOLD
Package: -
Stock13,116
-
114
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
Preci-Dip
CONN IC DIP SOCKET 8POS GOLD
Package: -
Stock14,328
-
114
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
Assmann WSW Components
CONN IC DIP SOCKET 22POS TIN
Package: -
Stock29,460
-
-
DIP, 0.4" (10.16mm) Row Spacing
22 (2 x 11)
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT)
-55°C ~ 85°C
On Shore Technology Inc.
CONN IC DIP SOCKET 10POS GOLD
Package: -
Stock56,556
-
SA
DIP, 0.3" (7.62mm) Row Spacing
10 (2 x 5)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Thermoplastic, Polyester, Glass Filled
-40°C ~ 105°C
Assmann WSW Components
CONN IC DIP SOCKET 40POS TIN
Package: -
Stock101,964
-
-
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Polybutylene Terephthalate (PBT)
-55°C ~ 85°C
3M
CONN IC DIP SOCKET 14POS TIN
Package: -
Stock69,852
-
4800
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Polyester, Glass Filled
-25°C ~ 85°C
3M
CONN IC DIP SOCKET 8POS TIN
Package: -
Stock138,318
-
4800
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Polyester, Glass Filled
-25°C ~ 85°C
Assmann WSW Components
CONN IC DIP SOCKET 28POS TIN
Package: -
Stock15,666
-
-
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Polybutylene Terephthalate (PBT)
-55°C ~ 85°C
Assmann WSW Components
CONN IC DIP SOCKET 24POS TIN
Package: -
Stock15,348
-
-
DIP, 0.3" (7.62mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT)
-55°C ~ 85°C
Assmann WSW Components
CONN IC DIP SOCKET 20POS TIN
Package: -
Stock22,446
-
-
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Polybutylene Terephthalate (PBT)
-55°C ~ 85°C
On Shore Technology Inc.
CONN IC DIP SOCKET 8POS GOLD
Package: -
Stock38,844
-
SA
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Thermoplastic, Polyester, Glass Filled
-40°C ~ 105°C
On Shore Technology Inc.
CONN IC DIP SOCKET 8POS GOLD
Package: -
Stock36,120
-
SA
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
80µin (2.03µm)
Brass
Thermoplastic, Polyester, Glass Filled
-40°C ~ 105°C
On Shore Technology Inc.
CONN IC DIP SOCKET 40POS TIN
Package: -
Stock50,580
-
ED
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 110°C
Amphenol FCI
CONN IC DIP SOCKET 28POS TIN
Package: -
Stock96,786
-
-
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Tin
100µin (2.54µm)
Copper Alloy
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
100µin (2.54µm)
Copper Alloy
Polyamide (PA), Nylon
-55°C ~ 105°C
CNC Tech
CONN IC DIP SOCKET 8POS GOLD
Package: -
Stock61,128
-
-
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polybutylene Terephthalate (PBT)
-40°C ~ 105°C
TE Connectivity AMP Connectors
20P,DIP SKT,300 CL,LDR,PB FREE
Package: -
Stock46,494
-
*
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Assmann WSW Components
CONN IC DIP SOCKET 6POS TIN
Package: -
Stock100,482
-
-
DIP, 0.3" (7.62mm) Row Spacing
6 (2 x 3)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Thermoplastic, Polyester
-40°C ~ 105°C
Assmann WSW Components
CONN IC DIP SOCKET 28POS TIN
Package: -
Stock234,372
-
-
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Polybutylene Terephthalate (PBT)
-55°C ~ 85°C
Preci-Dip
CONN IC DIP SOCKET 6POS GOLD
Package: -
Stock19,668
-
110
DIP, 0.3" (7.62mm) Row Spacing
6 (2 x 3)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
CNC Tech
CONN IC DIP SOCKET 28POS TIN
Package: -
Stock26,586
-
-
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Tin
100µin (2.54µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
100µin (2.54µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
On Shore Technology Inc.
CONN IC DIP SOCKET 32POS TIN
Package: -
Stock25,590
-
ED
DIP, 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 110°C
CNC Tech
CONN IC DIP SOCKET 6POS GOLD
Package: -
Stock76,704
-
-
DIP, 0.3" (7.62mm) Row Spacing
6 (2 x 3)
0.100" (2.54mm)
Gold
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polybutylene Terephthalate (PBT)
-40°C ~ 105°C
Assmann WSW Components
CONN IC DIP SOCKET 24POS TIN
Package: -
Stock32,694
-
-
DIP, 0.6" (15.24mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Polybutylene Terephthalate (PBT)
-55°C ~ 85°C
Amphenol FCI
CONN IC DIP SOCKET 20POS TIN
Package: -
Stock56,160
-
-
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Tin
100µin (2.54µm)
Copper Alloy
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
100µin (2.54µm)
Copper Alloy
Polyamide (PA), Nylon
-55°C ~ 105°C
Assmann WSW Components
CONN IC DIP SOCKET 18POS TIN
Package: -
Stock14,232
-
-
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Polybutylene Terephthalate (PBT)
-55°C ~ 85°C
On Shore Technology Inc.
CONN IC DIP SOCKET 28POS TIN
Package: -
Stock61,122
-
ED
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 110°C
CNC Tech
CONN IC DIP SOCKET 16POS TIN
Package: -
Stock55,278
-
-
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Through Hole, Kinked Pin
Open Frame
Solder
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
CNC Tech
CONN IC DIP SOCKET 20POS TIN
Package: -
Stock16,404
-
-
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C