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Sockets for ICs, Transistors

Records 11083
Page  366/370
Image
Part Number
Manufacturer
Description
Package
Stock
Quantity
Package
Series
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
CNC Tech
CONN IC DIP SOCKET 6POS TIN
Package: -
Stock55,980
-
-
DIP, 0.3" (7.62mm) Row Spacing
6 (2 x 3)
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
Assmann WSW Components
CONN IC DIP SOCKET 16POS TIN
Package: -
Stock250,812
-
-
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Polybutylene Terephthalate (PBT)
-55°C ~ 85°C
On Shore Technology Inc.
CONN IC DIP SOCKET 24POS TIN
Package: -
Stock30,252
-
ED
DIP, 0.3" (7.62mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 110°C
TE Connectivity AMP Connectors
18P,DIP SKT,300 CL,LDR,PB FREE
Package: -
Stock48,552
-
*
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Assmann WSW Components
CONN IC DIP SOCKET 14POS TIN
Package: -
Stock56,292
-
-
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Polybutylene Terephthalate (PBT)
-55°C ~ 85°C
On Shore Technology Inc.
CONN IC DIP SOCKET 24POS TIN
Package: -
Stock82,668
-
ED
DIP, 0.6" (15.24mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 110°C
Amphenol FCI
CONN IC DIP SOCKET 16POS TIN
Package: -
Stock116,790
-
-
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Tin
100µin (2.54µm)
Copper Alloy
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
100µin (2.54µm)
Copper Alloy
Polyamide (PA), Nylon
-55°C ~ 105°C
Preci-Dip
CONN IC DIP SOCKET 4POS GOLD
Package: -
Stock27,354
-
110
DIP, 0.3" (7.62mm) Row Spacing
4 (2 x 2)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
On Shore Technology Inc.
CONN IC DIP SOCKET 20POS TIN
Package: -
Stock35,112
-
ED
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 110°C
Amphenol FCI
CONN IC DIP SOCKET 14POS TIN
Package: -
Stock104,868
-
-
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Tin
100µin (2.54µm)
Copper Alloy
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
100µin (2.54µm)
Copper Alloy
Polyamide (PA), Nylon
-55°C ~ 105°C
Assmann WSW Components
CONN IC DIP SOCKET 6POS TIN
Package: -
Stock91,698
-
-
DIP, 0.3" (7.62mm) Row Spacing
6 (2 x 3)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Polybutylene Terephthalate (PBT)
-55°C ~ 85°C
On Shore Technology Inc.
CONN IC DIP SOCKET 6POS TIN
Package: -
Stock53,088
-
ED
DIP, 0.3" (7.62mm) Row Spacing
6 (2 x 3)
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 110°C
CNC Tech
CONN IC DIP SOCKET 16POS TIN
Package: -
Stock59,196
-
-
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
TE Connectivity AMP Connectors
16P,DIP SKT,300 CL,LDR,PB FREE
Package: -
Stock100,842
-
*
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
CNC Tech
CONN IC DIP SOCKET 8POS TIN
Package: -
Stock87,618
-
-
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Through Hole, Kinked Pin
Open Frame
Solder
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
On Shore Technology Inc.
CONN IC DIP SOCKET 18POS TIN
Package: -
Stock59,880
-
ED
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 110°C
TE Connectivity AMP Connectors
14P,DIP SKT,300 CL,LDR,PB FREE
Package: -
Stock123,318
-
*
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
TE Connectivity AMP Connectors
6P,DIP SKT,300 CL,LDR,PB FREE
Package: -
Stock102,798
-
*
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
CNC Tech
CONN IC DIP SOCKET 8POS TIN
Package: -
Stock179,952
-
-
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
Assmann WSW Components
CONN IC DIP SOCKET 8POS TIN
Package: -
Stock317,388
-
-
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Polybutylene Terephthalate (PBT)
-55°C ~ 85°C
On Shore Technology Inc.
CONN IC DIP SOCKET 16POS TIN
Package: -
Stock108,702
-
ED
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 110°C
Amphenol FCI
CONN IC DIP SOCKET 8POS TIN
Package: -
Stock233,664
-
-
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Tin
100µin (2.54µm)
Copper Alloy
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
100µin (2.54µm)
Copper Alloy
Polyamide (PA), Nylon
-55°C ~ 105°C
On Shore Technology Inc.
CONN IC DIP SOCKET 14POS TIN
Package: -
Stock92,538
-
ED
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 110°C
TE Connectivity AMP Connectors
8P,DIP SKT,300 CL,LDR,PB FREE
Package: -
Stock66,054
-
*
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
On Shore Technology Inc.
CONN IC DIP SOCKET 8POS TIN
Package: -
Stock260,748
-
ED
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 110°C
Aries Electronics
CONN SOCKET PLCC ZIF 84POS GOLD
Package: -
Stock6,264
-
537
PLCC, ZIF (ZIP)
84 (4 x 21)
0.100" (2.54mm)
Gold
12µin (0.30µm)
-
Surface Mount
Closed Frame
-
-
-
-
-
-
-
3M
CONN SOCKET QFN 88POS GOLD
Package: -
Stock6,156
-
Textool?
QFN
88 (4 x 22)
0.016" (0.40mm)
Gold
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.016" (0.40mm)
Gold
-
Beryllium Copper
Polyethersulfone (PES)
-
3M
CONN SOCKET QFN 48POS GOLD
Package: -
Stock6,156
-
Textool?
QFN
48 (4 x 12)
0.016" (0.40mm)
Gold
-
Beryllium Copper
Through Hole
Closed Frame
Solder
-
Gold
-
Beryllium Copper
Polyethersulfone (PES)
-
3M
CONN SOCKET PGA ZIF 441POS GOLD
Package: -
Stock8,226
-
Textool?
PGA, ZIF (ZIP)
441 (21 x 21)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polyethersulfone (PES)
-55°C ~ 150°C
Aries Electronics
CONN SOCKET PGA ZIF GOLD
Package: -
Stock6,324
-
PRS
PGA, ZIF (ZIP)
-
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Polyphenylene Sulfide (PPS)
-65°C ~ 125°C