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* Please refer to the English Version as our Official Version.
* Please refer to the English Version as our Official Version.
Image |
Part Number |
Manufacturer |
Description |
Package |
Stock |
Quantity |
Package |
Series |
Type |
Number of Positions or Pins (Grid) |
Pitch - Mating |
Contact Finish - Mating |
Contact Finish Thickness - Mating |
Contact Material - Mating |
Mounting Type |
Features |
Termination |
Pitch - Post |
Contact Finish - Post |
Contact Finish Thickness - Post |
Contact Material - Post |
Housing Material |
Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock6,300 |
|
- |
PRS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 125°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock6,732 |
|
- |
PRS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 125°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock6,678 |
|
- |
PRS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 125°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock3,888 |
|
- |
PLS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 125°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock2,664 |
|
- |
PRS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 125°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock2,448 |
|
- |
PRS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Nickel Bronze |
50µin (1.27µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 200°C |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET ZIF 42POS
|
Package: - |
Stock5,454 |
|
- |
55 |
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
42 (2 x 21) |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Polyetheretherketone (PEEK), Glass Filled |
-55°C ~ 250°C |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET ZIF 42POS
|
Package: - |
Stock7,452 |
|
- |
55 |
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
42 (2 x 21) |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Polyetheretherketone (PEEK), Glass Filled |
-55°C ~ 250°C |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET ZIF 42POS
|
Package: - |
Stock4,194 |
|
- |
55 |
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
42 (2 x 21) |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Polyetheretherketone (PEEK), Glass Filled |
-55°C ~ 250°C |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET ZIF 42POS
|
Package: - |
Stock4,464 |
|
- |
55 |
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing |
42 (2 x 21) |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Polyetheretherketone (PEEK), Glass Filled |
-55°C ~ 250°C |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET ZIF 42POS
|
Package: - |
Stock8,676 |
|
- |
55 |
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing |
42 (2 x 21) |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Polyetheretherketone (PEEK), Glass Filled |
-55°C ~ 250°C |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET ZIF 42POS
|
Package: - |
Stock2,520 |
|
- |
55 |
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing |
42 (2 x 21) |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Polyetheretherketone (PEEK), Glass Filled |
-55°C ~ 250°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock3,492 |
|
- |
PRS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 125°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock4,032 |
|
- |
PLS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 125°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock4,734 |
|
- |
PRS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 125°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock2,376 |
|
- |
PRS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 125°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock4,968 |
|
- |
PRS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 125°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock3,472 |
|
- |
PRS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Nickel Bronze |
50µin (1.27µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 200°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock7,398 |
|
- |
PRS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 125°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock8,064 |
|
- |
PLS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 125°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock2,790 |
|
- |
PRS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 125°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock8,298 |
|
- |
PLS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 125°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock5,976 |
|
- |
PRS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Nickel Bronze |
50µin (1.27µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 200°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock8,550 |
|
- |
PRS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 125°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock7,866 |
|
- |
PLS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 125°C |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET ZIF 28POS TIN
|
Package: - |
Stock5,886 |
|
- |
57 |
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS), Glass Filled |
- |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET ZIF 28POS GLD
|
Package: - |
Stock8,964 |
|
- |
57 |
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS), Glass Filled |
- |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET ZIF 42POS TIN
|
Package: - |
Stock3,168 |
|
- |
55 |
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
42 (2 x 21) |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS), Glass Filled |
- |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET ZIF 40POS
|
Package: - |
Stock2,700 |
|
- |
55 |
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
40 (2 x 20) |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Polyetheretherketone (PEEK), Glass Filled |
-55°C ~ 250°C |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET ZIF 40POS
|
Package: - |
Stock3,508 |
|
- |
55 |
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
40 (2 x 20) |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Polyetheretherketone (PEEK), Glass Filled |
-55°C ~ 250°C |
