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Sockets for ICs, Transistors

Records 4240
Page  141/142
Image
Part Number
Manufacturer
Description
Package
Stock
Quantity
Package
Series
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
Aries Electronics
CONN IC DIP SOCKET 10POS GOLD
Package: -
Stock17,850
-
Lo-PRO?file, 513
DIP, 0.2" (5.08mm) Row Spacing
10 (2 x 5)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
Aries Electronics
CONN IC DIP SOCKET ZIF 40POS GLD
Package: -
Stock6,972
-
55
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Gold
-
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
-
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
-
Aries Electronics
CONN SOCKET SIP 25POS GOLD
Package: -
Stock7,398
-
0503
SIP
25 (1 x 25)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
-
Wire Wrap
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA), Nylon, Glass Filled
-
Aries Electronics
CONN IC DIP SOCKET ZIF 28POS TIN
Package: -
Stock6,588
-
55
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
-
Aries Electronics
CONN IC DIP SOCKET ZIF 40POS TIN
Package: -
Stock9,540
-
Lo-PRO?file, 526
DIP, ZIF (ZIP)
40 (2 x 20)
0.100" (2.54mm)
Tin
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
10µin (0.25µm)
Beryllium Copper
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
Aries Electronics
CONN IC DIP SOCKET ZIF 28POS TIN
Package: -
Stock19,062
-
Lo-PRO?file, 526
DIP, ZIF (ZIP)
28 (2 x 14)
0.100" (2.54mm)
Tin
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
10µin (0.25µm)
Beryllium Copper
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
Aries Electronics
CONN IC DIP SOCKET 12POS GOLD
Package: -
Stock7,848
-
Vertisockets? 800
DIP, 0.3" (7.62mm) Row Spacing
12 (2 x 6)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole, Right Angle, Vertical
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
Aries Electronics
CONN IC DIP SOCKET 14POS GOLD
Package: -
Stock9,156
-
Vertisockets? 800
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Phosphor Bronze
Through Hole, Right Angle, Horizontal
Closed Frame
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6
-
Aries Electronics
CONN IC DIP SOCKET 14POS GOLD
Package: -
Stock6,480
-
Vertisockets? 800
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Phosphor Bronze
Through Hole, Right Angle, Vertical
Closed Frame
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6
-
Aries Electronics
CONN IC DIP SOCKET 14POS TIN
Package: -
Stock14,190
-
Vertisockets? 800
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Tin
50µin (1.27µm)
Phosphor Bronze
Through Hole, Right Angle, Vertical
Closed Frame
Solder
0.100" (2.54mm)
Tin
50µin (1.27µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6
-
Aries Electronics
CONN IC DIP SOCKET 40POS GOLD
Package: -
Stock6,444
-
EJECT-A-DIP?
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
Aries Electronics
CONN IC DIP SOCKET 10POS TIN
Package: -
Stock41,598
-
Vertisockets? 800
DIP, 0.2" (5.08mm) Row Spacing
10 (2 x 5)
0.100" (2.54mm)
Tin
200µin (5.08µm)
Phosphor Bronze
Through Hole, Right Angle, Vertical
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6
-
Aries Electronics
CONN IC DIP SOCKET 28POS GOLD
Package: -
Stock21,612
-
EJECT-A-DIP?
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
Aries Electronics
CONN SOCKET SIP 40POS GOLD
Package: -
Stock9,552
-
518
SIP
40 (1 x 40)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
Aries Electronics
CONN IC DIP SOCKET 16POS GOLD
Package: -
Stock16,512
-
EJECT-A-DIP?
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
Aries Electronics
CONN SOCKET SIP 12POS TIN
Package: -
Stock21,336
-
511
SIP
12 (1 x 12)
0.100" (2.54mm)
Tin
50µin (1.27µm)
Phosphor Bronze
Through Hole
-
Solder
0.100" (2.54mm)
Tin
50µin (1.27µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
Aries Electronics
CONN IC DIP SOCKET 28POS GOLD
Package: -
Stock22,260
-
518
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
Aries Electronics
CONN IC DIP SOCKET 18POS GOLD
Package: -
Stock15,558
-
518
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
Aries Electronics
CONN IC DIP SOCKET 8POS GOLD
Package: -
Stock18,078
-
Lo-PRO?file, 513
DIP, 0.2" (5.08mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
Aries Electronics
CONN IC DIP SOCKET 8POS GOLD
Package: -
Stock21,852
-
518
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
Aries Electronics
CONN IC DIP SOCKET 8POS GOLD
Package: -
Stock51,786
-
518
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
Aries Electronics
CONN SOCKET PLCC ZIF 84POS GOLD
Package: -
Stock6,264
-
537
PLCC, ZIF (ZIP)
84 (4 x 21)
0.100" (2.54mm)
Gold
12µin (0.30µm)
-
Surface Mount
Closed Frame
-
-
-
-
-
-
-
Aries Electronics
CONN SOCKET PGA ZIF GOLD
Package: -
Stock6,324
-
PRS
PGA, ZIF (ZIP)
-
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Polyphenylene Sulfide (PPS)
-65°C ~ 125°C
Aries Electronics
CONN SOCKET PGA ZIF GOLD
Package: -
Stock7,284
-
PRS
PGA, ZIF (ZIP)
-
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Polyphenylene Sulfide (PPS)
-65°C ~ 125°C
Aries Electronics
CONN SOCKET PGA ZIF GOLD
Package: -
Stock7,488
-
PRS
PGA, ZIF (ZIP)
-
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Polyphenylene Sulfide (PPS)
-65°C ~ 125°C
Aries Electronics
CONN IC DIP SOCKET ZIF 48POS GLD
Package: -
Stock15,528
-
55
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
48 (2 x 24)
0.100" (2.54mm)
Gold
-
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
-
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
-
Aries Electronics
CONN IC DIP SOCKET ZIF 28POS GLD
Package: -
Stock25,212
-
55
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
-
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
-
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
-
Aries Electronics
CONN IC DIP SOCKET ZIF 40POS TIN
Package: -
Stock18,312
-
55
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
-
Aries Electronics
CONN IC DIP SOCKET ZIF 48POS TIN
Package: -
Stock21,324
-
55
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
48 (2 x 24)
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
-
Aries Electronics
CONN IC DIP SOCKET 10POS GOLD
Package: -
Stock16,848
-
Vertisockets? 800
DIP, 0.3" (7.62mm) Row Spacing
10 (2 x 5)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole, Right Angle, Vertical
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-