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* Please refer to the English Version as our Official Version.
* Please refer to the English Version as our Official Version.
Image |
Part Number |
Manufacturer |
Description |
Package |
Stock |
Quantity |
Package |
Series |
Type |
Number of Positions or Pins (Grid) |
Pitch - Mating |
Contact Finish - Mating |
Contact Finish Thickness - Mating |
Contact Material - Mating |
Mounting Type |
Features |
Termination |
Pitch - Post |
Contact Finish - Post |
Contact Finish Thickness - Post |
Contact Material - Post |
Housing Material |
Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Aries Electronics |
CONN SOCKET SIP 4POS GOLD
|
Package: - |
Stock5,868 |
|
- |
518 |
SIP |
4 (1 x 4) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
|
|
|
Aries Electronics |
CONN SOCKET SIP 2POS GOLD
|
Package: - |
Stock7,668 |
|
- |
0513 |
SIP |
2 (1 x 2) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
- |
Solder |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
|
|
|
Aries Electronics |
CONN SOCKET SIP 1POS GOLD
|
Package: - |
Stock5,184 |
|
- |
508 |
SIP |
1 (1 x 1) |
- |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
- |
Wire Wrap |
- |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6 |
-55°C ~ 105°C |
|
|
|
Aries Electronics |
CONN SOCKET SIP 1POS GOLD
|
Package: - |
Stock4,446 |
|
- |
508 |
SIP |
1 (1 x 1) |
- |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
- |
Wire Wrap |
- |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6 |
-55°C ~ 105°C |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET 4POS GOLD
|
Package: - |
Stock8,910 |
|
- |
518 |
DIP, 0.2" (5.08mm) Row Spacing |
4 (2 x 2) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
|
|
|
Aries Electronics |
CONN SOCKET SIP 4POS GOLD
|
Package: - |
Stock5,418 |
|
- |
518 |
SIP |
4 (1 x 4) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
|
|
|
Aries Electronics |
CONN SOCKET SIP 3POS GOLD
|
Package: - |
Stock7,992 |
|
- |
518 |
SIP |
3 (1 x 3) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
|
|
|
Aries Electronics |
CONN SOCKET SIP 3POS GOLD
|
Package: - |
Stock4,032 |
|
- |
0513 |
SIP |
3 (1 x 3) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
- |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET 4POS GOLD
|
Package: - |
Stock3,562 |
|
- |
518 |
DIP, 0.2" (5.08mm) Row Spacing |
4 (2 x 2) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
|
|
|
Aries Electronics |
CONN SOCKET SIP 4POS GOLD
|
Package: - |
Stock5,490 |
|
- |
518 |
SIP |
4 (1 x 4) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
|
|
|
Aries Electronics |
CONN SOCKET SIP 2POS GOLD
|
Package: - |
Stock5,976 |
|
- |
0513 |
SIP |
2 (1 x 2) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
- |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
|
|
|
Aries Electronics |
CONN SOCKET SIP 3POS GOLD
|
Package: - |
Stock8,028 |
|
- |
518 |
SIP |
3 (1 x 3) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
|
|
|
Aries Electronics |
CONN SOCKET SIP 3POS GOLD
|
Package: - |
Stock2,952 |
|
- |
0513 |
SIP |
3 (1 x 3) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
- |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
|
|
|
Aries Electronics |
CONN SOCKET SIP 1POS GOLD
|
Package: - |
Stock8,496 |
|
- |
0517 |
SIP |
1 (1 x 1) |
- |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole, Right Angle |
- |
Solder |
- |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
|
|
|
Aries Electronics |
CONN SOCKET SIP 3POS GOLD
|
Package: - |
Stock8,388 |
|
- |
518 |
SIP |
3 (1 x 3) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET 2POS GOLD
|
Package: - |
Stock7,614 |
|
- |
518 |
DIP, 0.2" (5.08mm) Row Spacing |
2 (1 x 2) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
|
|
|
Aries Electronics |
CONN SOCKET SIP 2POS GOLD
|
Package: - |
Stock2,484 |
|
- |
518 |
SIP |
2 (1 x 2) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
|
|
|
Aries Electronics |
CONN SOCKET SIP 1POS GOLD
|
Package: - |
Stock6,246 |
|
- |
518 |
SIP |
1 (1 x 1) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
|
|
|
Aries Electronics |
CONN SOCKET SIP 3POS GOLD
|
Package: - |
Stock3,454 |
|
- |
518 |
SIP |
3 (1 x 3) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Surface Mount |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
|
|
|
Aries Electronics |
CONN SOCKET SIP 1POS GOLD
|
Package: - |
Stock5,796 |
|
- |
0513 |
SIP |
1 (1 x 1) |
- |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
- |
Solder |
- |
Gold |
10µin (0.25µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET 2POS GOLD
|
Package: - |
Stock2,646 |
|
- |
Lo-PRO?file, 513 |
DIP, 0.4" (10.16mm) Row Spacing |
2 (1 x 2) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET 2POS GOLD
|
Package: - |
Stock8,388 |
|
- |
Lo-PRO?file, 513 |
DIP, 0.3" (7.62mm) Row Spacing |
2 (1 x 2) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET 2POS GOLD
|
Package: - |
Stock7,758 |
|
- |
Lo-PRO?file, 513 |
DIP, 0.2" (5.08mm) Row Spacing |
2 (1 x 2) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
|
|
|
Aries Electronics |
CONN SOCKET SIP 3POS GOLD
|
Package: - |
Stock6,390 |
|
- |
518 |
SIP |
3 (1 x 3) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
|
|
|
Aries Electronics |
CONN SOCKET SIP 2POS GOLD
|
Package: - |
Stock6,480 |
|
- |
0513 |
SIP |
2 (1 x 2) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
- |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
|
|
|
Aries Electronics |
CONN SOCKET SIP 1POS GOLD
|
Package: - |
Stock7,650 |
|
- |
0513 |
SIP |
1 (1 x 1) |
- |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
- |
Solder |
- |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET 2POS GOLD
|
Package: - |
Stock2,682 |
|
- |
518 |
DIP, 0.2" (5.08mm) Row Spacing |
2 (1 x 2) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET 2POS GOLD
|
Package: - |
Stock6,120 |
|
- |
518 |
DIP, 0.2" (5.08mm) Row Spacing |
2 (1 x 2) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
|
|
|
Aries Electronics |
CONN SOCKET SIP 2POS GOLD
|
Package: - |
Stock2,394 |
|
- |
518 |
SIP |
2 (1 x 2) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
|
|
|
Aries Electronics |
CONN SOCKET SIP 2POS GOLD
|
Package: - |
Stock2,124 |
|
- |
518 |
SIP |
2 (1 x 2) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
