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Sockets for ICs, Transistors

Records 4240
Page  140/142
Image
Part Number
Manufacturer
Description
Package
Stock
Quantity
Package
Series
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
Aries Electronics
CONN SOCKET SIP 8POS GOLD
Package: -
Stock8,124
-
518
SIP
8 (1 x 8)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
Aries Electronics
CONN SOCKET PGA ZIF GOLD
Package: -
Stock6,336
-
PRS
PGA, ZIF (ZIP)
-
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Polyphenylene Sulfide (PPS)
-65°C ~ 125°C
Aries Electronics
CONN SOCKET PGA ZIF GOLD
Package: -
Stock5,814
-
PRS
PGA, ZIF (ZIP)
-
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Polyphenylene Sulfide (PPS)
-65°C ~ 125°C
Aries Electronics
CONN IC DIP SOCKET ZIF 24POS GLD
Package: -
Stock6,324
-
55
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
-
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
-
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
-
Aries Electronics
CONN IC DIP SOCKET 10POS GOLD
Package: -
Stock8,160
-
Vertisockets? 800
DIP, 0.6" (15.24mm) Row Spacing
10 (2 x 5)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole, Right Angle, Vertical
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
Aries Electronics
CONN IC DIP SOCKET ZIF 24POS
Package: -
Stock7,794
-
55
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Nickel Boron
50µin (1.27µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Nickel Boron
50µin (1.27µm)
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
-
Aries Electronics
CONN IC DIP SOCKET 40POS GOLD
Package: -
Stock7,332
-
Vertisockets? 800
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Phosphor Bronze
Through Hole, Right Angle, Horizontal
Closed Frame
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6
-
Aries Electronics
CONN SOCKET PGA GOLD
Package: -
Stock6,144
-
PGM
PGA
-
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
Aries Electronics
CONN IC DIP SOCKET ZIF 32POS TIN
Package: -
Stock11,148
-
55
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
-
Aries Electronics
CONN IC DIP SOCKET ZIF 28POS GLD
Package: -
Stock8,904
-
516
DIP, ZIF (ZIP)
28 (2 x 14)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Polyamide (PA46), Nylon 4/6, Glass Filled
-
Aries Electronics
CONN IC DIP SOCKET 18POS GOLD
Package: -
Stock7,680
-
Vertisockets? 800
DIP, 0.6" (15.24mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Phosphor Bronze
Through Hole, Right Angle, Horizontal
Closed Frame
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6
-
Aries Electronics
CONN IC DIP SOCKET 16POS GOLD
Package: -
Stock7,686
-
Vertisockets? 800
DIP, 0.2" (5.08mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole, Right Angle, Horizontal
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
Aries Electronics
CONN IC DIP SOCKET 18POS TIN
Package: -
Stock19,596
-
Vertisockets? 800
DIP, 0.6" (15.24mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Tin
200µin (5.08µm)
Phosphor Bronze
Through Hole, Right Angle, Vertical
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6
-
Aries Electronics
CONN IC DIP SOCKET 12POS GOLD
Package: -
Stock8,676
-
Vertisockets? 800
DIP, 0.6" (15.24mm) Row Spacing
12 (2 x 6)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole, Right Angle, Vertical
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
Aries Electronics
CONN IC DIP SOCKET 16POS GOLD
Package: -
Stock7,092
-
Vertisockets? 800
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole, Right Angle, Vertical
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
Aries Electronics
CONN IC DIP SOCKET 14POS GOLD
Package: -
Stock9,348
-
Vertisockets? 800
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole, Right Angle, Vertical
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
Aries Electronics
CONN IC DIP SOCKET 10POS GOLD
Package: -
Stock14,448
-
Vertisockets? 800
DIP, 0.2" (5.08mm) Row Spacing
10 (2 x 5)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Phosphor Bronze
Through Hole, Right Angle, Vertical
Closed Frame
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6
-
Aries Electronics
CONN IC DIP SOCKET 16POS GOLD
Package: -
Stock6,102
-
Vertisockets? 800
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Phosphor Bronze
Through Hole, Right Angle, Horizontal
Closed Frame
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6
-
Aries Electronics
CONN IC DIP SOCKET 12POS GOLD
Package: -
Stock8,028
-
Vertisockets? 800
DIP, 0.3" (7.62mm) Row Spacing
12 (2 x 6)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole, Right Angle, Horizontal
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
Aries Electronics
CONN IC DIP SOCKET 40POS GOLD
Package: -
Stock8,880
-
EJECT-A-DIP?
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
Aries Electronics
CONN IC DIP SOCKET 10POS GOLD
Package: -
Stock20,370
-
Vertisockets? 800
DIP, 0.4" (10.16mm) Row Spacing
10 (2 x 5)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole, Right Angle, Horizontal
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
Aries Electronics
CONN IC DIP SOCKET 10POS GOLD
Package: -
Stock20,508
-
Vertisockets? 800
DIP, 0.2" (5.08mm) Row Spacing
10 (2 x 5)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole, Right Angle, Horizontal
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
Aries Electronics
CONN IC DIP SOCKET 32POS GOLD
Package: -
Stock7,056
-
EJECT-A-DIP?
DIP, 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
Aries Electronics
CONN IC DIP SOCKET 10POS TIN
Package: -
Stock8,892
-
Vertisockets? 800
DIP, 0.2" (5.08mm) Row Spacing
10 (2 x 5)
0.100" (2.54mm)
Tin
200µin (5.08µm)
Phosphor Bronze
Through Hole, Right Angle, Horizontal
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6
-
Aries Electronics
CONN SOCKET SIP 25POS TIN
Package: -
Stock10,416
-
511
SIP
25 (1 x 25)
0.100" (2.54mm)
Tin
50µin (1.27µm)
Phosphor Bronze
Through Hole
-
Solder
0.100" (2.54mm)
Tin
50µin (1.27µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
Aries Electronics
CONN SOCKET SIP 20POS GOLD
Package: -
Stock8,676
-
518
SIP
20 (1 x 20)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
Aries Electronics
CONN IC DIP SOCKET 14POS GOLD
Package: -
Stock6,744
-
518
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
Aries Electronics
CONN IC DIP SOCKET 48POS GOLD
Package: -
Stock8,844
-
518
DIP, 0.6" (15.24mm) Row Spacing
48 (2 x 24)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
Aries Electronics
CONN IC DIP SOCKET 14POS TIN
Package: -
Stock6,600
-
8
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Tin
200µin (5.08µm)
Phosphor Bronze
Through Hole
Closed Frame, Elevated
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
Aries Electronics
CONN IC DIP SOCKET 18POS GOLD
Package: -
Stock7,524
-
Lo-PRO?file, 513
DIP, 0.6" (15.24mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-