* Please refer to the English Version as our Official Version.
Image |
Part Number |
Manufacturer |
Description |
Package |
Stock |
Quantity |
Package |
Series |
Type |
Number of Positions or Pins (Grid) |
Pitch - Mating |
Contact Finish - Mating |
Contact Finish Thickness - Mating |
Contact Material - Mating |
Mounting Type |
Features |
Termination |
Pitch - Post |
Contact Finish - Post |
Contact Finish Thickness - Post |
Contact Material - Post |
Housing Material |
Operating Temperature |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics |
CONN SOCKET SIP 2POS GOLD
|
Package: - |
Stock2,574 |
|
- |
0503 |
SIP |
2 (1 x 2) |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
- |
Wire Wrap |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA), Nylon, Glass Filled |
- |
||
Aries Electronics |
CONN SOCKET SIP 5POS GOLD
|
Package: - |
Stock5,724 |
|
- |
0513 |
SIP |
5 (1 x 5) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
- |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
||
Aries Electronics |
CONN IC DIP SOCKET 6POS GOLD
|
Package: - |
Stock6,354 |
|
- |
518 |
DIP, 0.2" (5.08mm) Row Spacing |
6 (2 x 3) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
||
Aries Electronics |
CONN SOCKET SIP 6POS GOLD
|
Package: - |
Stock8,802 |
|
- |
518 |
SIP |
6 (1 x 6) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Surface Mount |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
||
Aries Electronics |
CONN IC DIP SOCKET 6POS GOLD
|
Package: - |
Stock6,858 |
|
- |
Lo-PRO?file, 513 |
DIP, 0.2" (5.08mm) Row Spacing |
6 (2 x 3) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
||
Aries Electronics |
CONN IC DIP SOCKET 6POS GOLD
|
Package: - |
Stock7,704 |
|
- |
Lo-PRO?file, 513 |
DIP, 0.3" (7.62mm) Row Spacing |
6 (2 x 3) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
||
Aries Electronics |
CONN IC DIP SOCKET 8POS GOLD
|
Package: - |
Stock6,048 |
|
- |
518 |
DIP, 0.2" (5.08mm) Row Spacing |
8 (2 x 4) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
||
Aries Electronics |
CONN SOCKET SIP 8POS GOLD
|
Package: - |
Stock3,348 |
|
- |
518 |
SIP |
8 (1 x 8) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
||
Aries Electronics |
CONN IC DIP SOCKET 14POS GOLD
|
Package: - |
Stock2,214 |
|
- |
518 |
DIP, 0.3" (7.62mm) Row Spacing |
14 (2 x 7) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
||
Aries Electronics |
CONN SOCKET SIP 7POS GOLD
|
Package: - |
Stock7,074 |
|
- |
0513 |
SIP |
7 (1 x 7) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
- |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
||
Aries Electronics |
CONN SOCKET SIP 4POS GOLD
|
Package: - |
Stock6,192 |
|
- |
0513 |
SIP |
4 (1 x 4) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
- |
Solder |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
||
Aries Electronics |
CONN SOCKET SIP 9POS GOLD
|
Package: - |
Stock4,662 |
|
- |
518 |
SIP |
9 (1 x 9) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
||
Aries Electronics |
CONN IC DIP SOCKET 8POS GOLD
|
Package: - |
Stock7,506 |
|
- |
518 |
DIP, 0.2" (5.08mm) Row Spacing |
8 (2 x 4) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
||
Aries Electronics |
CONN SOCKET SIP 8POS GOLD
|
Package: - |
Stock5,760 |
|
- |
518 |
SIP |
8 (1 x 8) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
||
Aries Electronics |
CONN IC DIP SOCKET 6POS GOLD
|
Package: - |
Stock7,956 |
|
- |
518 |
DIP, 0.2" (5.08mm) Row Spacing |
6 (2 x 3) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
||
Aries Electronics |
CONN SOCKET SIP 6POS GOLD
|
Package: - |
Stock3,598 |
|
- |
518 |
SIP |
6 (1 x 6) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
||
Aries Electronics |
CONN IC DIP SOCKET 2POS GOLD
|
Package: - |
Stock4,050 |
|
- |
508 |
DIP, 0.2" (5.08mm) Row Spacing |
2 (1 x 2) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
- |
Wire Wrap |
- |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6 |
-55°C ~ 105°C |
||
Aries Electronics |
CONN IC DIP SOCKET 2POS GOLD
|
Package: - |
Stock2,304 |
|
- |
508 |
DIP, 0.2" (5.08mm) Row Spacing |
2 (1 x 2) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
- |
Wire Wrap |
- |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6 |
-55°C ~ 105°C |
||
Aries Electronics |
CONN SOCKET SIP 2POS GOLD
|
Package: - |
Stock3,780 |
|
- |
508 |
SIP |
2 (1 x 2) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
- |
Wire Wrap |
- |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6 |
-55°C ~ 105°C |
||
Aries Electronics |
CONN SOCKET SIP 2POS GOLD
|
Package: - |
Stock2,070 |
|
- |
508 |
SIP |
2 (1 x 2) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
- |
Wire Wrap |
- |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6 |
-55°C ~ 105°C |
||
Aries Electronics |
CONN SOCKET SIP 6POS GOLD
|
Package: - |
Stock3,042 |
|
- |
0513 |
SIP |
6 (1 x 6) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
- |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
||
Aries Electronics |
CONN SOCKET SIP 1POS GOLD
|
Package: - |
Stock3,960 |
|
- |
508 |
SIP |
1 (1 x 1) |
- |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
- |
Wire Wrap |
- |
Gold |
10µin (0.25µm) |
Brass |
Polyamide (PA46), Nylon 4/6 |
-55°C ~ 125°C |
||
Aries Electronics |
CONN SOCKET SIP 1POS GOLD
|
Package: - |
Stock7,200 |
|
- |
508 |
SIP |
1 (1 x 1) |
- |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
- |
Wire Wrap |
- |
Gold |
10µin (0.25µm) |
Brass |
Polyamide (PA46), Nylon 4/6 |
-55°C ~ 125°C |
||
Aries Electronics |
CONN SOCKET SIP 7POS GOLD
|
Package: - |
Stock5,436 |
|
- |
518 |
SIP |
7 (1 x 7) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
||
Aries Electronics |
CONN IC DIP SOCKET 6POS GOLD
|
Package: - |
Stock3,204 |
|
- |
518 |
DIP, 0.3" (7.62mm) Row Spacing |
6 (2 x 3) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
||
Aries Electronics |
CONN SOCKET SIP 4POS GOLD
|
Package: - |
Stock2,448 |
|
- |
0513 |
SIP |
4 (1 x 4) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
- |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
||
Aries Electronics |
CONN SOCKET SIP 3POS GOLD
|
Package: - |
Stock6,624 |
|
- |
0513 |
SIP |
3 (1 x 3) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
- |
Solder |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
||
Aries Electronics |
CONN IC DIP SOCKET 8POS GOLD
|
Package: - |
Stock3,418 |
|
- |
518 |
DIP, 0.2" (5.08mm) Row Spacing |
8 (2 x 4) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
||
Aries Electronics |
CONN SOCKET SIP 7POS GOLD
|
Package: - |
Stock3,438 |
|
- |
518 |
SIP |
7 (1 x 7) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
||
Aries Electronics |
CONN SOCKET SIP 3POS GOLD
|
Package: - |
Stock4,914 |
|
- |
518 |
SIP |
3 (1 x 3) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |