* Please refer to the English Version as our Official Version.
Image |
Part Number |
Manufacturer |
Description |
Package |
Stock |
Quantity |
Package |
Series |
Type |
Number of Positions or Pins (Grid) |
Pitch - Mating |
Contact Finish - Mating |
Contact Finish Thickness - Mating |
Contact Material - Mating |
Mounting Type |
Features |
Termination |
Pitch - Post |
Contact Finish - Post |
Contact Finish Thickness - Post |
Contact Material - Post |
Housing Material |
Operating Temperature |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics |
CONN SOCKET SIP 12POS GOLD
|
Package: - |
Stock5,400 |
|
- |
518 |
SIP |
12 (1 x 12) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
||
Aries Electronics |
CONN IC DIP SOCKET 18POS GOLD
|
Package: - |
Stock2,394 |
|
- |
518 |
DIP, 0.3" (7.62mm) Row Spacing |
18 (2 x 9) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
||
Aries Electronics |
CONN SOCKET SIP 11POS GOLD
|
Package: - |
Stock3,924 |
|
- |
0513 |
SIP |
11 (1 x 11) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
- |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
||
Aries Electronics |
CONN SOCKET SIP 10POS GOLD
|
Package: - |
Stock6,030 |
|
- |
0513 |
SIP |
10 (1 x 10) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
- |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
||
Aries Electronics |
CONN IC DIP SOCKET 8POS GOLD
|
Package: - |
Stock3,492 |
|
- |
Lo-PRO?file, 513 |
DIP, 0.6" (15.24mm) Row Spacing |
8 (2 x 4) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
||
Aries Electronics |
CONN IC DIP SOCKET 14POS GOLD
|
Package: - |
Stock6,606 |
|
- |
518 |
DIP, 0.2" (5.08mm) Row Spacing |
14 (2 x 7) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
||
Aries Electronics |
CONN SOCKET SIP 7POS GOLD
|
Package: - |
Stock8,496 |
|
- |
0513 |
SIP |
7 (1 x 7) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
- |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
||
Aries Electronics |
CONN SOCKET SIP 6POS GOLD
|
Package: - |
Stock5,166 |
|
- |
0513 |
SIP |
6 (1 x 6) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
- |
Solder |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
||
Aries Electronics |
CONN SOCKET SIP 5POS GOLD
|
Package: - |
Stock6,858 |
|
- |
0513 |
SIP |
5 (1 x 5) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
- |
Solder |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
||
Aries Electronics |
CONN IC DIP SOCKET 12POS GOLD
|
Package: - |
Stock8,568 |
|
- |
518 |
DIP, 0.2" (5.08mm) Row Spacing |
12 (2 x 6) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
||
Aries Electronics |
CONN SOCKET SIP 12POS GOLD
|
Package: - |
Stock2,520 |
|
- |
518 |
SIP |
12 (1 x 12) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
||
Aries Electronics |
CONN SOCKET SIP 9POS GOLD
|
Package: - |
Stock7,812 |
|
- |
518 |
SIP |
9 (1 x 9) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
||
Aries Electronics |
CONN IC DIP SOCKET 10POS GOLD
|
Package: - |
Stock3,834 |
|
- |
Lo-PRO?file, 513 |
DIP, 0.3" (7.62mm) Row Spacing |
10 (2 x 5) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
||
Aries Electronics |
CONN IC DIP SOCKET 10POS GOLD
|
Package: - |
Stock4,302 |
|
- |
Lo-PRO?file, 513 |
DIP, 0.2" (5.08mm) Row Spacing |
10 (2 x 5) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
||
Aries Electronics |
CONN SOCKET SIP 13POS GOLD
|
Package: - |
Stock6,192 |
|
- |
518 |
SIP |
13 (1 x 13) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
||
Aries Electronics |
CONN SOCKET SIP 11POS GOLD
|
Package: - |
Stock2,142 |
|
- |
518 |
SIP |
11 (1 x 11) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
||
Aries Electronics |
CONN SOCKET SIP 5POS GOLD
|
Package: - |
Stock6,012 |
|
- |
518 |
SIP |
5 (1 x 5) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
||
Aries Electronics |
CONN SOCKET SIP 3POS GOLD
|
Package: - |
Stock7,380 |
|
- |
508 |
SIP |
3 (1 x 3) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
- |
Wire Wrap |
- |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6 |
-55°C ~ 105°C |
||
Aries Electronics |
CONN SOCKET SIP 3POS GOLD
|
Package: - |
Stock8,370 |
|
- |
508 |
SIP |
3 (1 x 3) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
- |
Wire Wrap |
- |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6 |
-55°C ~ 105°C |
||
Aries Electronics |
CONN SOCKET SIP 10POS GOLD
|
Package: - |
Stock6,336 |
|
- |
0513 |
SIP |
10 (1 x 10) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
- |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
||
Aries Electronics |
CONN SOCKET SIP 9POS GOLD
|
Package: - |
Stock2,196 |
|
- |
0513 |
SIP |
9 (1 x 9) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
- |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
||
Aries Electronics |
CONN IC DIP SOCKET 20POS GOLD
|
Package: - |
Stock6,840 |
|
- |
518 |
DIP, 0.3" (7.62mm) Row Spacing |
20 (2 x 10) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
||
Aries Electronics |
CONN IC DIP SOCKET 6POS GOLD
|
Package: - |
Stock3,438 |
|
- |
Lo-PRO?file, 513 |
DIP, 0.3" (7.62mm) Row Spacing |
6 (2 x 3) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
||
Aries Electronics |
CONN SOCKET SIP 11POS GOLD
|
Package: - |
Stock5,904 |
|
- |
518 |
SIP |
11 (1 x 11) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
||
Aries Electronics |
CONN SOCKET SIP 7POS GOLD
|
Package: - |
Stock2,340 |
|
- |
518 |
SIP |
7 (1 x 7) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Surface Mount |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
||
Aries Electronics |
CONN IC DIP SOCKET 8POS GOLD
|
Package: - |
Stock2,520 |
|
- |
Lo-PRO?file, 513 |
DIP, 0.6" (15.24mm) Row Spacing |
8 (2 x 4) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
||
Aries Electronics |
CONN IC DIP SOCKET 6POS GOLD
|
Package: - |
Stock8,082 |
|
- |
Lo-PRO?file, 513 |
DIP, 0.6" (15.24mm) Row Spacing |
6 (2 x 3) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
||
Aries Electronics |
CONN IC DIP SOCKET 2POS GOLD
|
Package: - |
Stock4,068 |
|
- |
Lo-PRO?file, 513 |
DIP, 0.6" (15.24mm) Row Spacing |
2 (1 x 2) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
||
Aries Electronics |
CONN IC DIP SOCKET 12POS GOLD
|
Package: - |
Stock6,552 |
|
- |
518 |
DIP, 0.2" (5.08mm) Row Spacing |
12 (2 x 6) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
||
Aries Electronics |
CONN SOCKET SIP 12POS GOLD
|
Package: - |
Stock3,852 |
|
- |
518 |
SIP |
12 (1 x 12) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |