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* Please refer to the English Version as our Official Version.
* Please refer to the English Version as our Official Version.
Image |
Part Number |
Manufacturer |
Description |
Package |
Stock |
Quantity |
Package |
Series |
Type |
Number of Positions or Pins (Grid) |
Pitch - Mating |
Contact Finish - Mating |
Contact Finish Thickness - Mating |
Contact Material - Mating |
Mounting Type |
Features |
Termination |
Pitch - Post |
Contact Finish - Post |
Contact Finish Thickness - Post |
Contact Material - Post |
Housing Material |
Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock6,552 |
|
- |
PLS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 125°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock7,776 |
|
- |
PLS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Nickel Bronze |
50µin (1.27µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 200°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock4,518 |
|
- |
PRS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Nickel Bronze |
50µin (1.27µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 200°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock4,194 |
|
- |
PRS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Nickel Bronze |
50µin (1.27µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 200°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock8,892 |
|
- |
PRS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 125°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock4,680 |
|
- |
PLS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 125°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock3,402 |
|
- |
PRS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 125°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock6,588 |
|
- |
PLS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 125°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock3,762 |
|
- |
PLS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 125°C |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET ZIF 32POS TIN
|
Package: - |
Stock7,092 |
|
- |
57 |
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
32 (2 x 16) |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS), Glass Filled |
- |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET ZIF 32POS
|
Package: - |
Stock7,218 |
|
- |
57 |
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing |
32 (2 x 16) |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Polyphenylene Sulfide (PPS), Glass Filled |
- |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET ZIF 40POS
|
Package: - |
Stock3,636 |
|
- |
55 |
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing |
40 (2 x 20) |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Polyetheretherketone (PEEK), Glass Filled |
-55°C ~ 250°C |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET ZIF 40POS
|
Package: - |
Stock5,490 |
|
- |
55 |
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
40 (2 x 20) |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Polyetheretherketone (PEEK), Glass Filled |
-55°C ~ 250°C |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET ZIF 44POS
|
Package: - |
Stock7,470 |
|
- |
55 |
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
44 (2 x 22) |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Polyetheretherketone (PEEK), Glass Filled |
-55°C ~ 250°C |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET ZIF 44POS
|
Package: - |
Stock4,212 |
|
- |
55 |
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
44 (2 x 22) |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Polyetheretherketone (PEEK), Glass Filled |
-55°C ~ 250°C |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET ZIF 44POS
|
Package: - |
Stock6,408 |
|
- |
55 |
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
44 (2 x 22) |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Polyetheretherketone (PEEK), Glass Filled |
-55°C ~ 250°C |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET ZIF 44POS
|
Package: - |
Stock5,886 |
|
- |
55 |
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing |
44 (2 x 22) |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Polyetheretherketone (PEEK), Glass Filled |
-55°C ~ 250°C |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET ZIF 44POS
|
Package: - |
Stock5,724 |
|
- |
55 |
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing |
44 (2 x 22) |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Polyetheretherketone (PEEK), Glass Filled |
-55°C ~ 250°C |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET ZIF 44POS
|
Package: - |
Stock6,264 |
|
- |
55 |
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing |
44 (2 x 22) |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Polyetheretherketone (PEEK), Glass Filled |
-55°C ~ 250°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock2,286 |
|
- |
PRS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Nickel Bronze |
50µin (1.27µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 200°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock7,578 |
|
- |
PRS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 125°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock4,356 |
|
- |
PLS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 125°C |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET ZIF 32POS TIN
|
Package: - |
Stock7,686 |
|
- |
57 |
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
32 (2 x 16) |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS), Glass Filled |
- |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET ZIF 32POS
|
Package: - |
Stock2,790 |
|
- |
57 |
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing |
32 (2 x 16) |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Polyphenylene Sulfide (PPS), Glass Filled |
- |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock3,474 |
|
- |
PRS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 125°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock4,446 |
|
- |
PLS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 125°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock3,490 |
|
- |
PRS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 125°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock2,268 |
|
- |
PRS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 125°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock5,022 |
|
- |
PLS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 125°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock5,886 |
|
- |
PLS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 125°C |
