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* Please refer to the English Version as our Official Version.
* Please refer to the English Version as our Official Version.
Image |
Part Number |
Manufacturer |
Description |
Package |
Stock |
Quantity |
Package |
Series |
Type |
Number of Positions or Pins (Grid) |
Pitch - Mating |
Contact Finish - Mating |
Contact Finish Thickness - Mating |
Contact Material - Mating |
Mounting Type |
Features |
Termination |
Pitch - Post |
Contact Finish - Post |
Contact Finish Thickness - Post |
Contact Material - Post |
Housing Material |
Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Aries Electronics |
CONN IC DIP SOCKET ZIF 32POS
|
Package: - |
Stock3,834 |
|
- |
55 |
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
32 (2 x 16) |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Polyetheretherketone (PEEK), Glass Filled |
-55°C ~ 250°C |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET ZIF 32POS
|
Package: - |
Stock2,160 |
|
- |
55 |
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing |
32 (2 x 16) |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Polyetheretherketone (PEEK), Glass Filled |
-55°C ~ 250°C |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET ZIF 32POS
|
Package: - |
Stock6,048 |
|
- |
55 |
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing |
32 (2 x 16) |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Polyetheretherketone (PEEK), Glass Filled |
-55°C ~ 250°C |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET ZIF 32POS
|
Package: - |
Stock8,712 |
|
- |
55 |
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing |
32 (2 x 16) |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Polyetheretherketone (PEEK), Glass Filled |
-55°C ~ 250°C |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET ZIF 28POS
|
Package: - |
Stock3,418 |
|
- |
55 |
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Polyetheretherketone (PEEK), Glass Filled |
-55°C ~ 250°C |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET ZIF 24POS
|
Package: - |
Stock6,786 |
|
- |
55 |
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing |
24 (2 x 12) |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Polyetheretherketone (PEEK), Glass Filled |
-55°C ~ 250°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock2,682 |
|
- |
PRS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 125°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock3,348 |
|
- |
PRS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 125°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock6,552 |
|
- |
PRS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 125°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock6,534 |
|
- |
PLS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 125°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock6,426 |
|
- |
PRS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 125°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock5,742 |
|
- |
PLS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 125°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock2,502 |
|
- |
PRS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 125°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock8,532 |
|
- |
PLS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 125°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock4,572 |
|
- |
PRS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Nickel Bronze |
50µin (1.27µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 200°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock5,058 |
|
- |
PLS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Nickel Bronze |
50µin (1.27µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 200°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock3,834 |
|
- |
PRS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Nickel Bronze |
50µin (1.27µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 200°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock3,348 |
|
- |
PLS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Nickel Bronze |
50µin (1.27µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 200°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock7,650 |
|
- |
PRS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Nickel Bronze |
50µin (1.27µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 200°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock5,688 |
|
- |
PRS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 125°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock3,546 |
|
- |
PRS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 125°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock8,028 |
|
- |
PLS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 125°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock7,074 |
|
- |
PLS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 125°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock3,762 |
|
- |
PRS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 125°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock7,596 |
|
- |
PRS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 125°C |
|
|
|
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
Package: - |
Stock6,552 |
|
- |
PLS |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 125°C |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET ZIF 32POS TIN
|
Package: - |
Stock7,614 |
|
- |
55 |
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
32 (2 x 16) |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS), Glass Filled |
- |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET ZIF 28POS
|
Package: - |
Stock5,922 |
|
- |
55 |
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Polyetheretherketone (PEEK), Glass Filled |
-55°C ~ 250°C |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET ZIF 28POS
|
Package: - |
Stock4,014 |
|
- |
55 |
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Polyetheretherketone (PEEK), Glass Filled |
-55°C ~ 250°C |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET ZIF 28POS
|
Package: - |
Stock5,634 |
|
- |
55 |
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Nickel Boron |
50µin (1.27µm) |
Beryllium Nickel |
Polyetheretherketone (PEEK), Glass Filled |
-55°C ~ 250°C |
