SalesDept@topcomponents.cc +8613427370519
Login / Registro
Language Translation

* Please refer to the English Version as our Official Version.

Solicitação de cotação

Sockets for ICs, Transistors

Records 11083
Page  349/370
Image
Part Number
Manufacturer
Description
Package
Stock
Quantity
Package
Series
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
3M
CONN IC DIP SOCKET 18POS TIN
Package: -
Stock20,784
-
4800
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Polyester, Glass Filled
-25°C ~ 85°C
Assmann WSW Components
CONN IC DIP SOCKET 32POS TIN
Package: -
Stock7,368
-
-
DIP, 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Polybutylene Terephthalate (PBT)
-55°C ~ 85°C
Aries Electronics
CONN SOCKET PGA ZIF GOLD
Package: -
Stock6,336
-
PRS
PGA, ZIF (ZIP)
-
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Polyphenylene Sulfide (PPS)
-65°C ~ 125°C
3M
CONN SOCKET QFN 64POS GOLD
Package: -
Stock8,028
-
Textool?
QFN
64 (4 x 16)
0.020" (0.50mm)
Gold
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.020" (0.50mm)
Gold
-
Beryllium Copper
Polyethersulfone (PES)
-
Aries Electronics
CONN SOCKET PGA ZIF GOLD
Package: -
Stock5,814
-
PRS
PGA, ZIF (ZIP)
-
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Polyphenylene Sulfide (PPS)
-65°C ~ 125°C
3M
CONN SOCKET QFN 28POS GOLD
Package: -
Stock8,766
-
Textool?
QFN
28 (4 x 7)
0.020" (0.50mm)
Gold
-
Beryllium Copper
Through Hole
-
Solder
-
Gold
-
Beryllium Copper
Polyethersulfone (PES)
-
3M
CONN SOCKET QFN 24POS GOLD
Package: -
Stock7,398
-
Textool?
QFN
24 (4 x 6)
0.020" (0.50mm)
Gold
-
Beryllium Copper
Through Hole
-
Solder
-
Gold
-
Beryllium Copper
Polyethersulfone (PES)
-
3M
CONN SOCKET QFN 48POS GOLD
Package: -
Stock6,714
-
Textool?
QFN
48 (4 x 12)
0.020" (0.50mm)
Gold
-
Beryllium Copper
Through Hole
Closed Frame
Solder
-
Gold
-
Beryllium Copper
Polyethersulfone (PES)
-
3M
CONN SOCKET QFN 16POS GOLD
Package: -
Stock7,560
-
Textool?
QFN
16 (4 x 4)
0.020" (0.50mm)
Gold
-
Beryllium Copper
Through Hole
-
Solder
-
Gold
-
Beryllium Copper
Polyethersulfone (PES)
-
3M
CONN SOCKET PGA ZIF 225POS GOLD
Package: -
Stock6,168
-
Textool?
PGA, ZIF (ZIP)
225 (15 x 15)
0.100" (2.54mm)
-
-
-
-
-
-
0.100" (2.54mm)
-
-
-
Polyethersulfone (PES)
-55°C ~ 150°C
3M
CONN SOCKET SIP ZIF 24POS GOLD
Package: -
Stock5,904
-
Textool?
SIP, ZIF (ZIP)
24 (1 x 24)
0.100" (2.54mm)
Gold
-
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN SOCKET SIP ZIF 10POS GOLD
Package: -
Stock6,444
-
Textool?
SIP, ZIF (ZIP)
10 (1 x 10)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
Aries Electronics
CONN IC DIP SOCKET ZIF 24POS GLD
Package: -
Stock6,324
-
55
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
-
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
-
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
-
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 28POS GOLD
Package: -
Stock7,524
-
110
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
TE Connectivity AMP Connectors
SOCKET ASSY LGA2011-1 0.38AU
Package: -
Stock7,872
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
TE Connectivity AMP Connectors
SOCKET ASSY LGA2011-3 0.76UM AU
Package: -
Stock8,550
-
*
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
TE Connectivity AMP Connectors
CONN TRANSIST TO-5 8POS GOLD
Package: -
Stock6,504
-
8058
Transistor, TO-5
8 (Round)
-
Gold
-
Beryllium Copper
Panel Mount
-
Solder Cup
-
Gold
-
Brass
Polytetrafluoroethylene (PTFE)
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN TRANSIST TO-5 3POS GOLD
Package: -
Stock8,832
-
8059
Transistor, TO-5
3 (Round)
-
Gold
-
Copper Alloy
Through Hole
-
Solder
-
Gold
-
Copper Alloy
Polyamide (PA), Nylon
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN TRANSIST TO-5 8POS GOLD
Package: -
Stock8,838
-
8058
Transistor, TO-5
8 (Round)
-
Gold
-
Beryllium Copper
Through Hole
Closed Frame
Solder
-
Gold
-
Brass
Polytetrafluoroethylene (PTFE)
-55°C ~ 125°C
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 20POS GOLD
Package: -
Stock8,016
-
123
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame, Decoupling Capacitor
Wire Wrap
0.100" (2.54mm)
Tin-Lead
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 24POS GOLD
Package: -
Stock7,020
-
123
DIP, 0.4" (10.16mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Wire Wrap
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 8POS GOLD
Package: -
Stock13,590
-
116
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 18POS GOLD
Package: -
Stock12,078
-
116
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 10POS GOLD
Package: -
Stock8,856
-
111
DIP, 0.2" (5.08mm) Row Spacing
10 (2 x 5)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 48POS GOLD
Package: -
Stock7,740
-
800
DIP, 0.6" (15.24mm) Row Spacing
48 (2 x 24)
0.100" (2.54mm)
Gold
25µin (0.63µm)
Copper Alloy
Through Hole
Open Frame
Solder
0.100" (2.54mm)
-
-
Copper Alloy
Polyester
-55°C ~ 105°C
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 36POS GOLD
Package: -
Stock6,012
-
299
DIP, 0.6" (15.24mm) Row Spacing
36 (2 x 18)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole, Right Angle, Horizontal
Closed Frame
Solder
0.100" (2.54mm)
Tin-Lead
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 36POS GOLD
Package: -
Stock13,944
-
800
DIP, 0.6" (15.24mm) Row Spacing
36 (2 x 18)
0.100" (2.54mm)
Gold
25µin (0.63µm)
Copper Alloy
Through Hole
Open Frame
Solder
0.100" (2.54mm)
-
-
-
Polyester
-55°C ~ 105°C
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 32POS GOLD
Package: -
Stock8,700
-
299
DIP, 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole, Right Angle, Horizontal
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
TE Connectivity AMP Connectors
SOCKET ASSY LGA1150
Package: -
Stock7,860
-
*
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
TE Connectivity AMP Connectors
SOCKET ASSY LGA1151, 0.38AU
Package: -
Stock7,344
-
*
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-