* Please refer to the English Version as our Official Version.
Image |
Part Number |
Manufacturer |
Description |
Package |
Stock |
Quantity |
Package |
Series |
Type |
Number of Positions or Pins (Grid) |
Pitch - Mating |
Contact Finish - Mating |
Contact Finish Thickness - Mating |
Contact Material - Mating |
Mounting Type |
Features |
Termination |
Pitch - Post |
Contact Finish - Post |
Contact Finish Thickness - Post |
Contact Material - Post |
Housing Material |
Operating Temperature |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 40POS GOLD
|
Package: - |
Stock7,800 |
|
- |
800 |
DIP, 0.6" (15.24mm) Row Spacing |
40 (2 x 20) |
0.100" (2.54mm) |
Gold |
20µin (0.51µm) |
Copper Alloy |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin-Lead |
- |
Copper Alloy |
Polyester |
-55°C ~ 105°C |
||
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 24POS GOLD
|
Package: - |
Stock8,244 |
|
- |
614 |
DIP, 0.3" (7.62mm) Row Spacing |
24 (2 x 12) |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
||
Harwin Inc. |
CONN IC DIP SOCKET 16POS GOLD
|
Package: - |
Stock13,248 |
|
- |
D0 |
DIP, 0.3" (7.62mm) Row Spacing |
16 (2 x 8) |
0.100" (2.54mm) |
Gold |
10µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Wire Wrap |
0.100" (2.54mm) |
Tin |
196.8µin (5.00µm) |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
-55°C ~ 125°C |
||
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 6POS GOLD
|
Package: - |
Stock15,792 |
|
- |
299 |
DIP, 0.3" (7.62mm) Row Spacing |
6 (2 x 3) |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole, Right Angle, Horizontal |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin-Lead |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
||
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 22POS GOLD
|
Package: - |
Stock9,300 |
|
- |
101 |
DIP, 0.4" (10.16mm) Row Spacing |
22 (2 x 11) |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin-Lead |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 16POS GOLD
|
Package: - |
Stock27,972 |
|
- |
500 |
DIP, 0.3" (7.62mm) Row Spacing |
16 (2 x 8) |
0.100" (2.54mm) |
Gold |
25µin (0.63µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Gold |
25µin (0.63µm) |
Nickel |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
||
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 14POS GOLD
|
Package: - |
Stock7,290 |
|
- |
110 |
DIP, 0.3" (7.62mm) Row Spacing |
14 (2 x 7) |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Surface Mount |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin-Lead |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
||
On Shore Technology Inc. |
CONN IC DIP SOCKET 28POS GOLD
|
Package: - |
Stock13,752 |
|
- |
WMS |
DIP, 0.6" (15.24mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
Open Frame, Wash Away |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
- |
-40°C ~ 105°C |
||
On Shore Technology Inc. |
CONN IC DIP SOCKET 24POS GOLD
|
Package: - |
Stock15,396 |
|
- |
WMS |
DIP, 0.3" (7.62mm) Row Spacing |
24 (2 x 12) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
Open Frame, Wash Away |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
- |
-40°C ~ 105°C |
||
On Shore Technology Inc. |
CONN IC DIP SOCKET 20POS GOLD
|
Package: - |
Stock23,112 |
|
- |
WMS |
DIP, 0.3" (7.62mm) Row Spacing |
20 (2 x 10) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
Open Frame, Wash Away |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
- |
-40°C ~ 105°C |
||
On Shore Technology Inc. |
CONN IC DIP SOCKET 18POS GOLD
|
Package: - |
Stock26,256 |
|
- |
WMS |
DIP, 0.3" (7.62mm) Row Spacing |
18 (2 x 9) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
Open Frame, Wash Away |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass |
- |
-40°C ~ 105°C |
||
TE Connectivity AMP Connectors |
LEFT SIDE LGA3647-1 SOCKET-P1
|
Package: - |
Stock8,514 |
|
- |
- |
LGA |
1823 |
- |
Gold |
30µin (0.76µm) |
Copper Alloy |
Surface Mount |
Open Frame |
Solder |
- |
- |
- |
Copper Alloy |
Liquid Crystal Polymer (LCP) |
- |
||
TE Connectivity AMP Connectors |
RIGHT SIDE LGA3647-1 SOCKET-P1
|
Package: - |
Stock7,524 |
|
- |
- |
LGA |
1823 |
- |
Gold |
30µin (0.76µm) |
Copper Alloy |
Surface Mount |
Open Frame |
Solder |
- |
- |
- |
Copper Alloy |
Liquid Crystal Polymer (LCP) |
- |
||
TE Connectivity AMP Connectors |
LEFT SIDE LGA3647-0 SOCKET- P0
|
Package: - |
Stock7,056 |
|
- |
- |
LGA |
1823 |
- |
Gold |
30µin (0.76µm) |
Copper Alloy |
Surface Mount |
Open Frame |
Solder |
- |
- |
- |
Copper Alloy |
Liquid Crystal Polymer (LCP) |
- |
||
TE Connectivity AMP Connectors |
CONN SOCKET LGA 1366POS GOLD
|
Package: - |
Stock8,874 |
|
- |
- |
LGA |
1366 (32 x 41) |
0.040" (1.01mm) |
Gold |
15µin (0.38µm) |
Copper Alloy |
Surface Mount |
Open Frame |
Solder |
0.040" (1.01mm) |
- |
- |
Copper Alloy |
Thermoplastic |
- |
||
TE Connectivity AMP Connectors |
CONN TRANSIST TO-5 4POS GOLD
|
Package: - |
Stock6,660 |
|
- |
8060 |
Transistor, TO-5 |
4 (Round) |
- |
Gold |
- |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
- |
Gold |
- |
Beryllium Copper |
Fluoropolymer (FP) |
-55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN SOCKET LGA 771POS GOLD
|
Package: - |
Stock7,116 |
|
- |
- |
LGA |
771 (33 x 33) |
0.043" (1.09mm) |
Gold |
- |
Copper Alloy |
Surface Mount |
Open Frame |
Solder |
0.043" (1.09mm) |
- |
- |
- |
Thermoplastic |
-25°C ~ 100°C |
||
Mill-Max Manufacturing Corp. |
STANDRD SOLDER TAIL SIP SOCKET
|
Package: - |
Stock8,532 |
|
- |
316 |
SIP |
64 (1 x 64) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
- |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
||
Mill-Max Manufacturing Corp. |
STANDRD SOLDER TAIL SIP SOCKET
|
Package: - |
Stock6,492 |
|
- |
316 |
SIP |
64 (1 x 64) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
- |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
||
Mill-Max Manufacturing Corp. |
STANDRD SOLDER TAIL SIP SOCKET
|
Package: - |
Stock7,752 |
|
- |
316 |
SIP |
64 (1 x 64) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
- |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
||
Keystone Electronics |
CONN TRANSIST TO-3 3POS TIN
|
Package: - |
Stock6,228 |
|
- |
- |
Transistor, TO-3 |
3 (Oval) |
- |
Tin |
- |
Brass |
Chassis Mount |
Closed Frame |
Solder |
- |
Tin |
- |
Brass |
Polybutylene Terephthalate (PBT) |
- |
||
Keystone Electronics |
CONN TRANSIST TO-3 3POS TIN
|
Package: - |
Stock6,732 |
|
- |
- |
Transistor, TO-3 |
3 (Oval) |
- |
Tin |
- |
Brass |
Chassis Mount |
Closed Frame |
Solder |
- |
Tin |
- |
Brass |
Polybutylene Terephthalate (PBT) |
- |
||
Mill-Max Manufacturing Corp. |
STANDRD SOLDER TAIL SIP SOCKET
|
Package: - |
Stock8,928 |
|
- |
311 |
SIP |
64 (1 x 64) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
- |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
||
Keystone Electronics |
CONN TRANSIST TO-3 3POS TIN
|
Package: - |
Stock30,252 |
|
- |
- |
Transistor, TO-3 |
3 (Oval) |
- |
Tin |
- |
Brass |
Chassis Mount |
Closed Frame |
Solder |
- |
Tin |
- |
Brass |
Polybutylene Terephthalate (PBT) |
- |
||
Keystone Electronics |
CONN TRANSIST TO-3 3POS TIN
|
Package: - |
Stock10,632 |
|
- |
- |
Transistor, TO-3 |
3 (Oval) |
- |
Tin |
- |
Brass |
Chassis Mount |
Closed Frame |
Solder |
- |
Tin |
- |
Brass |
Polybutylene Terephthalate (PBT) |
- |
||
Samtec Inc. |
DIP SOCKETS
|
Package: - |
Stock13,200 |
|
- |
* |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
||
Mill-Max Manufacturing Corp. |
STANDRD SOLDER TAIL SIP SOCKET
|
Package: - |
Stock6,888 |
|
- |
315 |
SIP |
64 (1 x 64) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
- |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
||
Mill-Max Manufacturing Corp. |
STANDRD SOLDER TAIL SIP SOCKET
|
Package: - |
Stock7,164 |
|
- |
315 |
SIP |
64 (1 x 64) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
- |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
||
Keystone Electronics |
CONN TRANSIST TO-5 8POS TIN
|
Package: - |
Stock8,568 |
|
- |
- |
Transistor, TO-5 |
8 (Round) |
- |
Tin |
- |
Brass |
Chassis Mount |
Closed Frame |
Solder |
- |
Tin |
- |
Brass |
Polyester, Glass Filled |
- |
||
Mill-Max Manufacturing Corp. |
STANDRD SOLDER TAIL SIP SOCKET
|
Package: - |
Stock7,860 |
|
- |
310 |
SIP |
64 (1 x 64) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
- |
Solder |
0.100" (2.54mm) |
Tin |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |