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Sockets for ICs, Transistors

Records 11083
Page  347/370
Image
Part Number
Manufacturer
Description
Package
Stock
Quantity
Package
Series
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
3M
CONN IC DIP SOCKET ZIF 28POS GLD
Package: -
Stock6,900
-
Textool?
DIP, ZIF (ZIP), 0.4" (10.16mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN IC DIP SOCKET ZIF 32POS GLD
Package: -
Stock8,496
-
Textool?
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN IC DIP SOCKET ZIF 22POS GLD
Package: -
Stock8,532
-
Textool?
DIP, ZIF (ZIP), 0.4" (10.16mm) Row Spacing
22 (2 x 11)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
Aries Electronics
CONN IC DIP SOCKET ZIF 32POS GLD
Package: -
Stock6,732
-
55
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Gold
-
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
-
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
-
Sullins Connector Solutions
CONN TRANSIST TO-220/TO-247 5POS
Package: -
Stock6,624
-
-
Transistor, TO-220 and TO-247
5 (Rectangular)
-
Gold
30µin (0.76µm)
Nickel Boron
Through Hole, Right Angle
-
Solder
-
Gold
30µin (0.76µm)
Nickel Boron
Polyphenylene Sulfide (PPS)
-65°C ~ 200°C
Sullins Connector Solutions
CONN TRANSIST TO-220/TO-247 5POS
Package: -
Stock8,334
-
-
Transistor, TO-220 and TO-247
5 (Rectangular)
-
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
-
Solder
-
Gold
30µin (0.76µm)
Beryllium Copper
Polyphenylene Sulfide (PPS)
-65°C ~ 175°C
Aries Electronics
CONN IC DIP SOCKET ZIF 24POS TIN
Package: -
Stock6,498
-
55
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
-
Sullins Connector Solutions
CONN SOCKET TRANSIST 3POS GOLD
Package: -
Stock6,240
-
-
Transistor
3 (Rectangular)
-
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Board Guide, Flange
Solder
-
Gold
30µin (0.76µm)
Beryllium Copper
Polyphenylene Sulfide (PPS)
-55°C ~ 175°C
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 20POS GOLD
Package: -
Stock5,112
-
299
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole, Right Angle, Horizontal
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
Mill-Max Manufacturing Corp.
CONN SOCKET TRANSIST TO100 10POS
Package: -
Stock17,244
-
917
Transistor, TO-100
10 (Round)
-
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
-
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
Aries Electronics
CONN IC DIP SOCKET 28POS GOLD
Package: -
Stock17,640
-
518
DIP, 0.3" (7.62mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 18POS GOLD
Package: -
Stock19,224
-
110
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 48POS TIN
Package: -
Stock18,696
-
110
DIP, 0.6" (15.24mm) Row Spacing
48 (2 x 24)
0.100" (2.54mm)
Tin
100µin (2.54µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 24POS GOLD
Package: -
Stock23,136
-
210
DIP, 0.3" (7.62mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 20POS GOLD
Package: -
Stock20,208
-
111
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
Keystone Electronics
CONN TRANSIST TO-3 3POS TIN
Package: -
Stock15,360
-
-
Transistor, TO-3
3 (Oval)
-
Tin
-
Brass
Chassis Mount
Closed Frame
Solder
-
Tin
-
Brass
Polyester, Glass Filled
-
Mill-Max Manufacturing Corp.
CONN SOCKET TRANSIST TO-100 8POS
Package: -
Stock7,344
-
917
Transistor, TO-100
8 (Round)
-
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
-
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
Assmann WSW Components
CONN IC DIP SOCKET 14POS GOLD
Package: -
Stock20,208
-
-
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
-
Beryllium Copper
Through Hole
Open Frame
Wire Wrap
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Thermoplastic, Polyester
-40°C ~ 105°C
3M
CONN SOCKET PLCC 84POS TIN
Package: -
Stock21,432
-
8400
PLCC
84 (4 x 21)
0.050" (1.27mm)
Tin
160µin (4.06µm)
Copper Alloy
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
160µin (4.06µm)
Copper Alloy
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 24POS GOLD
Package: -
Stock15,780
-
110
DIP, 0.3" (7.62mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 24POS GOLD
Package: -
Stock15,720
-
110
DIP, 0.3" (7.62mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 40POS TINLEAD
Package: -
Stock14,112
-
110
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Tin-Lead
200µin (5.08µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
Keystone Electronics
CONN TRANSIST TO-3 3POS TIN
Package: -
Stock7,536
-
-
Transistor, TO-3
3 (Oval)
-
Tin
-
Brass
Chassis Mount
Closed Frame
Solder
-
Tin
-
Brass
Polyester, Glass Filled
-
Omron Electronics Inc-EMC Div
CONN IC DIP SOCKET 14POS GOLD
Package: -
Stock14,460
-
XR2
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 16POS GOLD
Package: -
Stock20,076
-
115
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
Harwin Inc.
CONN IC DIP SOCKET 28POS GOLD
Package: -
Stock6,624
-
D2
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
196.8µin (5.00µm)
Brass
Plastic
-55°C ~ 125°C
On Shore Technology Inc.
CONN IC DIP SOCKET 8POS GOLD
Package: -
Stock16,272
-
BU-178HT
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
78.7µin (2.00µm)
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Copper
Flash
Brass
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Mill-Max Manufacturing Corp.
CONN TRANSIST TO-5 8POS GOLD
Package: -
Stock16,188
-
917
Transistor, TO-5
8 (Round)
-
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
-
Tin-Lead
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
Mill-Max Manufacturing Corp.
CONN SOCKET PLCC 68POS TIN
Package: -
Stock19,176
-
940
PLCC
68 (4 x 17)
0.050" (1.27mm)
Tin
150µin (3.81µm)
Beryllium Copper
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
Preci-Dip
CONN IC DIP SOCKET 40POS GOLD
Package: -
Stock14,412
-
110
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C