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Sockets for ICs, Transistors

Records 11083
Page  346/370
Image
Part Number
Manufacturer
Description
Package
Stock
Quantity
Package
Series
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 14POS GOLD
Package: -
Stock7,860
-
210
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin-Lead
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
Aries Electronics
CONN IC DIP SOCKET 6POS GOLD
Package: -
Stock16,044
-
Lo-PRO?file, 513
DIP, 0.3" (7.62mm) Row Spacing
6 (2 x 3)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 16POS GOLD
Package: -
Stock8,136
-
110
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
Harwin Inc.
CONN IC DIP SOCKET 8POS GOLD
Package: -
Stock10,320
-
D0
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Wire Wrap
0.100" (2.54mm)
Tin
196.8µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
Assmann WSW Components
CONN IC DIP SOCKET 14POS GOLD
Package: -
Stock19,212
-
-
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Thermoplastic, Polyester
-40°C ~ 105°C
Assmann WSW Components
CONN IC DIP SOCKET 18POS GOLD
Package: -
Stock13,080
-
-
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Gold
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Thermoplastic, Polyester
-40°C ~ 105°C
On Shore Technology Inc.
CONN IC DIP SOCKET 28POS GOLD
Package: -
Stock7,128
-
SA
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
80µin (2.03µm)
Brass
Thermoplastic, Polyester, Glass Filled
-40°C ~ 105°C
CNC Tech
CONN SOCKET PLCC 32POS GOLD
Package: -
Stock7,908
-
-
PLCC
32 (4 x 8)
0.050" (1.27mm)
Gold
-
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Gold
-
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
Aries Electronics
CONN SOCKET SIP 6POS GOLD
Package: -
Stock8,010
-
518
SIP
6 (1 x 6)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
Assmann WSW Components
CONN IC DIP SOCKET 6POS GOLD
Package: -
Stock8,112
-
-
DIP, 0.3" (7.62mm) Row Spacing
6 (2 x 3)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Thermoplastic, Polyester
-40°C ~ 105°C
3M
CONN IC DIP SOCKET 48POS TIN
Package: -
Stock17,256
-
4800
DIP, 0.6" (15.24mm) Row Spacing
48 (2 x 24)
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Polyester, Glass Filled
-25°C ~ 85°C
Aries Electronics
CONN SOCKET SIP 6POS GOLD
Package: -
Stock5,220
-
518
SIP
6 (1 x 6)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
Harwin Inc.
CONN IC DIP SOCKET 8POS GOLD
Package: -
Stock16,008
-
D2
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
196.8µin (5.00µm)
Brass
Plastic
-55°C ~ 125°C
On Shore Technology Inc.
CONN PLCC SOCKET 20POS T/H
Package: -
Stock8,832
-
ED
PLCC
20 (2 x 10)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Polybutylene Terephthalate (PBT)
-55°C ~ 105°C
Assmann WSW Components
IC SOCKET PLCC 20POS TIN
Package: -
Stock9,096
-
-
PLCC
20 (4 x 5)
0.050" (1.27mm)
Tin
160µin (4.06µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
160µin (4.06µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT)
-40°C ~ 105°C
Assmann WSW Components
CONN SOCKET PLCC 28POS TIN
Package: -
Stock18,468
-
-
PLCC
28 (4 x 7)
0.050" (1.27mm)
Tin
160µin (4.06µm)
Phosphor Bronze
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
160µin (4.06µm)
Phosphor Bronze
Polyamide (PA9T), Nylon 9T, Glass Filled
-40°C ~ 105°C
On Shore Technology Inc.
CONN SOCKET PLCC 28POS SMD
Package: -
Stock6,096
-
ED
PLCC
28 (2 x 14)
0.050" (1.27mm)
-
-
Phosphor Bronze
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
-
-
Phosphor Bronze
Polyphenylene Sulfide (PPS)
-55°C ~ 105°C
Assmann WSW Components
CONN IC DIP SOCKET 32POS TIN
Package: -
Stock13,104
-
-
DIP, 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Polybutylene Terephthalate (PBT)
-55°C ~ 85°C
CNC Tech
CONN SOCKET PLCC 32POS TIN
Package: -
Stock15,192
-
-
PLCC
32 (4 x 8)
0.050" (1.27mm)
Tin
-
Phosphor Bronze
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
-
Phosphor Bronze
Polyphenylene Sulfide (PPS)
-55°C ~ 105°C
CNC Tech
CONN IC DIP SOCKET 40POS TIN
Package: -
Stock9,096
-
-
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Tin
100µin (2.54µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
100µin (2.54µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
Assmann WSW Components
CONN IC DIP SOCKET 24POS TIN
Package: -
Stock10,068
-
-
DIP, 0.6" (15.24mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Polybutylene Terephthalate (PBT)
-55°C ~ 85°C
CNC Tech
CONN IC DIP SOCKET 14POS TIN
Package: -
Stock19,344
-
-
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
3M
CONN SOCKET QFN 80POS GOLD
Package: -
Stock6,480
-
Textool?
QFN
80 (4 x 20)
0.020" (0.50mm)
Gold
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.020" (0.50mm)
Gold
-
Beryllium Copper
Polyethersulfone (PES)
-
3M
CONN SOCKET QFN 56POS GOLD
Package: -
Stock8,262
-
Textool?
QFN
56 (4 x 14)
0.016" (0.40mm)
Gold
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.016" (0.40mm)
Gold
-
Beryllium Copper
Polyethersulfone (PES)
-
TE Connectivity AMP Connectors
LGA3647-0 SOCKET P0 KIT FOR ODM
Package: -
Stock6,822
-
-
LGA
3647
-
Gold
30µin (0.76µm)
Copper Alloy
Surface Mount
Open Frame
Solder
-
-
-
Copper Alloy
Liquid Crystal Polymer (LCP)
-
3M
CONN SOCKET PGA ZIF 289POS GOLD
Package: -
Stock6,462
-
Textool?
PGA, ZIF (ZIP)
289 (17 x 17)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polyethersulfone (PES)
-55°C ~ 150°C
3M
CONN SOCKET SIP ZIF 32POS GOLD
Package: -
Stock4,572
-
Textool?
SIP, ZIF (ZIP)
32 (1 x 32)
0.100" (2.54mm)
Gold
-
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN IC DIP SOCKET ZIF 64POS GLD
Package: -
Stock6,408
-
Textool?
DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing
64 (2 x 32)
0.070" (1.78mm)
Gold
30µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.070" (1.78mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN IC DIP SOCKET ZIF 28POS GLD
Package: -
Stock6,348
-
Textool?
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN IC DIP SOCKET ZIF 24POS GLD
Package: -
Stock7,110
-
Textool?
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C