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Sockets for ICs, Transistors

Records 11083
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Image
Part Number
Manufacturer
Description
Package
Stock
Quantity
Package
Series
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 8POS GOLD
Package: -
Stock7,932
-
614
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 18POS TINLEAD
Package: -
Stock16,968
-
214
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Tin-Lead
100µin (2.54µm)
Beryllium Copper
Surface Mount
Closed Frame
Solder
0.100" (2.54mm)
Tin-Lead
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 8POS GOLD
Package: -
Stock15,936
-
110
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4), 4 Loaded
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 24POS TINLEAD
Package: -
Stock7,308
-
110
DIP, 0.4" (10.16mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Tin-Lead
200µin (5.08µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
Preci-Dip
CONN IC DIP SOCKET 10POS GOLD
Package: -
Stock17,496
-
116
DIP, 0.6" (15.24mm) Row Spacing
10 (2 x 5)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
Aries Electronics
CONN IC DIP SOCKET 8POS GOLD
Package: -
Stock6,924
-
518
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
Preci-Dip
CONN IC DIP SOCKET 10POS GOLD
Package: -
Stock8,196
-
116
DIP, 0.2" (5.08mm) Row Spacing
10 (2 x 5)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
Aries Electronics
CONN SOCKET SOIC ZIF 44POS GOLD
Package: -
Stock7,506
-
547
SOIC, ZIF (ZIP)
44 (2 x 22)
-
Gold
20µin (0.51µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Gold
20µin (0.51µm)
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
-
Aries Electronics
CONN SOCKET SOIC ZIF 44POS GOLD
Package: -
Stock4,590
-
547
SOIC, ZIF (ZIP)
44 (2 x 22)
-
Gold
20µin (0.51µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Gold
20µin (0.51µm)
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
-
3M
CONN ZIG-ZAG ZIF 51POS GOLD
Package: -
Stock7,776
-
Textool?
Zig-Zag, ZIF (ZIP)
51 (1 x 25, 1 x 26)
0.050" (1.27mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN ZIG-ZAG ZIF 51POS GOLD
Package: -
Stock7,416
-
Textool?
Zig-Zag, ZIF (ZIP)
51 (1 x 25, 1 x 26)
0.050" (1.27mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN SOCKET PGA ZIF 361POS GOLD
Package: -
Stock6,570
-
Textool?
PGA, ZIF (ZIP)
361 (19 x 19)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polyethersulfone (PES)
-55°C ~ 150°C
3M
CONN SOCKET SIP ZIF 36POS GOLD
Package: -
Stock8,064
-
Textool?
SIP, ZIF (ZIP)
36 (1 x 36)
0.100" (2.54mm)
Gold
-
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 28POS GOLD
Package: -
Stock5,364
-
110
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
3M
CONN IC DIP SOCKET ZIF 56POS GLD
Package: -
Stock5,778
-
Textool?
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
56 (2 x 28)
0.070" (1.78mm)
Gold
30µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN SOCKET SOIC 24POS GOLD
Package: -
Stock5,886
-
Textool?
SOIC
24 (2 x 12)
-
Gold
-
Beryllium Copper
Through Hole
Closed Frame
Solder
-
Gold
30µin (0.76µm)
Beryllium Copper
Polyethersulfone (PES), Glass Filled
-55°C ~ 150°C
3M
CONN SOCKET SOIC 20POS GOLD
Package: -
Stock6,108
-
Textool?
SOIC
20 (2 x 10)
-
Gold
-
Beryllium Copper
Through Hole
Closed Frame
Solder
-
Gold
30µin (0.76µm)
Beryllium Copper
Polyethersulfone (PES), Glass Filled
-55°C ~ 150°C
3M
CONN IC DIP SOCKET ZIF 40POS GLD
Package: -
Stock3,906
-
Textool?
DIP, ZIF (ZIP), 1.0" (25.40mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN IC DIP SOCKET ZIF 42POS GLD
Package: -
Stock4,626
-
Textool?
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
42 (2 x 21)
0.070" (1.78mm)
Gold
30µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN IC DIP SOCKET ZIF 28POS GLD
Package: -
Stock6,660
-
Textool?
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.070" (1.78mm)
Gold
30µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
Aries Electronics
CONN IC DIP SOCKET ZIF 40POS TIN
Package: -
Stock8,658
-
57
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
-
Apex Microtechnology
CONN SOCKET SIP 20POS GOLD
Package: -
Stock6,204
-
Apex Precision Power?
SIP
20 (1 x 20)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyester, Glass Filled
-
Sullins Connector Solutions
CONN TRANSIST TO-220/TO-247 5POS
Package: -
Stock5,004
-
-
Transistor, TO-220 and TO-247
5 (Rectangular)
-
Gold
30µin (0.76µm)
Nickel Boron
Through Hole
-
Solder
-
Gold
30µin (0.76µm)
Nickel Boron
Polyphenylene Sulfide (PPS)
-65°C ~ 200°C
Aries Electronics
CONN SOCKET PGA GOLD
Package: -
Stock8,946
-
PGM
PGA
-
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
Sullins Connector Solutions
CONN TRANSIST TO-262 3POS GOLD
Package: -
Stock6,480
-
-
Transistor, TO-262
3 (Rectangular)
0.150" (3.81mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
-
Solder
0.150" (3.81mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polyphenylene Sulfide (PPS)
-50°C ~ 175°C
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 40POS GOLD
Package: -
Stock8,892
-
110
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame, Decoupling Capacitor
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 64POS GOLD
Package: -
Stock6,498
-
117
DIP, 0.75" (19.05mm) Row Spacing
64 (2 x 32)
0.070" (1.78mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.070" (1.78mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
Aries Electronics
CONN IC DIP SOCKET 40POS GOLD
Package: -
Stock5,292
-
Lo-PRO?file, 513
DIP, 0.9" (22.86mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
Aries Electronics
CONN IC DIP SOCKET 14POS TIN
Package: -
Stock4,788
-
Vertisockets? 800
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Tin
200µin (5.08µm)
Phosphor Bronze
Through Hole, Right Angle, Vertical
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6
-
Aries Electronics
CONN IC DIP SOCKET 8POS GOLD
Package: -
Stock7,434
-
Vertisockets? 800
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Phosphor Bronze
Through Hole, Right Angle, Vertical
Closed Frame
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6
-