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Sockets for ICs, Transistors

Records 2819
Page  5/94
Image
Part Number
Manufacturer
Description
Package
Stock
Quantity
Package
Series
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
Preci-Dip
BGA PIN ADAPTER 1.27MM SMD
Package: -
Stock3,870
-
550
BGA
480 (29 x 29)
0.050" (1.27mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
CONN SOCKET BGA 478POS GOLD
Package: -
Stock6,804
-
514
BGA
478 (26 x 26)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
Preci-Dip
CONN SOCKET BGA 388POS GOLD
Package: -
Stock8,694
-
514
BGA
388 (26 x 26)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
Preci-Dip
BGA PIN ADAPTER 1.27MM SMD
Package: -
Stock3,276
-
550
BGA
478 (26 x 26)
0.050" (1.27mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
CONN SOCKET PGA 292POS GOLD
Package: -
Stock7,902
-
518
PGA
292 (20 x 20)
0.050" (1.27mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.050" (1.27mm)
Gold
Flash
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
BGA SURFACE MOUNT 1.27MM
Package: -
Stock3,258
-
558
BGA
292 (20 x 20)
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
CONN SOCKET BGA 456POS GOLD
Package: -
Stock7,938
-
514
BGA
456 (26 x 26)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
Preci-Dip
BGA PIN ADAPTER 1.27MM SMD
Package: -
Stock3,114
-
550
BGA
456 (26 x 26)
0.050" (1.27mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
CONN SOCKET PGA 272POS GOLD
Package: -
Stock4,968
-
518
PGA
272 (20 x 20)
0.050" (1.27mm)
Gold
Flash
Beryllium Copper
Surface Mount
Open Frame
Solder
0.050" (1.27mm)
Gold
Flash
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
CONN SOCKET BGA 360POS GOLD
Package: -
Stock4,086
-
514
BGA
360 (19 x 19)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
Preci-Dip
PGA SOLDER TAIL 1.27MM
Package: -
Stock3,348
-
558
PGA
292 (20 x 20)
0.050" (1.27mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
CONN SOCKET BGA 357POS GOLD
Package: -
Stock7,686
-
514
BGA
357 (19 x 19)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
Preci-Dip
CONN SOCKET PGA 272POS GOLD
Package: -
Stock5,346
-
518
PGA
272 (20 x 20)
0.050" (1.27mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.050" (1.27mm)
Gold
Flash
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
CONN SOCKET BGA 356POS GOLD
Package: -
Stock2,088
-
514
BGA
356 (26 x 26)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
Preci-Dip
BGA SURFACE MOUNT 1.27MM
Package: -
Stock5,436
-
558
BGA
272 (20 x 20)
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
CONN SOCKET BGA 352POS GOLD
Package: -
Stock8,586
-
514
BGA
352 (26 x 26)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
Preci-Dip
CONN SOCKET BGA 432POS GOLD
Package: -
Stock4,752
-
514
BGA
432 (31 x 31)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
Preci-Dip
BGA PIN ADAPTER 1.27MM SMD
Package: -
Stock5,256
-
550
BGA
432 (31 x 31)
0.050" (1.27mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
CONN SOCKET PGA 256POS GOLD
Package: -
Stock8,352
-
518
PGA
256 (20 x 20)
0.050" (1.27mm)
Gold
Flash
Beryllium Copper
Surface Mount
Open Frame
Solder
0.050" (1.27mm)
Gold
Flash
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
CONN SOCKET PGA 256POS GOLD
Package: -
Stock8,406
-
518
PGA
256 (16 x 16)
0.050" (1.27mm)
Gold
Flash
Beryllium Copper
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Gold
Flash
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
CONN SOCKET BGA 420POS GOLD
Package: -
Stock7,326
-
514
BGA
420 (26 x 26)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
Preci-Dip
CONN SOCKET PGA 255POS GOLD
Package: -
Stock2,214
-
518
PGA
255 (16 x 16)
0.050" (1.27mm)
Gold
Flash
Beryllium Copper
Surface Mount
Open Frame
Solder
0.050" (1.27mm)
Gold
Flash
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
BGA PIN ADAPTER 1.27MM SMD
Package: -
Stock3,544
-
550
BGA
420 (26 x 26)
0.050" (1.27mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
BGA SOLDER TAIL
Package: -
Stock2,880
-
550
BGA
292 (20 x 20)
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
CONN SOCKET PGA 256POS GOLD
Package: -
Stock3,544
-
518
PGA
256 (20 x 20)
0.050" (1.27mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.050" (1.27mm)
Gold
Flash
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
CONN SOCKET PGA 256POS GOLD
Package: -
Stock8,874
-
518
PGA
256 (16 x 16)
0.050" (1.27mm)
Gold
Flash
Beryllium Copper
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Gold
Flash
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
PGA SOLDER TAIL 1.27MM
Package: -
Stock3,024
-
558
PGA
272 (20 x 20)
0.050" (1.27mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
CONN SOCKET PGA 255POS GOLD
Package: -
Stock6,912
-
518
PGA
255 (16 x 16)
0.050" (1.27mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.050" (1.27mm)
Gold
Flash
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
BGA SURFACE MOUNT 1.27MM
Package: -
Stock2,610
-
558
BGA
256 (16 x 16)
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
BGA SURFACE MOUNT 1.27MM
Package: -
Stock6,714
-
558
BGA
256 (20 x 20)
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
FR4 Epoxy Glass
-55°C ~ 125°C