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Sockets for ICs, Transistors

Records 2819
Page  2/94
Image
Part Number
Manufacturer
Description
Package
Stock
Quantity
Package
Series
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
Preci-Dip
PGA SOLDER TAIL 1.27MM
Package: -
Stock6,390
-
558
PGA
504 (29 x 29)
0.050" (1.27mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
CONN SOCKET PGA 520POS GOLD
Package: -
Stock7,434
-
518
PGA
520 (31 x 31)
0.050" (1.27mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.050" (1.27mm)
Gold
Flash
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
BGA SURFACE MOUNT 1.27MM
Package: -
Stock4,860
-
558
BGA
520 (31 x 31)
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
PGA SOLDER TAIL 1.27MM
Package: -
Stock8,748
-
558
PGA
500 (30 x 30)
0.050" (1.27mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
CONN SOCKET PGA 504POS GOLD
Package: -
Stock8,964
-
518
PGA
504 (29 x 29)
0.050" (1.27mm)
Gold
Flash
Beryllium Copper
Surface Mount
Open Frame
Solder
0.050" (1.27mm)
Gold
Flash
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
CONN SOCKET PGA 456POS GOLD
Package: -
Stock7,866
-
518
PGA
456 (26 x 26)
0.050" (1.27mm)
Gold
Flash
Beryllium Copper
Surface Mount
Open Frame
Solder
0.050" (1.27mm)
Gold
Flash
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
BGA SOLDER TAIL
Package: -
Stock6,678
-
550
BGA
576 (30 x 30)
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
CONN SOCKET PGA 500POS GOLD
Package: -
Stock3,852
-
518
PGA
500 (30 x 30)
0.050" (1.27mm)
Gold
Flash
Beryllium Copper
Surface Mount
Open Frame
Solder
0.050" (1.27mm)
Gold
Flash
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
BGA SOLDER TAIL
Package: -
Stock3,042
-
550
BGA
520 (31 x 31)
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
CONN SOCKET BGA 600POS GOLD
Package: -
Stock2,682
-
514
BGA
600 (35 x 35)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
Preci-Dip
CONN SOCKET PGA 504POS GOLD
Package: -
Stock7,722
-
518
PGA
504 (29 x 29)
0.050" (1.27mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.050" (1.27mm)
Gold
Flash
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
CONN SOCKET PGA 456POS GOLD
Package: -
Stock3,114
-
518
PGA
456 (26 x 26)
0.050" (1.27mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.050" (1.27mm)
Gold
Flash
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
BGA SURFACE MOUNT 1.27MM
Package: -
Stock7,362
-
558
BGA
504 (29 x 29)
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
BGA SURFACE MOUNT 1.27MM
Package: -
Stock4,878
-
558
BGA
456 (26 x 26)
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
CONN SOCKET PGA 500POS GOLD
Package: -
Stock7,668
-
518
PGA
500 (30 x 30)
0.050" (1.27mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.050" (1.27mm)
Gold
Flash
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
PGA SOLDER TAIL 1.27MM
Package: -
Stock6,678
-
558
PGA
480 (29 x 29)
0.050" (1.27mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
PGA SOLDER TAIL 1.27MM
Package: -
Stock4,716
-
558
PGA
478 (26 x 26)
0.050" (1.27mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
BGA SOLDER TAIL
Package: -
Stock3,834
-
550
BGA
504 (29 x 29)
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
BGA SOLDER TAIL
Package: -
Stock3,708
-
550
BGA
500 (30 x 30)
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
CONN SOCKET PGA 432POS GOLD
Package: -
Stock8,100
-
518
PGA
432 (31 x 31)
0.050" (1.27mm)
Gold
Flash
Beryllium Copper
Surface Mount
Open Frame
Solder
0.050" (1.27mm)
Gold
Flash
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
CONN SOCKET BGA 576POS GOLD
Package: -
Stock7,308
-
514
BGA
576 (30 x 30)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
Preci-Dip
CONN SOCKET PGA 432POS GOLD
Package: -
Stock3,888
-
518
PGA
432 (31 x 31)
0.050" (1.27mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.050" (1.27mm)
Gold
Flash
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
BGA SURFACE MOUNT 1.27MM
Package: -
Stock4,932
-
558
BGA
432 (31 x 31)
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
CONN SOCKET PGA 420POS GOLD
Package: -
Stock2,898
-
518
PGA
420 (26 x 26)
0.050" (1.27mm)
Gold
Flash
Beryllium Copper
Surface Mount
Open Frame
Solder
0.050" (1.27mm)
Gold
Flash
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
PGA SOLDER TAIL 1.27MM
Package: -
Stock8,946
-
558
PGA
456 (26 x 26)
0.050" (1.27mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
CONN SOCKET BGA 560POS GOLD
Package: -
Stock2,142
-
514
BGA
560 (33 x 33)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
Preci-Dip
BGA SOLDER TAIL
Package: -
Stock8,838
-
550
BGA
480 (29 x 29)
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
BGA SOLDER TAIL
Package: -
Stock7,326
-
550
BGA
478 (26 x 26)
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
Through Hole
Open Frame
Solder
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
CONN SOCKET PGA 420POS GOLD
Package: -
Stock3,672
-
518
PGA
420 (26 x 26)
0.050" (1.27mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.050" (1.27mm)
Gold
Flash
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
BGA SURFACE MOUNT 1.27MM
Package: -
Stock6,822
-
558
BGA
420 (26 x 26)
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
FR4 Epoxy Glass
-55°C ~ 125°C