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Sockets for ICs, Transistors

Records 2819
Page  3/94
Image
Part Number
Manufacturer
Description
Package
Stock
Quantity
Package
Series
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
Preci-Dip
CONN SOCKET PGA 400POS GOLD
Package: -
Stock7,974
-
518
PGA
400 (20 x 20)
0.050" (1.27mm)
Gold
Flash
Beryllium Copper
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Gold
Flash
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
PGA SOLDER TAIL 1.27MM
Package: -
Stock4,338
-
558
PGA
432 (31 x 31)
0.050" (1.27mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
BGA SOLDER TAIL
Package: -
Stock6,408
-
550
BGA
456 (26 x 26)
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
CONN SOCKET BGA 652POS GOLD
Package: -
Stock7,416
-
514
BGA
652 (35 x 35)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
Preci-Dip
BGA PIN ADAPTER 1.27MM SMD
Package: -
Stock7,776
-
550
BGA
652 (35 x 35)
0.050" (1.27mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
CONN SOCKET PGA 400POS GOLD
Package: -
Stock4,608
-
518
PGA
400 (20 x 20)
0.050" (1.27mm)
Gold
Flash
Beryllium Copper
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Gold
Flash
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
BGA SURFACE MOUNT 1.27MM
Package: -
Stock3,508
-
558
BGA
400 (20 x 20)
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
CONN SOCKET BGA 520POS GOLD
Package: -
Stock6,084
-
514
BGA
520 (31 x 31)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
Preci-Dip
CONN SOCKET PGA 388POS GOLD
Package: -
Stock8,676
-
518
PGA
388 (26 x 26)
0.050" (1.27mm)
Gold
Flash
Beryllium Copper
Surface Mount
Open Frame
Solder
0.050" (1.27mm)
Gold
Flash
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
PGA SOLDER TAIL 1.27MM
Package: -
Stock5,742
-
558
PGA
420 (26 x 26)
0.050" (1.27mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
CONN SOCKET PGA 388POS GOLD
Package: -
Stock6,228
-
518
PGA
388 (26 x 26)
0.050" (1.27mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.050" (1.27mm)
Gold
Flash
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
BGA SURFACE MOUNT 1.27MM
Package: -
Stock5,634
-
558
BGA
388 (26 x 26)
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
CONN SOCKET BGA 504POS GOLD
Package: -
Stock7,938
-
514
BGA
504 (29 x 29)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
Preci-Dip
BGA SOLDER TAIL
Package: -
Stock6,246
-
550
BGA
432 (31 x 31)
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
CONN SOCKET BGA 500POS GOLD
Package: -
Stock3,960
-
514
BGA
500 (30 x 30)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
Preci-Dip
PGA SOLDER TAIL 1.27MM
Package: -
Stock6,786
-
558
PGA
400 (20 x 20)
0.050" (1.27mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
BGA SOLDER TAIL
Package: -
Stock6,228
-
550
BGA
420 (26 x 26)
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
CONN SOCKET BGA 600POS GOLD
Package: -
Stock3,672
-
514
BGA
600 (35 x 35)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
Preci-Dip
BGA PIN ADAPTER 1.27MM SMD
Package: -
Stock4,932
-
550
BGA
600 (35 x 35)
0.050" (1.27mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
CONN SOCKET PGA 360POS GOLD
Package: -
Stock5,202
-
518
PGA
360 (19 x 19)
0.050" (1.27mm)
Gold
Flash
Beryllium Copper
Surface Mount
Open Frame
Solder
0.050" (1.27mm)
Gold
Flash
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
CONN SOCKET BGA 480POS GOLD
Package: -
Stock6,480
-
514
BGA
480 (29 x 29)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
Preci-Dip
CONN SOCKET BGA 478POS GOLD
Package: -
Stock2,790
-
514
BGA
478 (26 x 26)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
Preci-Dip
PGA SOLDER TAIL 1.27MM
Package: -
Stock8,910
-
558
PGA
388 (26 x 26)
0.050" (1.27mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
CONN SOCKET PGA 357POS GOLD
Package: -
Stock6,984
-
518
PGA
357 (19 x 19)
0.050" (1.27mm)
Gold
Flash
Beryllium Copper
Surface Mount
Open Frame
Solder
0.050" (1.27mm)
Gold
Flash
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
CONN SOCKET PGA 356POS GOLD
Package: -
Stock3,852
-
518
PGA
356 (26 x 26)
0.050" (1.27mm)
Gold
Flash
Beryllium Copper
Surface Mount
Open Frame
Solder
0.050" (1.27mm)
Gold
Flash
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
CONN SOCKET PGA 360POS GOLD
Package: -
Stock2,160
-
518
PGA
360 (19 x 19)
0.050" (1.27mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.050" (1.27mm)
Gold
Flash
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
CONN SOCKET PGA 352POS GOLD
Package: -
Stock5,760
-
518
PGA
352 (26 x 26)
0.050" (1.27mm)
Gold
Flash
Beryllium Copper
Surface Mount
Open Frame
Solder
0.050" (1.27mm)
Gold
Flash
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
BGA SURFACE MOUNT 1.27MM
Package: -
Stock4,752
-
558
BGA
360 (19 x 19)
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Gold
10µin (0.25µm)
Brass
FR4 Epoxy Glass
-55°C ~ 125°C
Preci-Dip
CONN SOCKET BGA 576POS GOLD
Package: -
Stock8,676
-
514
BGA
576 (30 x 30)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
Preci-Dip
CONN SOCKET PGA 357POS GOLD
Package: -
Stock2,100
-
518
PGA
357 (19 x 19)
0.050" (1.27mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.050" (1.27mm)
Gold
Flash
Brass
FR4 Epoxy Glass
-55°C ~ 125°C