SalesDept@topcomponents.cc +8613427370519
Login / Registro
Language Translation

* Please refer to the English Version as our Official Version.

Solicitação de cotação

Sockets for ICs, Transistors

Records 234
Page  6/8
Image
Part Number
Manufacturer
Description
Package
Stock
Quantity
Package
Series
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
3M
CONN SOCKET PGA ZIF 289POS GOLD
Package: -
Stock6,462
-
Textool?
PGA, ZIF (ZIP)
289 (17 x 17)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polyethersulfone (PES)
-55°C ~ 150°C
3M
CONN SOCKET SIP ZIF 32POS GOLD
Package: -
Stock4,572
-
Textool?
SIP, ZIF (ZIP)
32 (1 x 32)
0.100" (2.54mm)
Gold
-
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN IC DIP SOCKET ZIF 64POS GLD
Package: -
Stock6,408
-
Textool?
DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing
64 (2 x 32)
0.070" (1.78mm)
Gold
30µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.070" (1.78mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN IC DIP SOCKET ZIF 28POS GLD
Package: -
Stock6,348
-
Textool?
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN IC DIP SOCKET ZIF 24POS GLD
Package: -
Stock7,110
-
Textool?
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN IC DIP SOCKET ZIF 28POS GLD
Package: -
Stock6,900
-
Textool?
DIP, ZIF (ZIP), 0.4" (10.16mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN IC DIP SOCKET ZIF 32POS GLD
Package: -
Stock8,496
-
Textool?
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN IC DIP SOCKET ZIF 22POS GLD
Package: -
Stock8,532
-
Textool?
DIP, ZIF (ZIP), 0.4" (10.16mm) Row Spacing
22 (2 x 11)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN SOCKET PLCC 84POS TIN
Package: -
Stock21,432
-
8400
PLCC
84 (4 x 21)
0.050" (1.27mm)
Tin
160µin (4.06µm)
Copper Alloy
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
160µin (4.06µm)
Copper Alloy
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
3M
CONN SOCKET PLCC 44POS TIN
Package: -
Stock16,584
-
8400
PLCC
44 (4 x 11)
0.050" (1.27mm)
Tin
160µin (4.06µm)
Copper Alloy
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Tin
160µin (4.06µm)
Copper Alloy
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
3M
CONN IC DIP SOCKET 48POS TIN
Package: -
Stock16,992
-
4800
DIP, 0.6" (15.24mm) Row Spacing
48 (2 x 24)
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Polyester, Glass Filled
-25°C ~ 85°C
3M
CONN IC DIP SOCKET 18POS TIN
Package: -
Stock20,784
-
4800
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Polyester, Glass Filled
-25°C ~ 85°C
3M
CONN SOCKET QFN 64POS GOLD
Package: -
Stock8,028
-
Textool?
QFN
64 (4 x 16)
0.020" (0.50mm)
Gold
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.020" (0.50mm)
Gold
-
Beryllium Copper
Polyethersulfone (PES)
-
3M
CONN SOCKET QFN 28POS GOLD
Package: -
Stock8,766
-
Textool?
QFN
28 (4 x 7)
0.020" (0.50mm)
Gold
-
Beryllium Copper
Through Hole
-
Solder
-
Gold
-
Beryllium Copper
Polyethersulfone (PES)
-
3M
CONN SOCKET QFN 24POS GOLD
Package: -
Stock7,398
-
Textool?
QFN
24 (4 x 6)
0.020" (0.50mm)
Gold
-
Beryllium Copper
Through Hole
-
Solder
-
Gold
-
Beryllium Copper
Polyethersulfone (PES)
-
3M
CONN SOCKET QFN 48POS GOLD
Package: -
Stock6,714
-
Textool?
QFN
48 (4 x 12)
0.020" (0.50mm)
Gold
-
Beryllium Copper
Through Hole
Closed Frame
Solder
-
Gold
-
Beryllium Copper
Polyethersulfone (PES)
-
3M
CONN SOCKET QFN 16POS GOLD
Package: -
Stock7,560
-
Textool?
QFN
16 (4 x 4)
0.020" (0.50mm)
Gold
-
Beryllium Copper
Through Hole
-
Solder
-
Gold
-
Beryllium Copper
Polyethersulfone (PES)
-
3M
CONN SOCKET PGA ZIF 225POS GOLD
Package: -
Stock6,168
-
Textool?
PGA, ZIF (ZIP)
225 (15 x 15)
0.100" (2.54mm)
-
-
-
-
-
-
0.100" (2.54mm)
-
-
-
Polyethersulfone (PES)
-55°C ~ 150°C
3M
CONN SOCKET SIP ZIF 24POS GOLD
Package: -
Stock5,904
-
Textool?
SIP, ZIF (ZIP)
24 (1 x 24)
0.100" (2.54mm)
Gold
-
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN SOCKET SIP ZIF 10POS GOLD
Package: -
Stock6,444
-
Textool?
SIP, ZIF (ZIP)
10 (1 x 10)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN SOCKET PLCC 84POS TIN
Package: -
Stock23,772
-
8400
PLCC
84 (4 x 21)
0.050" (1.27mm)
Tin
160µin (4.06µm)
Copper Alloy
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
160µin (4.06µm)
Copper Alloy
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
3M
CONN SOCKET PLCC 32POS TIN
Package: -
Stock13,734
-
8400
PLCC
32 (2 x 7, 2 x 9)
0.050" (1.27mm)
Tin
160µin (4.06µm)
Copper Alloy
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
160µin (4.06µm)
Copper Alloy
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
3M
CONN IC DIP SOCKET 24POS TIN
Package: -
Stock26,478
-
4800
DIP, 0.6" (15.24mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Polyester, Glass Filled
-25°C ~ 85°C
3M
CONN SOCKET PGA ZIF 625POS GOLD
Package: -
Stock7,506
-
Textool?
PGA, ZIF (ZIP)
625 (25 x 25)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polyethersulfone (PES)
-55°C ~ 150°C
3M
CONN SOCKET QFN 48POS GOLD
Package: -
Stock5,076
-
Textool?
QFN
48 (4 x 12)
0.020" (0.50mm)
Gold
-
Beryllium Copper
Through Hole
Closed Frame
Solder
-
Gold
-
Beryllium Copper
Polyethersulfone (PES)
-
3M
CONN SOCKET PGA ZIF 100POS GOLD
Package: -
Stock6,684
-
Textool?
PGA, ZIF (ZIP)
100 (10 x 10)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polyethersulfone (PES)
-55°C ~ 150°C
3M
CONN IC DIP SOCKET ZIF 24POS GLD
Package: -
Stock6,072
-
Textool?
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN IC DIP SOCKET ZIF 42POS GLD
Package: -
Stock8,004
-
Textool?
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
42 (2 x 21)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN IC DIP SOCKET ZIF 18POS GLD
Package: -
Stock7,488
-
Textool?
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN SOCKET CLCC 68POS GOLD
Package: -
Stock8,802
-
OEM
CLCC
68 (4 x 17)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
-55°C ~ 105°C