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Sockets for ICs, Transistors

Records 234
Page  4/8
Image
Part Number
Manufacturer
Description
Package
Stock
Quantity
Package
Series
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
3M
CONN IC DIP SOCKET ZIF 20POS GLD
Package: -
Stock2,520
-
OEM
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
250µin (6.35µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
250µin (6.35µm)
Beryllium Copper
Polyether Imide (PEI), Glass Filled
-55°C ~ 105°C
3M
CONN SOCKET QFN 60POS GOLD
Package: -
Stock3,276
-
Textool?
QFN
60 (4 x 15)
0.020" (0.50mm)
Gold
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.020" (0.50mm)
Gold
-
Beryllium Copper
Polyethersulfone (PES)
-
3M
CONN ZIG-ZAG ZIF 51POS GOLD
Package: -
Stock5,022
-
Textool?
Zig-Zag, ZIF (ZIP)
51 (1 x 25, 1 x 26)
0.050" (1.27mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN ZIG-ZAG ZIF 51POS GOLD
Package: -
Stock5,904
-
Textool?
Zig-Zag, ZIF (ZIP)
51 (1 x 25, 1 x 26)
0.050" (1.27mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN ZIG-ZAG ZIF 35POS GOLD
Package: -
Stock3,276
-
Textool?
Zig-Zag, ZIF (ZIP)
35 (1 x 17, 1 x 18)
0.050" (1.27mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN ZIG-ZAG ZIF 35POS GOLD
Package: -
Stock5,778
-
Textool?
Zig-Zag, ZIF (ZIP)
35 (1 x 17, 1 x 18)
0.050" (1.27mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN ZIG-ZAG ZIF 35POS GOLD
Package: -
Stock4,680
-
Textool?
Zig-Zag, ZIF (ZIP)
35 (1 x 17, 1 x 18)
0.050" (1.27mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN ZIG-ZAG ZIF 35POS GOLD
Package: -
Stock5,004
-
Textool?
Zig-Zag, ZIF (ZIP)
35 (1 x 17, 1 x 18)
0.050" (1.27mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN ZIG-ZAG ZIF 34POS GOLD
Package: -
Stock2,898
-
Textool?
Zig-Zag, ZIF (ZIP)
34 (2 x 17)
0.050" (1.27mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN ZIG-ZAG ZIF 34POS GOLD
Package: -
Stock6,228
-
Textool?
Zig-Zag, ZIF (ZIP)
34 (1 x 34)
0.050" (1.27mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN ZIG-ZAG ZIF 34POS GOLD
Package: -
Stock7,254
-
Textool?
Zig-Zag, ZIF (ZIP)
34 (2 x 17)
0.050" (1.27mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN ZIG-ZAG ZIF 34POS GOLD
Package: -
Stock2,988
-
Textool?
Zig-Zag, ZIF (ZIP)
34 (2 x 17)
0.050" (1.27mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
SOCKET ZIP IN-LINE 36POS
Package: -
Stock5,778
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
3M
CONN ZIG-ZAG 39POS GOLD
Package: -
Stock3,472
-
-
Zig-Zag
39 (1 x 19, 1 x 20)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 150°C
3M
IN-LINE ZIP STRIP POCKETS 32 CON
Package: -
Stock4,680
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
3M
CONN ZIG-ZAG 39POS GOLD
Package: -
Stock3,960
-
-
Zig-Zag
39 (1 x 19, 1 x 20)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 150°C
3M
CONN SOCKET 39POS ZIP STRIP
Package: -
Stock3,526
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
3M
STAGGERED ZIP STRIP POCKETS 32 C
Package: -
Stock3,042
-
Textool?
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
3M
STAGGERED ZIP STRIP POCKETS 32 C
Package: -
Stock4,230
-
Textool?
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
3M
CONN SOCKET PGA ZIF 32POS GOLD
Package: -
Stock3,472
-
Textool?
PGA, ZIF (ZIP)
32 (2 x 16)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN SOCKET PGA ZIF 32POS GOLD
Package: -
Stock8,046
-
Textool?
PGA, ZIF (ZIP)
32 (2 x 16)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN SOCKET 39POS ZIP STRIP
Package: -
Stock6,876
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
3M
CONN SOCKET PLCC 84POS GOLD
Package: -
Stock8,406
-
OEM
PLCC
84 (4 x 21)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
-55°C ~ 105°C
3M
CONN IC DIP SOCKET ZIF 32POS GLD
Package: -
Stock5,580
-
OEM
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Gold
250µin (6.35µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
250µin (6.35µm)
Beryllium Copper
Polyether Imide (PEI), Glass Filled
-55°C ~ 105°C
3M
OEM LCC SOCKETS 32 POS SOLID LID
Package: -
Stock6,264
-
OEM
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
3M
CONN SOCKET PLCC 68POS TIN
Package: -
Stock8,244
-
8400
PLCC
68 (4 x 17)
0.050" (1.27mm)
Tin
160µin (4.06µm)
Copper Alloy
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
160µin (4.06µm)
Copper Alloy
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
3M
CONN SOCKET PLCC 84POS TIN
Package: -
Stock6,912
-
8400
PLCC
84 (4 x 21)
0.050" (1.27mm)
Tin
160µin (4.06µm)
Copper Alloy
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
160µin (4.06µm)
Copper Alloy
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
3M
CONN SOCKET PLCC 52POS TIN
Package: -
Stock4,644
-
8400
PLCC
52 (4 x 13)
0.050" (1.27mm)
Tin
160µin (4.06µm)
Copper Alloy
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
160µin (4.06µm)
Copper Alloy
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
3M
CONN SOCKET PLCC 20POS TIN
Package: -
Stock3,384
-
8400
PLCC
20 (4 x 5)
0.050" (1.27mm)
Tin
160µin (4.06µm)
Copper Alloy
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
160µin (4.06µm)
Copper Alloy
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
3M
CONN SOCKET PLCC 28POS TIN
Package: -
Stock4,158
-
8400
PLCC
28 (4 x 7)
0.050" (1.27mm)
Tin
160µin (4.06µm)
Copper Alloy
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
160µin (4.06µm)
Copper Alloy
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C