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Sockets for ICs, Transistors

Records 234
Page  5/8
Image
Part Number
Manufacturer
Description
Package
Stock
Quantity
Package
Series
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
3M
CONN SOCKET PLCC 20POS TIN
Package: -
Stock8,514
-
8400
PLCC
20 (4 x 5)
0.050" (1.27mm)
Tin
160µin (4.06µm)
Copper Alloy
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
160µin (4.06µm)
Copper Alloy
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
3M
CONN IC DIP SOCKET 42POS TIN
Package: -
Stock4,122
-
4800
DIP, 0.6" (15.24mm) Row Spacing
42 (2 x 21)
0.100" (2.54mm)
Tin
135µin (3.43µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
135µin (3.43µm)
Phosphor Bronze
Polyester, Glass Filled
-25°C ~ 85°C
3M
CONN IC DIP SOCKET 42POS TIN
Package: -
Stock6,714
-
4800
DIP, 0.6" (15.24mm) Row Spacing
42 (2 x 21)
0.100" (2.54mm)
Tin
135µin (3.43µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
135µin (3.43µm)
Phosphor Bronze
Polyester, Glass Filled
-25°C ~ 85°C
3M
CONN IC DIP SOCKET 32POS TIN
Package: -
Stock3,690
-
4800
DIP, 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Polyester, Glass Filled
-25°C ~ 85°C
3M
CONN IC DIP SOCKET 24POS TIN
Package: -
Stock5,598
-
4800
DIP, 0.3" (7.62mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Polyester, Glass Filled
-25°C ~ 85°C
3M
CONN SOCKET SOIC 28POS GOLD
Package: -
Stock5,742
-
Textool?
SOIC
28 (2 x 14)
-
Gold
-
Beryllium Copper
Through Hole
Closed Frame
Solder
-
Gold
30µin (0.76µm)
Beryllium Copper
Polyethersulfone (PES), Glass Filled
-55°C ~ 150°C
3M
CONN IC DIP SOCKET ZIF 64POS GLD
Package: -
Stock3,474
-
Textool?
DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing
64 (2 x 32)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN IC DIP SOCKET 8POS TIN
Package: -
Stock2,538
-
4800
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Polyester, Glass Filled
-25°C ~ 85°C
3M
CONN SOCKET QFN 60POS GOLD
Package: -
Stock7,326
-
Textool?
QFN
60 (4 x 15)
0.016" (0.40mm)
Gold
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.016" (0.40mm)
Gold
-
Beryllium Copper
Polyethersulfone (PES)
-
3M
CONN SOCKET QFN 40POS GOLD
Package: -
Stock8,658
-
Textool?
QFN
40 (4 x 10)
-
Gold
-
Beryllium Copper
Through Hole
Closed Frame
Solder
-
Gold
-
Beryllium Copper
Polyethersulfone (PES)
-
3M
CONN SOCKET QFN 40POS GOLD
Package: -
Stock6,750
-
Textool?
QFN
40 (4 x 10)
-
Gold
-
Beryllium Copper
Through Hole
Closed Frame
Solder
-
Gold
-
Beryllium Copper
Polyethersulfone (PES)
-
3M
CONN IC DIP SOCKET ZIF 90POS GLD
Package: -
Stock4,788
-
Textool?
DIP, ZIF (ZIP)
90 (2 x 45)
0.070" (1.78mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.070" (1.78mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN IC DIP SOCKET ZIF 42POS GLD
Package: -
Stock6,084
-
Textool?
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
42 (2 x 21)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN SOCKET SOIC 18POS GOLD
Package: -
Stock6,138
-
Textool?
SOIC
18 (2 x 9)
-
Gold
-
Beryllium Copper
Through Hole
Closed Frame
Solder
-
Gold
30µin (0.76µm)
Beryllium Copper
Polyethersulfone (PES), Glass Filled
-55°C ~ 150°C
3M
CONN IC DIP SOCKET ZIF 32POS GLD
Package: -
Stock5,796
-
Textool?
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.070" (1.78mm)
Gold
30µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN ZIG-ZAG ZIF 51POS GOLD
Package: -
Stock7,776
-
Textool?
Zig-Zag, ZIF (ZIP)
51 (1 x 25, 1 x 26)
0.050" (1.27mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN ZIG-ZAG ZIF 51POS GOLD
Package: -
Stock7,416
-
Textool?
Zig-Zag, ZIF (ZIP)
51 (1 x 25, 1 x 26)
0.050" (1.27mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN SOCKET PGA ZIF 361POS GOLD
Package: -
Stock6,570
-
Textool?
PGA, ZIF (ZIP)
361 (19 x 19)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polyethersulfone (PES)
-55°C ~ 150°C
3M
CONN SOCKET SIP ZIF 36POS GOLD
Package: -
Stock8,064
-
Textool?
SIP, ZIF (ZIP)
36 (1 x 36)
0.100" (2.54mm)
Gold
-
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN IC DIP SOCKET ZIF 56POS GLD
Package: -
Stock5,778
-
Textool?
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
56 (2 x 28)
0.070" (1.78mm)
Gold
30µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN SOCKET SOIC 24POS GOLD
Package: -
Stock5,886
-
Textool?
SOIC
24 (2 x 12)
-
Gold
-
Beryllium Copper
Through Hole
Closed Frame
Solder
-
Gold
30µin (0.76µm)
Beryllium Copper
Polyethersulfone (PES), Glass Filled
-55°C ~ 150°C
3M
CONN SOCKET SOIC 20POS GOLD
Package: -
Stock6,108
-
Textool?
SOIC
20 (2 x 10)
-
Gold
-
Beryllium Copper
Through Hole
Closed Frame
Solder
-
Gold
30µin (0.76µm)
Beryllium Copper
Polyethersulfone (PES), Glass Filled
-55°C ~ 150°C
3M
CONN IC DIP SOCKET ZIF 40POS GLD
Package: -
Stock3,906
-
Textool?
DIP, ZIF (ZIP), 1.0" (25.40mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN IC DIP SOCKET ZIF 42POS GLD
Package: -
Stock4,626
-
Textool?
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
42 (2 x 21)
0.070" (1.78mm)
Gold
30µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN IC DIP SOCKET ZIF 28POS GLD
Package: -
Stock6,660
-
Textool?
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.070" (1.78mm)
Gold
30µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
3M
CONN SOCKET PLCC 52POS TIN
Package: -
Stock18,408
-
8400
PLCC
52 (4 x 13)
0.050" (1.27mm)
Tin
160µin (4.06µm)
Copper Alloy
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
160µin (4.06µm)
Copper Alloy
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
3M
CONN SOCKET PLCC 52POS TIN
Package: -
Stock16,656
-
8400
PLCC
52 (4 x 13)
0.050" (1.27mm)
Tin
160µin (4.06µm)
Copper Alloy
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
160µin (4.06µm)
Copper Alloy
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
3M
CONN IC DIP SOCKET 48POS TIN
Package: -
Stock17,256
-
4800
DIP, 0.6" (15.24mm) Row Spacing
48 (2 x 24)
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Polyester, Glass Filled
-25°C ~ 85°C
3M
CONN SOCKET QFN 80POS GOLD
Package: -
Stock6,480
-
Textool?
QFN
80 (4 x 20)
0.020" (0.50mm)
Gold
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.020" (0.50mm)
Gold
-
Beryllium Copper
Polyethersulfone (PES)
-
3M
CONN SOCKET QFN 56POS GOLD
Package: -
Stock8,262
-
Textool?
QFN
56 (4 x 14)
0.016" (0.40mm)
Gold
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.016" (0.40mm)
Gold
-
Beryllium Copper
Polyethersulfone (PES)
-