* Please refer to the English Version as our Official Version.
Image |
Part Number |
Manufacturer |
Description |
Package |
Stock |
Quantity |
Package |
Series |
Type |
Number of Positions or Pins (Grid) |
Pitch - Mating |
Contact Finish - Mating |
Contact Finish Thickness - Mating |
Contact Material - Mating |
Mounting Type |
Features |
Termination |
Pitch - Post |
Contact Finish - Post |
Contact Finish Thickness - Post |
Contact Material - Post |
Housing Material |
Operating Temperature |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. |
CONN IC DIP SOCKET 16POS GOLD
|
Package: - |
Stock2,754 |
|
- |
IC |
DIP, 0.3" (7.62mm) Row Spacing |
16 (2 x 8) |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Phosphor Bronze |
Polyester, Glass Filled |
-55°C ~ 125°C |
||
Grayhill Inc. |
CONN SOCKET TRANSIST 3POS GOLD
|
Package: - |
Stock8,604 |
|
- |
22 |
Transistor |
3 (Round) |
- |
Gold |
- |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
- |
Gold |
- |
Beryllium Copper |
Thermoplastic, Glass Filled |
- |
||
Grayhill Inc. |
CONN SOCKET TRANSIST 3POS GOLD
|
Package: - |
Stock4,788 |
|
- |
22 |
Transistor |
3 (Round) |
- |
Gold |
- |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
- |
Gold |
- |
Beryllium Copper |
Thermoplastic, Glass Filled |
- |
||
Grayhill Inc. |
CONN SOCKET TRANSIST 4POS GOLD
|
Package: - |
Stock3,888 |
|
- |
22 |
Transistor |
4 (Round) |
- |
Gold |
- |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
- |
Gold |
- |
Beryllium Copper |
Thermoplastic, Glass Filled |
- |
||
Samtec Inc. |
CONN SOCKET PLCC 84POS TIN
|
Package: - |
Stock4,572 |
|
- |
PLCC |
PLCC |
84 (4 x 21) |
0.050" (1.27mm) |
Tin |
- |
Beryllium Copper |
Surface Mount |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Beryllium Copper |
Liquid Crystal Polymer (LCP) |
-55°C ~ 125°C |
||
Samtec Inc. |
CONN SOCKET PLCC 44POS TIN
|
Package: - |
Stock6,660 |
|
- |
PLCC |
PLCC |
44 (4 x 11) |
0.050" (1.27mm) |
Tin |
- |
Beryllium Copper |
Surface Mount |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Beryllium Copper |
Liquid Crystal Polymer (LCP) |
-55°C ~ 125°C |
||
Samtec Inc. |
CONN SOCKET PLCC 28POS TIN
|
Package: - |
Stock4,302 |
|
- |
PLCC |
PLCC |
28 (4 x 7) |
0.050" (1.27mm) |
Tin |
- |
Beryllium Copper |
Surface Mount |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Beryllium Copper |
Liquid Crystal Polymer (LCP) |
-55°C ~ 125°C |
||
Molex, LLC |
CONN SOCKET PGA 988POS GOLD
|
Package: - |
Stock5,130 |
|
- |
47989 |
PGA |
988 (35 x 36) |
0.039" (1.00mm) |
Gold |
15µin (0.38µm) |
Copper Alloy |
Surface Mount |
Open Frame |
Solder |
0.039" (1.00mm) |
- |
- |
- |
Liquid Crystal Polymer (LCP) |
- |
||
Molex, LLC |
CONN SOCKET PGA 989POS GOLD
|
Package: - |
Stock8,550 |
|
- |
47989 |
PGA |
989 (35 x 36) |
0.039" (1.00mm) |
Gold |
15µin (0.38µm) |
Copper Alloy |
Surface Mount |
Open Frame |
Solder |
0.039" (1.00mm) |
- |
- |
- |
Liquid Crystal Polymer (LCP) |
- |
||
Molex, LLC |
CONN SOCKET PGA 989POS GOLD
|
Package: - |
Stock8,586 |
|
- |
47989 |
PGA |
989 (35 x 36) |
0.039" (1.00mm) |
Gold |
15µin (0.38µm) |
Copper Alloy |
Surface Mount |
Open Frame |
Solder |
0.039" (1.00mm) |
- |
- |
- |
Liquid Crystal Polymer (LCP) |
- |
||
Molex, LLC |
CONN SOCKET PGA 989POS GOLD
|
Package: - |
Stock6,858 |
|
- |
47989 |
PGA |
989 (35 x 36) |
0.039" (1.00mm) |
Gold |
15µin (0.38µm) |
Copper Alloy |
Surface Mount |
Open Frame |
Solder |
0.039" (1.00mm) |
- |
- |
- |
Liquid Crystal Polymer (LCP) |
- |
||
Molex, LLC |
CONN SOCKET PGA 989POS GOLD
|
Package: - |
Stock8,406 |
|
- |
47989 |
PGA |
989 (35 x 36) |
0.039" (1.00mm) |
Gold |
15µin (0.38µm) |
Copper Alloy |
Surface Mount |
Open Frame |
Solder |
0.039" (1.00mm) |
- |
- |
- |
Liquid Crystal Polymer (LCP) |
- |
||
Molex, LLC |
CONN SOCKET PGA 989POS GOLD
|
Package: - |
Stock6,606 |
|
- |
47989 |
PGA |
989 (35 x 36) |
0.039" (1.00mm) |
Gold |
15µin (0.38µm) |
Copper Alloy |
Surface Mount |
Open Frame |
Solder |
0.039" (1.00mm) |
- |
- |
- |
Liquid Crystal Polymer (LCP) |
- |
||
Molex, LLC |
CONN SOCKET PGA 989POS GOLD
|
Package: - |
Stock6,012 |
|
- |
47989 |
PGA |
989 (35 x 36) |
0.039" (1.00mm) |
Gold |
15µin (0.38µm) |
Copper Alloy |
Surface Mount |
Open Frame |
Solder |
0.039" (1.00mm) |
- |
- |
- |
Liquid Crystal Polymer (LCP) |
- |
||
Molex, LLC |
CONN SOCKET PGA 989POS GOLD
|
Package: - |
Stock2,502 |
|
- |
47989 |
PGA |
989 (35 x 36) |
0.039" (1.00mm) |
Gold |
15µin (0.38µm) |
Copper Alloy |
Surface Mount |
Open Frame |
Solder |
0.039" (1.00mm) |
- |
- |
- |
Liquid Crystal Polymer (LCP) |
- |
||
Omron Electronics Inc-EMC Div |
CONN SOCKET SIP 32POS GOLD
|
Package: - |
Stock4,032 |
|
- |
XR2 |
SIP |
32 (1 x 32) |
0.100" (2.54mm) |
Gold |
29.5µin (0.75µm) |
Beryllium Copper |
Through Hole |
Carrier |
Solder |
0.100" (2.54mm) |
Gold |
29.5µin (0.75µm) |
Beryllium Copper |
Polybutylene Terephthalate (PBT), Glass Filled |
-55°C ~ 125°C |
||
Omron Electronics Inc-EMC Div |
CONN IC DIP SOCKET 40POS GOLD
|
Package: - |
Stock8,568 |
|
- |
XR2 |
DIP, 0.6" (15.24mm) Row Spacing |
40 (2 x 20) |
0.100" (2.54mm) |
Gold |
29.5µin (0.75µm) |
Beryllium Copper |
Through Hole |
Carrier |
Solder |
0.100" (2.54mm) |
Gold |
29.5µin (0.75µm) |
Beryllium Copper |
Polybutylene Terephthalate (PBT), Glass Filled |
-55°C ~ 125°C |
||
Omron Electronics Inc-EMC Div |
CONN IC DIP SOCKET 24POS GOLD
|
Package: - |
Stock5,436 |
|
- |
XR2 |
DIP, 0.6" (15.24mm) Row Spacing |
24 (2 x 12) |
0.100" (2.54mm) |
Gold |
29.5µin (0.75µm) |
Beryllium Copper |
Through Hole |
Carrier |
Solder |
0.100" (2.54mm) |
Gold |
29.5µin (0.75µm) |
Beryllium Copper |
Polybutylene Terephthalate (PBT), Glass Filled |
-55°C ~ 125°C |
||
Omron Electronics Inc-EMC Div |
CONN SOCKET SIP 32POS GOLD
|
Package: - |
Stock7,956 |
|
- |
XR2 |
SIP |
32 (1 x 32) |
0.100" (2.54mm) |
Gold |
- |
Beryllium Copper |
- |
- |
Solder |
0.100" (2.54mm) |
Gold |
- |
Beryllium Copper |
Polybutylene Terephthalate (PBT), Glass Filled |
-55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN SOCKET PGA ZIF 988POS GOLD
|
Package: - |
Stock2,100 |
|
- |
- |
PGA, ZIF (ZIP) |
988 (35 x 36) |
0.039" (1.00mm) |
Gold |
15µin (0.38µm) |
Copper Alloy |
Surface Mount |
Open Frame |
Solder |
0.039" (1.00mm) |
- |
- |
Copper Alloy |
Thermoplastic |
- |
||
TE Connectivity AMP Connectors |
CONN TRANSIST TO-3 3POS SILVER
|
Package: - |
Stock6,606 |
|
- |
8080 |
Transistor, TO-3 |
3 (Oval) |
- |
Silver |
- |
Beryllium Copper |
Chassis Mount |
Closed Frame |
Solder |
- |
Silver |
- |
Beryllium Copper |
Diallyl Phthalate (DAP) |
-55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN TRANSIST TO-5 4POS GOLD
|
Package: - |
Stock6,822 |
|
- |
8058 |
Transistor, TO-5 |
4 (Round) |
- |
Gold |
- |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
- |
Gold |
- |
Brass |
Polytetrafluoroethylene (PTFE) |
-55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN TRANSIST TO-5 8POS GOLD
|
Package: - |
Stock8,118 |
|
- |
8058 |
Transistor, TO-5 |
8 (Round) |
- |
Gold |
- |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
- |
Gold |
- |
Brass |
Polytetrafluoroethylene (PTFE) |
-55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN TRANSIST TO-3 3POS TIN
|
Package: - |
Stock2,178 |
|
- |
8080 |
Transistor, TO-3 |
3 (Oval) |
- |
Tin |
- |
Beryllium Copper |
Chassis Mount |
Closed Frame |
Solder |
- |
Tin |
- |
Beryllium Copper |
Polytetrafluoroethylene (PTFE) |
-55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN TRANSIST TO-3 3POS GOLD
|
Package: - |
Stock6,012 |
|
- |
8080 |
Transistor, TO-3 |
3 (Oval) |
- |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Chassis Mount |
Closed Frame |
Solder |
- |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Polytetrafluoroethylene (PTFE) |
-55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN TRANSIST TO-3 3POS TIN
|
Package: - |
Stock7,596 |
|
- |
8080 |
Transistor, TO-3 |
3 (Oval) |
- |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Chassis Mount |
Closed Frame |
Solder |
- |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polytetrafluoroethylene (PTFE) |
-55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN TRANSIST TO-3 3POS TIN
|
Package: - |
Stock8,406 |
|
- |
8080 |
Transistor, TO-3 |
3 (Oval) |
- |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Chassis Mount |
Closed Frame |
Solder |
- |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polytetrafluoroethylene (PTFE) |
-55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN TRANSIST TO-3 3POS TIN
|
Package: - |
Stock3,978 |
|
- |
8080 |
Transistor, TO-3 |
3 (Oval) |
- |
Tin |
- |
Beryllium Copper |
Chassis Mount |
Closed Frame |
Solder |
- |
Tin |
- |
Beryllium Copper |
Polytetrafluoroethylene (PTFE) |
-55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN TRANSIST TO-3 3POS TIN
|
Package: - |
Stock6,156 |
|
- |
8080 |
Transistor, TO-3 |
3 (Oval) |
- |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Chassis Mount |
Closed Frame |
Solder |
- |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polytetrafluoroethylene (PTFE) |
-55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN TRANSIST TO-3 3POS TIN
|
Package: - |
Stock7,506 |
|
- |
8080 |
Transistor, TO-3 |
3 (Oval) |
- |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Chassis Mount |
Closed Frame |
Solder |
- |
Tin |
200µin (5.08µm) |
Beryllium Copper |
Polytetrafluoroethylene (PTFE) |
-55°C ~ 125°C |