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Sockets for ICs, Transistors

Records 11083
Page  7/370
Image
Part Number
Manufacturer
Description
Package
Stock
Quantity
Package
Series
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 20POS GOLD
Package: -
Stock8,028
-
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Thermoplastic, Glass Filled
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 20POS GOLD
Package: -
Stock2,448
-
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Thermoplastic, Glass Filled
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 24POS GOLD
Package: -
Stock3,400
-
Diplomate DL
DIP, 0.6" (15.24mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Thermoplastic, Glass Filled
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 40POS GOLD
Package: -
Stock7,488
-
Diplomate DL
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Thermoplastic, Glass Filled
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 24POS GOLD
Package: -
Stock2,448
-
Diplomate DL
DIP, 0.6" (15.24mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Thermoplastic, Glass Filled
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 20POS GOLD
Package: -
Stock3,834
-
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Thermoplastic, Glass Filled
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 20POS GOLD
Package: -
Stock3,672
-
500
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
20µin (0.51µm)
Beryllium Copper
Through Hole, Right Angle, Horizontal
Closed Frame
Solder
0.100" (2.54mm)
-
-
Brass
Thermoplastic
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 40POS GOLD
Package: -
Stock7,074
-
800
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Gold
-
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
-
-
Brass
-
-
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 14POS GOLD
Package: -
Stock7,434
-
800
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
-
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
-
-
Brass
-
-
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 28POS TIN
Package: -
Stock5,796
-
800
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
-
-
Brass
-
-
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 14POS TIN
Package: -
Stock2,142
-
800
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
-
-
Brass
-
-
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 8POS TIN
Package: -
Stock7,974
-
800
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
-
-
Brass
-
-
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 28POS GOLD
Package: -
Stock7,974
-
-
DIP, 0.3" (7.62mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Brass
Thermoplastic, Polyester
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 18POS GOLD
Package: -
Stock7,722
-
-
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Brass
Thermoplastic, Polyester
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 10POS GOLD
Package: -
Stock2,970
-
-
DIP, 0.3" (7.62mm) Row Spacing
10 (2 x 5)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
Flash
Brass
Thermoplastic, Polyester
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 10POS TIN
Package: -
Stock2,178
-
-
DIP, 0.3" (7.62mm) Row Spacing
10 (2 x 5)
0.100" (2.54mm)
Tin
196.8µin (5.00µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
196.8µin (5.00µm)
Brass
Thermoplastic, Polyester
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 6POS GOLD
Package: -
Stock5,058
-
-
DIP, 0.3" (7.62mm) Row Spacing
6 (2 x 3)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Brass
Thermoplastic, Polyester
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 64POS GOLD
Package: -
Stock2,880
-
800
DIP, 0.9" (22.86mm) Row Spacing
64 (2 x 32)
0.100" (2.54mm)
Gold
25µin (0.63µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
25µin (0.63µm)
Copper
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 105°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 22POS GOLD
Package: -
Stock8,496
-
800
DIP, 0.4" (10.16mm) Row Spacing
22 (2 x 11)
0.100" (2.54mm)
Gold
25µin (0.63µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
25µin (0.63µm)
Copper
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 105°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 20POS TIN
Package: -
Stock8,406
-
800
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Copper
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 105°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 22POS GOLD
Package: -
Stock5,544
-
800
DIP, 0.4" (10.16mm) Row Spacing
22 (2 x 11)
0.100" (2.54mm)
Gold
20µin (0.51µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
20µin (0.51µm)
Copper
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 105°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 64POS GOLD
Package: -
Stock4,590
-
800
DIP, 0.9" (22.86mm) Row Spacing
64 (2 x 32)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
Flash
Copper
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 105°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 18POS TIN
Package: -
Stock2,772
-
800
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Copper
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 105°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 24POS TIN
Package: -
Stock5,238
-
800
DIP, 0.3" (7.62mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Copper
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 105°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 6POS GOLD
Package: -
Stock6,966
-
500
DIP, 0.3" (7.62mm) Row Spacing
6 (2 x 3)
0.100" (2.54mm)
Gold
25µin (0.63µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
25µin (0.63µm)
Nickel
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 24POS GOLD
Package: -
Stock3,978
-
500
DIP, 0.4" (10.16mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
25µin (0.63µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
25µin (0.63µm)
Beryllium Copper
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 64POS GOLD
Package: -
Stock6,210
-
800
DIP, 0.3" (7.62mm) Row Spacing
64 (2 x 32)
0.100" (2.54mm)
Gold
25µin (0.63µm)
Copper Alloy
Through Hole
Open Frame
Solder
0.100" (2.54mm)
-
-
-
Polyester
-55°C ~ 105°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 36POS GOLD
Package: -
Stock4,446
-
500
DIP, 0.6" (15.24mm) Row Spacing
36 (2 x 18)
0.100" (2.54mm)
Gold
-
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
-
-
Brass
-
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 18POS GOLD
Package: -
Stock7,614
-
500
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Gold
-
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
-
-
Beryllium Copper
-
-55°C ~ 125°C
TE Connectivity AMP Connectors
504-AG10D=SOCKET ASSY
Package: -
Stock3,852
-
-
DIP, 0.3" (7.62mm) Row Spacing
4 (2 x 2)
0.100" (2.54mm)
Gold
-
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
-
Beryllium Copper
Thermoplastic, Polyester
-55°C ~ 125°C