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Sockets for ICs, Transistors

Records 11083
Page  3/370
Image
Part Number
Manufacturer
Description
Package
Stock
Quantity
Package
Series
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
Harwin Inc.
CONN IC DIP SOCKET 8POS GOLD
Package: -
Stock5,526
-
D0
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Wire Wrap
0.100" (2.54mm)
Tin
196.8µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
Harwin Inc.
CONN IC DIP SOCKET 6POS GOLD
Package: -
Stock4,284
-
D0
DIP, 0.3" (7.62mm) Row Spacing
6 (2 x 3)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Wire Wrap
0.100" (2.54mm)
Tin
196.8µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
Harwin Inc.
CONN IC DIP SOCKET 24POS GOLD
Package: -
Stock7,596
-
D0
DIP, 0.4" (10.16mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Wire Wrap
0.100" (2.54mm)
Tin
196.8µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
Harwin Inc.
CONN SOCKET SIP 32POS GOLD
Package: -
Stock6,516
-
D01-950
SIP
32 (1 x 32)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
Harwin Inc.
CONN SOCKET SIP 20POS GOLD
Package: -
Stock2,430
-
D01-950
SIP
20 (1 x 20)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
Harwin Inc.
CONN SOCKET SIP 18POS GOLD
Package: -
Stock3,960
-
D01-950
SIP
18 (1 x 18)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
Harwin Inc.
CONN SOCKET SIP 16POS GOLD
Package: -
Stock2,466
-
D01-950
SIP
16 (1 x 16)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
Harwin Inc.
CONN SOCKET SIP 14POS GOLD
Package: -
Stock2,682
-
D01-950
SIP
14 (1 x 14)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
Harwin Inc.
CONN SOCKET SIP 12POS GOLD
Package: -
Stock5,670
-
D01-950
SIP
12 (1 x 12)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
Harwin Inc.
CONN SOCKET SIP 10POS GOLD
Package: -
Stock5,454
-
D01-950
SIP
10 (1 x 10)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
Harwin Inc.
CONN SOCKET SIP 9POS GOLD
Package: -
Stock5,832
-
D01-950
SIP
9 (1 x 9)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
Harwin Inc.
CONN SOCKET SIP 8POS GOLD
Package: -
Stock8,892
-
D01-950
SIP
8 (1 x 8)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
Harwin Inc.
CONN SOCKET SIP 7POS GOLD
Package: -
Stock7,380
-
D01-950
SIP
7 (1 x 7)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
Harwin Inc.
CONN SOCKET SIP 6POS GOLD
Package: -
Stock7,416
-
D01-950
SIP
6 (1 x 6)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
Harwin Inc.
CONN SOCKET SIP 5POS GOLD
Package: -
Stock5,526
-
D01-950
SIP
5 (1 x 5)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
Harwin Inc.
CONN SOCKET SIP 4POS GOLD
Package: -
Stock2,304
-
D01-950
SIP
4 (1 x 4)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
On Shore Technology Inc.
CONN IC DIP SOCKET 64POS GOLD
Package: -
Stock4,392
-
SA
DIP, 0.9" (22.86mm) Row Spacing
64 (2 x 32)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
80µin (2.03µm)
Brass
Thermoplastic, Polyester, Glass Filled
-40°C ~ 105°C
On Shore Technology Inc.
CONN IC DIP SOCKET 64POS GOLD
Package: -
Stock4,896
-
SA
DIP, 0.9" (22.86mm) Row Spacing
64 (2 x 32)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Thermoplastic, Polyester, Glass Filled
-40°C ~ 105°C
Molex, LLC
CONN SOCKET LGA 1155POS GOLD
Package: -
Stock7,452
-
47596
LGA
1155 (40 x 40)
0.036" (0.91mm)
Gold
30µin (0.76µm)
Copper Alloy
Surface Mount
Open Frame
Solder
0.036" (0.91mm)
-
-
-
Thermoplastic
-
Molex, LLC
CONN SOCKET LGA 1155POS GOLD
Package: -
Stock3,726
-
47596
LGA
1155 (40 x 40)
0.036" (0.91mm)
Gold
15µin (0.38µm)
Copper Alloy
Surface Mount
Open Frame
Solder
0.036" (0.91mm)
-
-
-
Thermoplastic
-
Molex, LLC
CONN SOCKET LGA 1156POS GOLD
Package: -
Stock6,408
-
47596
LGA
1156 (40 x 40)
0.036" (0.91mm)
Gold
15µin (0.38µm)
Copper Alloy
Surface Mount
Open Frame
Solder
0.036" (0.91mm)
-
-
-
Thermoplastic
-
Molex, LLC
CONN SOCKET LGA 1356POS GOLD
Package: -
Stock4,662
-
47594
LGA
1356 (32 x 41)
0.040" (1.01mm)
Gold
15µin (0.38µm)
-
Surface Mount
Open Frame
-
-
-
-
-
-
-
Molex, LLC
CONN SOCKET LGA 1366POS GOLD
Package: -
Stock7,038
-
47594
LGA
1366 (32 x 41)
0.040" (1.01mm)
Gold
30µin (0.76µm)
Copper Alloy
Surface Mount
Open Frame
Solder
0.040" (1.01mm)
-
-
-
Liquid Crystal Polymer (LCP)
-
3M
CONN SOCKET BGA CUSTOM
Package: -
Stock7,038
-
Textool?
BGA
Custom
0.026" ~ 0.050" (0.65mm ~ 1.27mm)
Custom
Custom
-
Through Hole
Custom
-
-
-
-
-
-
-
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 32POS TIN
Package: -
Stock3,598
-
-
DIP, 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
-
-40°C ~ 105°C
Molex, LLC
CONN SOCKET LGA 1366POS GOLD
Package: -
Stock6,444
-
47594
LGA
1366 (32 x 41)
0.040" (1.01mm)
Gold
15µin (0.38µm)
Copper Alloy
Surface Mount
Open Frame
Solder
0.040" (1.01mm)
-
-
-
Liquid Crystal Polymer (LCP)
-
Molex, LLC
CONN SOCKET LGA 1366POS NICKEL
Package: -
Stock2,718
-
47594
LGA
1366 (32 x 41)
-
Nickel
3µin (0.08µm)
-
Surface Mount
Closed Frame
Solder
-
Nickel
3µin (0.08µm)
-
-
-
TE Connectivity Potter & Brumfield Relays
CONN IC DIP SOCKET 32POS TINLEAD
Package: -
Stock3,600
-
800
DIP, 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Tin-Lead
80µin (2.03µm)
Copper Alloy
Through Hole
Open Frame
Solder
0.100" (2.54mm)
-
-
-
Polyester
-55°C ~ 105°C
Samtec Inc.
CONN IC DIP SOCKET 28POS GOLD
Package: -
Stock5,112
-
IC
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Phosphor Bronze
Polyester, Glass Filled
-55°C ~ 125°C
Samtec Inc.
CONN IC DIP SOCKET 16POS GOLD
Package: -
Stock8,118
-
IC
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Phosphor Bronze
Polyester, Glass Filled
-55°C ~ 125°C