* Please refer to the English Version as our Official Version.
Image |
Part Number |
Manufacturer |
Description |
Package |
Stock |
Quantity |
Package |
Series |
Type |
Number of Positions or Pins (Grid) |
Pitch - Mating |
Contact Finish - Mating |
Contact Finish Thickness - Mating |
Contact Material - Mating |
Mounting Type |
Features |
Termination |
Pitch - Post |
Contact Finish - Post |
Contact Finish Thickness - Post |
Contact Material - Post |
Housing Material |
Operating Temperature |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
TE Connectivity AMP Connectors |
CONN SOCKET PQFP 160POS TIN-LEAD
|
Package: - |
Stock6,966 |
|
- |
- |
QFP |
160 (4 x 40) |
0.050" (1.27mm) |
Tin-Lead |
200µin (5.08µm) |
Phosphor Bronze |
Through Hole |
Closed Frame |
Solder |
0.050" (1.27mm) |
Tin-Lead |
200µin (5.08µm) |
Phosphor Bronze |
Liquid Crystal Polymer (LCP) |
- |
||
TE Connectivity AMP Connectors |
CONN SOCKET SIP 10POS TIN
|
Package: - |
Stock4,212 |
|
- |
Diplomate DL |
SIP |
10 (1 x 10) |
0.100" (2.54mm) |
Tin |
- |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Beryllium Copper |
Thermoplastic, Glass Filled |
-55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN SOCKET SIP 8POS TIN
|
Package: - |
Stock2,100 |
|
- |
Diplomate DL |
SIP |
8 (1 x 8) |
0.100" (2.54mm) |
Tin |
- |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Beryllium Copper |
Thermoplastic, Glass Filled |
-55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN SOCKET SIP 25POS TIN
|
Package: - |
Stock2,412 |
|
- |
Diplomate DL |
SIP |
25 (1 x 25) |
0.100" (2.54mm) |
Tin |
- |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Beryllium Copper |
Thermoplastic, Glass Filled |
-55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN SOCKET SIP 20POS TIN
|
Package: - |
Stock3,438 |
|
- |
Diplomate DL |
SIP |
20 (1 x 20) |
0.100" (2.54mm) |
Tin |
- |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Beryllium Copper |
Thermoplastic, Glass Filled |
-55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN SOCKET SIP 20POS TIN
|
Package: - |
Stock6,876 |
|
- |
Diplomate DL |
SIP |
20 (1 x 20) |
0.100" (2.54mm) |
Tin |
- |
Phosphor Bronze |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Phosphor Bronze |
Thermoplastic, Glass Filled |
-55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN SOCKET SIP 20POS TIN
|
Package: - |
Stock7,974 |
|
- |
Diplomate DL |
SIP |
20 (1 x 20) |
0.100" (2.54mm) |
Tin |
- |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Beryllium Copper |
Thermoplastic, Glass Filled |
-55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN SOCKET SIP 18POS TIN
|
Package: - |
Stock4,986 |
|
- |
Diplomate DL |
SIP |
18 (1 x 18) |
0.100" (2.54mm) |
Tin |
- |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Beryllium Copper |
Thermoplastic, Glass Filled |
-55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN SOCKET SIP 14POS TIN
|
Package: - |
Stock3,312 |
|
- |
Diplomate DL |
SIP |
14 (1 x 14) |
0.100" (2.54mm) |
Tin |
- |
Phosphor Bronze |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Phosphor Bronze |
Thermoplastic, Glass Filled |
-55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN SOCKET SIP 14POS TIN
|
Package: - |
Stock3,276 |
|
- |
Diplomate DL |
SIP |
14 (1 x 14) |
0.100" (2.54mm) |
Tin |
- |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Beryllium Copper |
Thermoplastic, Glass Filled |
-55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN SOCKET SIP 12POS TIN
|
Package: - |
Stock4,320 |
|
- |
Diplomate DL |
SIP |
12 (1 x 12) |
0.100" (2.54mm) |
Tin |
- |
Phosphor Bronze |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Phosphor Bronze |
Thermoplastic, Glass Filled |
-55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN SOCKET SIP 9POS TIN
|
Package: - |
Stock7,272 |
|
- |
Diplomate DL |
SIP |
9 (1 x 9) |
0.100" (2.54mm) |
Tin |
- |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Beryllium Copper |
Thermoplastic, Glass Filled |
-55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 28POS TIN
|
Package: - |
Stock6,768 |
|
- |
Diplomate DL |
DIP, 0.6" (15.24mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Tin |
- |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Beryllium Copper |
Thermoplastic, Glass Filled |
-55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 48POS TIN
|
Package: - |
Stock5,508 |
|
- |
Diplomate DL |
DIP, 0.6" (15.24mm) Row Spacing |
48 (2 x 24) |
0.100" (2.54mm) |
Tin |
- |
Phosphor Bronze |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Phosphor Bronze |
Thermoplastic, Glass Filled |
-55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN SOCKET SIP 8POS TIN-LEAD
|
Package: - |
Stock2,268 |
|
- |
- |
SIP |
8 (1 x 8) |
0.100" (2.54mm) |
Tin-Lead |
150µin (3.81µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin-Lead |
150µin (3.81µm) |
Beryllium Copper |
Fluoropolymer (FP) |
-55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN SOCKET SIP 7POS TIN
|
Package: - |
Stock8,658 |
|
- |
Diplomate DL |
SIP |
7 (1 x 7) |
0.100" (2.54mm) |
Tin |
- |
Phosphor Bronze |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Phosphor Bronze |
Thermoplastic, Glass Filled |
-55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN SOCKET SIP 4POS TIN
|
Package: - |
Stock6,984 |
|
- |
Diplomate DL |
SIP |
4 (1 x 4) |
0.100" (2.54mm) |
Tin |
- |
Phosphor Bronze |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Phosphor Bronze |
Thermoplastic, Glass Filled |
-55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 32POS TIN
|
Package: - |
Stock2,100 |
|
- |
Diplomate DL |
DIP, 0.6" (15.24mm) Row Spacing |
32 (2 x 16) |
0.100" (2.54mm) |
Tin |
- |
Phosphor Bronze |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Phosphor Bronze |
Thermoplastic, Glass Filled |
-55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 40POS GOLD
|
Package: - |
Stock4,896 |
|
- |
Diplomate DL |
DIP, 0.6" (15.24mm) Row Spacing |
40 (2 x 20) |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Thermoplastic |
-55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 28POS GOLD
|
Package: - |
Stock7,110 |
|
- |
Diplomate DL |
DIP, 0.6" (15.24mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Gold |
15µin (0.38µm) |
Phosphor Bronze |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Gold |
15µin (0.38µm) |
Phosphor Bronze |
Thermoplastic, Glass Filled |
-55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 40POS GOLD
|
Package: - |
Stock5,850 |
|
- |
Diplomate DL |
DIP, 0.6" (15.24mm) Row Spacing |
40 (2 x 20) |
0.100" (2.54mm) |
Gold |
15µin (0.38µm) |
Phosphor Bronze |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Gold |
15µin (0.38µm) |
Phosphor Bronze |
Thermoplastic, Glass Filled |
-55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 24POS GOLD
|
Package: - |
Stock7,326 |
|
- |
Diplomate DL |
DIP, 0.6" (15.24mm) Row Spacing |
24 (2 x 12) |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Thermoplastic, Glass Filled |
-55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 20POS GOLD
|
Package: - |
Stock6,210 |
|
- |
Diplomate DL |
DIP, 0.3" (7.62mm) Row Spacing |
20 (2 x 10) |
0.100" (2.54mm) |
Gold |
15µin (0.38µm) |
Phosphor Bronze |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Gold |
15µin (0.38µm) |
Phosphor Bronze |
Thermoplastic |
-55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 40POS GOLD
|
Package: - |
Stock5,148 |
|
- |
Diplomate DL |
DIP, 0.6" (15.24mm) Row Spacing |
40 (2 x 20) |
0.100" (2.54mm) |
Gold |
15µin (0.38µm) |
Phosphor Bronze |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Gold |
15µin (0.38µm) |
Phosphor Bronze |
Thermoplastic, Glass Filled |
-55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 28POS TIN
|
Package: - |
Stock5,274 |
|
- |
Diplomate DL |
DIP, 0.6" (15.24mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Tin |
- |
Phosphor Bronze |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Phosphor Bronze |
Thermoplastic, Glass Filled |
-55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 20POS TIN
|
Package: - |
Stock8,352 |
|
- |
Diplomate DL |
DIP, 0.3" (7.62mm) Row Spacing |
20 (2 x 10) |
0.100" (2.54mm) |
Tin |
- |
Phosphor Bronze |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Phosphor Bronze |
Thermoplastic, Glass Filled |
-55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 32POS TIN
|
Package: - |
Stock5,652 |
|
- |
Diplomate DL |
DIP, 0.6" (15.24mm) Row Spacing |
32 (2 x 16) |
0.100" (2.54mm) |
Tin |
- |
Phosphor Bronze |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin-Lead |
- |
Phosphor Bronze |
Thermoplastic |
-55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 28POS TIN
|
Package: - |
Stock8,136 |
|
- |
Diplomate DL |
DIP, 0.6" (15.24mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Tin |
- |
Phosphor Bronze |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Phosphor Bronze |
Thermoplastic |
-55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 20POS TIN
|
Package: - |
Stock5,724 |
|
- |
Diplomate DL |
DIP, 0.3" (7.62mm) Row Spacing |
20 (2 x 10) |
0.100" (2.54mm) |
Tin |
- |
Phosphor Bronze |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Phosphor Bronze |
Thermoplastic |
-55°C ~ 105°C |
||
Mill-Max Manufacturing Corp. |
CONN SOCKET PLCC 84POS TIN-LEAD
|
Package: - |
Stock4,608 |
|
- |
940 |
PLCC |
84 (4 x 21) |
0.050" (1.27mm) |
Tin-Lead |
100µin (2.54µm) |
Beryllium Copper |
Surface Mount |
Closed Frame |
Solder |
0.050" (1.27mm) |
Tin-Lead |
200µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |