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Sockets for ICs, Transistors

Records 11083
Page  30/370
Image
Part Number
Manufacturer
Description
Package
Stock
Quantity
Package
Series
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
Mill-Max Manufacturing Corp.
CONN SOCKET PLCC 28POS TIN-LEAD
Package: -
Stock7,074
-
540
PLCC
28 (4 x 7)
0.050" (1.27mm)
Tin-Lead
200µin (5.08µm)
-
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin-Lead
200µin (5.08µm)
-
Polyphenylene Sulfide (PPS)
-
Mill-Max Manufacturing Corp.
CONN SOCKET PLCC 20POS TIN-LEAD
Package: -
Stock6,012
-
540
PLCC
20 (4 x 5)
0.050" (1.27mm)
Tin-Lead
200µin (5.08µm)
-
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin-Lead
200µin (5.08µm)
-
Polyphenylene Sulfide (PPS)
-
Mill-Max Manufacturing Corp.
CONN SOCKET PLCC 84POS TIN-LEAD
Package: -
Stock6,480
-
540
PLCC
84 (4 x 21)
0.050" (1.27mm)
Tin-Lead
200µin (5.08µm)
-
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin-Lead
200µin (5.08µm)
-
Polyphenylene Sulfide (PPS)
-
Mill-Max Manufacturing Corp.
CONN SOCKET PLCC 68POS TIN-LEAD
Package: -
Stock6,372
-
540
PLCC
68 (4 x 17)
0.050" (1.27mm)
Tin-Lead
200µin (5.08µm)
-
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin-Lead
200µin (5.08µm)
-
Polyphenylene Sulfide (PPS)
-
Mill-Max Manufacturing Corp.
CONN SOCKET PLCC 52POS TIN-LEAD
Package: -
Stock5,634
-
540
PLCC
52 (4 x 13)
0.050" (1.27mm)
Tin-Lead
200µin (5.08µm)
-
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin-Lead
200µin (5.08µm)
-
Polyphenylene Sulfide (PPS)
-
Mill-Max Manufacturing Corp.
CONN SOCKET PLCC 44POS TIN-LEAD
Package: -
Stock2,412
-
540
PLCC
44 (4 x 11)
0.050" (1.27mm)
Tin-Lead
200µin (5.08µm)
-
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin-Lead
200µin (5.08µm)
-
Polyphenylene Sulfide (PPS)
-
Mill-Max Manufacturing Corp.
CONN SOCKET PLCC 32POS TIN-LEAD
Package: -
Stock8,154
-
540
PLCC
32 (2 x 7, 2 x 9)
0.050" (1.27mm)
Tin-Lead
200µin (5.08µm)
-
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin-Lead
200µin (5.08µm)
-
Polyphenylene Sulfide (PPS)
-
Mill-Max Manufacturing Corp.
CONN SOCKET PLCC 28POS TIN-LEAD
Package: -
Stock4,320
-
540
PLCC
28 (4 x 7)
0.050" (1.27mm)
Tin-Lead
200µin (5.08µm)
-
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin-Lead
200µin (5.08µm)
-
Polyphenylene Sulfide (PPS)
-
Mill-Max Manufacturing Corp.
CONN SOCKET PLCC 20POS TIN-LEAD
Package: -
Stock6,300
-
540
PLCC
20 (4 x 5)
0.050" (1.27mm)
Tin-Lead
200µin (5.08µm)
-
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin-Lead
200µin (5.08µm)
-
Polyphenylene Sulfide (PPS)
-
Mill-Max Manufacturing Corp.
CONN SOCKET PLCC 84POS TIN-LEAD
Package: -
Stock8,784
-
540
PLCC
84 (4 x 21)
0.050" (1.27mm)
Tin-Lead
200µin (5.08µm)
-
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Tin-Lead
200µin (5.08µm)
-
Polyphenylene Sulfide (PPS)
-
Mill-Max Manufacturing Corp.
CONN SOCKET PLCC 68POS TIN-LEAD
Package: -
Stock7,506
-
540
PLCC
68 (4 x 17)
0.050" (1.27mm)
Tin-Lead
200µin (5.08µm)
-
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Tin-Lead
200µin (5.08µm)
-
Polyphenylene Sulfide (PPS)
-
Mill-Max Manufacturing Corp.
CONN SOCKET PLCC 52POS TIN-LEAD
Package: -
Stock7,938
-
540
PLCC
52 (4 x 13)
0.050" (1.27mm)
Tin-Lead
200µin (5.08µm)
-
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Tin-Lead
200µin (5.08µm)
-
Polyphenylene Sulfide (PPS)
-
Mill-Max Manufacturing Corp.
CONN SOCKET PLCC 44POS TIN-LEAD
Package: -
Stock7,236
-
540
PLCC
44 (4 x 11)
0.050" (1.27mm)
Tin-Lead
200µin (5.08µm)
-
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Tin-Lead
200µin (5.08µm)
-
Polyphenylene Sulfide (PPS)
-
Mill-Max Manufacturing Corp.
CONN SOCKET PLCC 32POS TIN-LEAD
Package: -
Stock2,358
-
540
PLCC
32 (2 x 7, 2 x 9)
0.050" (1.27mm)
Tin-Lead
200µin (5.08µm)
-
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Tin-Lead
200µin (5.08µm)
-
Polyphenylene Sulfide (PPS)
-
Mill-Max Manufacturing Corp.
CONN SOCKET PLCC 28POS TIN-LEAD
Package: -
Stock8,424
-
540
PLCC
28 (4 x 7)
0.050" (1.27mm)
Tin-Lead
200µin (5.08µm)
-
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Tin-Lead
200µin (5.08µm)
-
Polyphenylene Sulfide (PPS)
-
Mill-Max Manufacturing Corp.
CONN SOCKET PLCC 20POS TIN-LEAD
Package: -
Stock3,600
-
540
PLCC
20 (4 x 5)
0.050" (1.27mm)
Tin-Lead
200µin (5.08µm)
-
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Tin-Lead
200µin (5.08µm)
-
Polyphenylene Sulfide (PPS)
-
Aries Electronics
COLLET PIN CARRIER 20-PIN .300
Package: -
Stock3,472
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Aries Electronics
CONN SOCKET PLCC ZIF 32POS GOLD
Package: -
Stock5,706
-
536
PLCC, ZIF (ZIP)
32 (2 x 7, 2 x 9)
0.050" (1.27mm)
Gold
12µin (0.30µm)
-
Through Hole
Open Frame
-
-
-
-
-
-
-
3M
CONN SOCKET CLCC 68POS GOLD
Package: -
Stock5,364
-
OEM
CLCC
68 (4 x 17)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
-55°C ~ 105°C
3M
CONN SOCKET CLCC 68POS GOLD
Package: -
Stock7,830
-
OEM
CLCC
68 (4 x 17)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
-55°C ~ 105°C
3M
CONN SOCKET CLCC 68POS GOLD
Package: -
Stock7,200
-
OEM
CLCC
68 (4 x 17)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
-55°C ~ 105°C
3M
CONN SOCKET PQFP 100POS TIN-LEAD
Package: -
Stock6,462
-
OEM
QFP
100 (4 x 25)
-
Tin-Lead
200µin (5.08µm)
Beryllium Copper
Through Hole
Open Frame
Solder
-
Tin-Lead
200µin (5.08µm)
Beryllium Copper
Polyethersulfone (PES), Glass Filled
0°C ~ 105°C
Aries Electronics
CONN SOCKET PLCC ZIF 52POS GOLD
Package: -
Stock7,632
-
536
PLCC, ZIF (ZIP)
52 (4 x 13)
0.050" (1.27mm)
Gold
12µin (0.30µm)
-
Through Hole
Open Frame
-
-
-
-
-
-
-
Molex Connector Corporation
CONN IC DIP SOCKET 28POS TINLEAD
Package: -
Stock4,050
-
-
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Tin-Lead
-
-
Through Hole
Closed Frame
-
-
-
-
-
-
-
Molex Connector Corporation
CONN SOCKET TRANSIST TO-220 3POS
Package: -
Stock3,598
-
4038
Transistor, TO-220
3 (Rectangular)
0.100" (2.54mm)
Tin
-
Brass
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
100µin (2.54µm)
Brass
Polyester, Glass Filled
-
Molex, LLC
CONN SOCKET TRANSIST TO-220 3POS
Package: -
Stock2,304
-
-
Transistor, TO-220
3 (Rectangular)
-
Tin
100µin (2.54µm)
Brass
Through Hole
Closed Frame
Solder
-
Tin
100µin (2.54µm)
Brass
Polyamide (PA66), Nylon 6/6
-40°C ~ 80°C
Aries Electronics
CONN IC DIP SOCKET 14POS GOLD
Package: -
Stock3,888
-
Lo-PRO?file, C93
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 125°C
Aries Electronics
CONN SOCKET PLCC ZIF 84POS GOLD
Package: -
Stock7,848
-
536
PLCC, ZIF (ZIP)
84 (4 x 21)
0.050" (1.27mm)
Gold
12µin (0.30µm)
-
Through Hole
Open Frame
-
-
-
-
-
-
-
Aries Electronics
CONN SOCKET PLCC ZIF 68POS GOLD
Package: -
Stock7,740
-
536
PLCC, ZIF (ZIP)
68 (4 x 17)
0.050" (1.27mm)
Gold
12µin (0.30µm)
-
Through Hole
Open Frame
-
-
-
-
-
-
-
Aries Electronics
CONN SOCKET PLCC ZIF 44POS GOLD
Package: -
Stock3,618
-
536
PLCC, ZIF (ZIP)
44 (4 x 11)
0.050" (1.27mm)
Gold
12µin (0.30µm)
-
Through Hole
Open Frame
-
-
-
-
-
-
-