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Sockets for ICs, Transistors

Records 11083
Page  27/370
Image
Part Number
Manufacturer
Description
Package
Stock
Quantity
Package
Series
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
TE Connectivity AMP Connectors
CONN SOCKET PQFP 144POS TIN-LEAD
Package: -
Stock4,266
-
-
QFP
144 (4 x 36)
0.050" (1.27mm)
Tin-Lead
200µin (5.08µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Tin-Lead
200µin (5.08µm)
Phosphor Bronze
Liquid Crystal Polymer (LCP)
-
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 16POS GOLD
Package: -
Stock2,412
-
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Thermoplastic, Glass Filled
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 16POS GOLD
Package: -
Stock8,316
-
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Thermoplastic, Glass Filled
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 14POS GOLD
Package: -
Stock4,770
-
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Thermoplastic, Glass Filled
-55°C ~ 105°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 6POS GOLD
Package: -
Stock4,230
-
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
6 (2 x 3)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Thermoplastic, Glass Filled
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 40POS TIN
Package: -
Stock7,434
-
Diplomate DL
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Beryllium Copper
Thermoplastic, Glass Filled
-55°C ~ 105°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 28POS GOLD
Package: -
Stock7,164
-
Diplomate DL
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Thermoplastic, Glass Filled
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 20POS TIN
Package: -
Stock8,262
-
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Beryllium Copper
Thermoplastic
-55°C ~ 105°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 28POS GOLD
Package: -
Stock5,940
-
Diplomate DL
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Thermoplastic, Glass Filled
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 16POS TIN
Package: -
Stock2,448
-
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Beryllium Copper
-
-
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 14POS TIN
Package: -
Stock6,030
-
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Beryllium Copper
Thermoplastic, Glass Filled
-55°C ~ 105°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 40POS GOLD
Package: -
Stock3,366
-
Diplomate DL
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Thermoplastic, Glass Filled
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 28POS TIN
Package: -
Stock2,556
-
Diplomate DL
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Through Hole, Right Angle, Vertical
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Beryllium Copper
Thermoplastic, Glass Filled
-55°C ~ 105°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 28POS TIN
Package: -
Stock3,168
-
Diplomate DL
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Thermoplastic, Glass Filled
-55°C ~ 105°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 8POS GOLD
Package: -
Stock7,362
-
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Thermoplastic, Glass Filled
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 24POS GOLD
Package: -
Stock3,508
-
Diplomate DL
DIP, 0.6" (15.24mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Thermoplastic
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 28POS GOLD
Package: -
Stock6,750
-
Diplomate DL
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Thermoplastic, Glass Filled
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 28POS TIN
Package: -
Stock2,754
-
Diplomate DL
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Beryllium Copper
Thermoplastic, Glass Filled
-55°C ~ 105°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 20POS GOLD
Package: -
Stock5,202
-
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Thermoplastic, Glass Filled
-55°C ~ 105°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 16POS TIN
Package: -
Stock8,262
-
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Beryllium Copper
Thermoplastic, Glass Filled
-55°C ~ 105°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 8POS GOLD
Package: -
Stock7,650
-
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Thermoplastic, Glass Filled
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 8POS TIN
Package: -
Stock4,626
-
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Beryllium Copper
Thermoplastic, Glass Filled
-55°C ~ 105°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 14POS TIN
Package: -
Stock7,776
-
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Beryllium Copper
Thermoplastic, Glass Filled
-55°C ~ 105°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 28POS TIN
Package: -
Stock8,784
-
Diplomate DL
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Thermoplastic, Glass Filled
-55°C ~ 105°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 24POS GOLD
Package: -
Stock2,052
-
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Thermoplastic
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 32POS GOLD
Package: -
Stock4,482
-
Diplomate DL
DIP, 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Thermoplastic
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 24POS TIN
Package: -
Stock5,850
-
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Beryllium Copper
Thermoplastic
-55°C ~ 105°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 24POS GOLD
Package: -
Stock4,536
-
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Thermoplastic
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 32POS GOLD
Package: -
Stock2,718
-
Diplomate DL
DIP, 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Thermoplastic
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 32POS TIN
Package: -
Stock4,302
-
Diplomate DL
DIP, 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Beryllium Copper
Thermoplastic
-