SalesDept@topcomponents.cc +8613427370519
Login / Registro
Language Translation

* Please refer to the English Version as our Official Version.

Solicitação de cotação

Sockets for ICs, Transistors

Records 11083
Page  15/370
Image
Part Number
Manufacturer
Description
Package
Stock
Quantity
Package
Series
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
Amphenol FCI
CONN SOCKET SIP 4POS GOLD
Package: -
Stock2,178
-
SIP050-1x
SIP
4 (1 x 4)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-
Amphenol FCI
CONN SOCKET SIP 4POS TIN-LEAD
Package: -
Stock6,300
-
SPF080-1x
SIP
4 (1 x 4)
0.100" (2.54mm)
Tin-Lead
200µin (5.08µm)
-
Through Hole
Closed Frame
-
-
-
-
-
-
-
Amphenol FCI
CONN SOCKET SIP 2POS TIN
Package: -
Stock3,618
-
SIP050-1x
SIP
2 (1 x 2)
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-
Amphenol FCI
CONN IC DIP SOCKET 6POS GOLD
Package: -
Stock3,330
-
-
DIP, 0.3" (7.62mm) Row Spacing
6 (2 x 3)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-
Amphenol FCI
CONN SOCKET SIP 18POS TIN
Package: -
Stock4,806
-
SIP050-1x
SIP
18 (1 x 18)
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-
Amphenol FCI
CONN IC DIP SOCKET 28POS TIN
Package: -
Stock7,722
-
-
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Tin
100µin (2.54µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-
Amphenol FCI
CONN SOCKET SIP 20POS GOLD
Package: -
Stock7,974
-
SIP1x
SIP
20 (1 x 20)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-
Amphenol FCI
CONN SOCKET SIP 27POS TIN
Package: -
Stock8,226
-
SIP050-1x
SIP
27 (1 x 27)
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-
Amphenol FCI
CONN SOCKET SIP 4POS TIN
Package: -
Stock8,244
-
SIP050-1x
SIP
4 (1 x 4)
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-
Amphenol FCI
CONN IC DIP SOCKET 16POS TIN
Package: -
Stock3,132
-
-
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Tin
100µin (2.54µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-
Amphenol FCI
CONN IC DIP SOCKET 16POS GOLD
Package: -
Stock6,084
-
-
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-
Amphenol FCI
CONN IC DIP SOCKET 24POS GOLD
Package: -
Stock4,662
-
-
DIP, 0.3" (7.62mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-
Amphenol FCI
CONN IC DIP SOCKET 14POS GOLD
Package: -
Stock2,646
-
-
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-
Amphenol FCI
CONN SOCKET SIP 20POS GOLD
Package: -
Stock5,454
-
SIP1x
SIP
20 (1 x 20)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-
Amphenol FCI
CONN IC DIP SOCKET 24POS GOLD
Package: -
Stock8,712
-
-
DIP, 0.3" (7.62mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-
Amphenol FCI
CONN IC DIP SOCKET 16POS GOLD
Package: -
Stock7,092
-
-
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-
Amphenol FCI
CONN IC DIP SOCKET 18POS GOLD
Package: -
Stock8,802
-
-
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-
Amphenol FCI
CONN IC DIP SOCKET 28POS GOLD
Package: -
Stock6,426
-
-
DIP, 0.3" (7.62mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-
Amphenol FCI
CONN IC DIP SOCKET 24POS TIN
Package: -
Stock8,712
-
-
DIP, 0.3" (7.62mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Tin
100µin (2.54µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-
Amphenol FCI
CONN IC DIP SOCKET 28POS TIN
Package: -
Stock2,772
-
-
DIP, 0.3" (7.62mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Tin
100µin (2.54µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-
Amphenol FCI
CONN SOCKET SIP 17POS GOLD
Package: -
Stock4,788
-
SIP1x
SIP
17 (1 x 17)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-
Amphenol FCI
CONN SOCKET SIP 2POS GOLD
Package: -
Stock2,214
-
SIP1x
SIP
2 (1 x 2)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-
Amphenol FCI
CONN SOCKET SIP 10POS GOLD
Package: -
Stock2,052
-
SIP1x
SIP
10 (1 x 10)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-
Amphenol FCI
CONN SOCKET SIP 16POS GOLD
Package: -
Stock2,556
-
SIP1x
SIP
16 (1 x 16)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-
Amphenol FCI
CONN IC DIP SOCKET 40POS GOLD
Package: -
Stock4,392
-
-
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-
Amphenol FCI
CONN SOCKET SIP 20POS GOLD
Package: -
Stock3,294
-
SIP1x
SIP
20 (1 x 20)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-
Amphenol FCI
CONN IC DIP SOCKET 28POS GOLD
Package: -
Stock5,364
-
-
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-
Amphenol FCI
CONN IC DIP SOCKET 32POS GOLD
Package: -
Stock3,474
-
-
DIP, 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-
Amphenol FCI
CONN SOCKET SIP 11POS GOLD
Package: -
Stock4,626
-
SIP1x
SIP
11 (1 x 11)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-
Amphenol FCI
CONN SOCKET SIP 2POS GOLD
Package: -
Stock3,024
-
SIP1x
SIP
2 (1 x 2)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-