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Sockets for ICs, Transistors

Records 11083
Page  12/370
Image
Part Number
Manufacturer
Description
Package
Stock
Quantity
Package
Series
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
3M
CONN IC DIP SOCKET 28POS GOLD
Package: -
Stock2,394
-
100
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
8µin (0.20µm)
Beryllium Copper
Through Hole
Closed Frame, Seal Tape
Solder
0.100" (2.54mm)
Gold
Flash
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-65°C ~ 125°C
3M
CONN IC DIP SOCKET 28POS GOLD
Package: -
Stock3,726
-
100
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
8µin (0.20µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
Flash
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-65°C ~ 125°C
3M
CONN IC DIP SOCKET 24POS GOLD
Package: -
Stock6,750
-
100
DIP, 0.6" (15.24mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
8µin (0.20µm)
Beryllium Copper
Through Hole
Closed Frame, Seal Tape
Solder
0.100" (2.54mm)
Gold
Flash
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-65°C ~ 125°C
3M
CONN IC DIP SOCKET 22POS GOLD
Package: -
Stock2,178
-
100
DIP, 0.4" (10.16mm) Row Spacing
22 (2 x 11)
0.100" (2.54mm)
Gold
8µin (0.20µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
Flash
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-65°C ~ 125°C
3M
CONN IC DIP SOCKET 20POS GOLD
Package: -
Stock5,778
-
100
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
8µin (0.20µm)
Beryllium Copper
Through Hole
Closed Frame, Seal Tape
Solder
0.100" (2.54mm)
Gold
Flash
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-65°C ~ 125°C
3M
CONN IC DIP SOCKET 20POS GOLD
Package: -
Stock3,690
-
100
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
8µin (0.20µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
Flash
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-65°C ~ 125°C
3M
CONN IC DIP SOCKET 18POS GOLD
Package: -
Stock5,832
-
100
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Gold
8µin (0.20µm)
Beryllium Copper
Through Hole
Closed Frame, Seal Tape
Solder
0.100" (2.54mm)
Gold
Flash
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-65°C ~ 125°C
3M
CONN IC DIP SOCKET 18POS GOLD
Package: -
Stock8,280
-
100
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Gold
8µin (0.20µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
Flash
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-65°C ~ 125°C
3M
CONN IC DIP SOCKET 16POS GOLD
Package: -
Stock7,236
-
100
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
8µin (0.20µm)
Beryllium Copper
Through Hole
Closed Frame, Seal Tape
Solder
0.100" (2.54mm)
Gold
Flash
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-65°C ~ 125°C
3M
CONN IC DIP SOCKET 16POS GOLD
Package: -
Stock3,474
-
100
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
8µin (0.20µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
Flash
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-65°C ~ 125°C
3M
CONN IC DIP SOCKET 14POS GOLD
Package: -
Stock6,804
-
100
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
8µin (0.20µm)
Beryllium Copper
Through Hole
Closed Frame, Seal Tape
Solder
0.100" (2.54mm)
Gold
Flash
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-65°C ~ 125°C
3M
CONN IC DIP SOCKET 14POS GOLD
Package: -
Stock2,106
-
100
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
8µin (0.20µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
Flash
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-65°C ~ 125°C
3M
CONN IC DIP SOCKET 10POS GOLD
Package: -
Stock3,598
-
100
DIP, 0.3" (7.62mm) Row Spacing
10 (2 x 5)
0.100" (2.54mm)
Gold
8µin (0.20µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
Flash
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-65°C ~ 125°C
3M
CONN IC DIP SOCKET 8POS GOLD
Package: -
Stock4,158
-
100
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
8µin (0.20µm)
Beryllium Copper
Through Hole
Closed Frame, Seal Tape
Solder
0.100" (2.54mm)
Gold
Flash
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-65°C ~ 125°C
3M
CONN IC DIP SOCKET 8POS GOLD
Package: -
Stock3,490
-
100
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
8µin (0.20µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
Flash
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-65°C ~ 125°C
3M
CONN IC DIP SOCKET 6POS GOLD
Package: -
Stock8,100
-
100
DIP, 0.3" (7.62mm) Row Spacing
6 (2 x 3)
0.100" (2.54mm)
Gold
8µin (0.20µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
Flash
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-65°C ~ 125°C
Assmann WSW Components
CONN IC DIP SOCKET 28POS TIN
Package: -
Stock8,946
-
-
DIP, 0.3" (7.62mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT)
-55°C ~ 85°C
TE Connectivity AMP Connectors
CONN SOCKET PGA ZIF 479POS GOLD
Package: -
Stock3,438
-
-
PGA, ZIF (ZIP)
479 (26 x 26)
0.050" (1.27mm)
Gold
30µin (0.76µm)
Copper Alloy
Surface Mount
Open Frame
Solder
0.050" (1.27mm)
Gold
30µin (0.76µm)
Copper Alloy
Thermoplastic
-
TE Connectivity AMP Connectors
CONN SOCKET PGA 638POS GOLD
Package: -
Stock6,930
-
-
PGA
638 (26 x 26)
0.050" (1.27mm)
Gold
Flash
Copper Alloy
Surface Mount
Open Frame
Solder
0.050" (1.27mm)
Gold
-
Copper Alloy
Thermoplastic
-
TE Connectivity AMP Connectors
CONN SOCKET PGA ZIF 939POS GOLD
Package: -
Stock3,528
-
-
PGA, ZIF (ZIP)
939 (31 x 31)
0.050" (1.27mm)
Gold
15µin (0.38µm)
Copper Alloy
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Gold
15µin (0.38µm)
Copper Alloy
Thermoplastic
-
Amphenol FCI
CONN SOCKET SIP 2POS GOLD
Package: -
Stock3,600
-
SIP1x
SIP
2 (1 x 2)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-
Amphenol FCI
CONN IC DIP SOCKET 8POS TIN-LEAD
Package: -
Stock2,322
-
DPF3
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Tin-Lead
200µin (5.08µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-
Amphenol FCI
CONN IC DIP SOCKET 14POS TINLEAD
Package: -
Stock6,462
-
DPF3
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Tin-Lead
200µin (5.08µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-
Amphenol FCI
CONN IC DIP SOCKET 16POS TINLEAD
Package: -
Stock7,902
-
DPF3
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Tin-Lead
200µin (5.08µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-
Amphenol FCI
CONN SOCKET SIP 16POS GOLD
Package: -
Stock6,462
-
SIP1x
SIP
16 (1 x 16)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyphenylene Sulfide (PPS), Glass Filled
-
Amphenol FCI
CONN SOCKET SIP 27POS GOLD
Package: -
Stock3,024
-
SIP050-1x
SIP
27 (1 x 27)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-
Amphenol FCI
CONN SOCKET SIP 31POS TIN
Package: -
Stock7,128
-
SIP050-1x
SIP
31 (1 x 31)
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-
Amphenol FCI
CONN SOCKET SIP 21POS GOLD
Package: -
Stock3,618
-
SIP050-1x
SIP
21 (1 x 21)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-
Amphenol FCI
CONN SOCKET SIP 26POS GOLD
Package: -
Stock2,394
-
SIP050-1x
SIP
26 (1 x 26)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-
Amphenol FCI
CONN SOCKET SIP 30POS TIN
Package: -
Stock5,022
-
SIP050-1x
SIP
30 (1 x 30)
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-