* Please refer to the English Version as our Official Version.
Image |
Part Number |
Manufacturer |
Description |
Package |
Stock |
Quantity |
Package |
Series |
Type |
Number of Positions or Pins (Grid) |
Pitch - Mating |
Contact Finish - Mating |
Contact Finish Thickness - Mating |
Contact Material - Mating |
Mounting Type |
Features |
Termination |
Pitch - Post |
Contact Finish - Post |
Contact Finish Thickness - Post |
Contact Material - Post |
Housing Material |
Operating Temperature |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
3M |
CONN SOCKET SIP 32POS GOLD
|
Package: - |
Stock8,748 |
|
- |
- |
SIP |
32 (1 x 32) |
0.100" (2.54mm) |
Gold |
8µin (0.20µm) |
- |
Through Hole |
Closed Frame |
- |
0.100" (2.54mm) |
Gold |
8µin (0.20µm) |
- |
- |
- |
||
3M |
CONN IC DIP SOCKET 40POS GOLD
|
Package: - |
Stock4,968 |
|
- |
400 |
DIP, 0.6" (15.24mm) Row Spacing |
40 (2 x 20) |
0.100" (2.54mm) |
Gold |
8µin (0.20µm) |
- |
Through Hole |
Open Frame |
- |
0.100" (2.54mm) |
Gold |
8µin (0.20µm) |
- |
- |
- |
||
3M |
CONN IC DIP SOCKET 32POS GOLD
|
Package: - |
Stock7,452 |
|
- |
400 |
DIP, 0.6" (15.24mm) Row Spacing |
32 (2 x 16) |
0.100" (2.54mm) |
Gold |
8µin (0.20µm) |
- |
Through Hole |
Open Frame |
- |
0.100" (2.54mm) |
Gold |
8µin (0.20µm) |
- |
- |
- |
||
3M |
CONN IC DIP SOCKET 28POS GOLD
|
Package: - |
Stock8,226 |
|
- |
400 |
DIP, 0.6" (15.24mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Gold |
8µin (0.20µm) |
- |
Through Hole |
Open Frame |
- |
0.100" (2.54mm) |
Gold |
8µin (0.20µm) |
- |
- |
- |
||
3M |
CONN SOCKET SIP 32POS GOLD
|
Package: - |
Stock2,340 |
|
- |
300 |
SIP |
32 (1 x 32) |
0.100" (2.54mm) |
Gold |
8µin (0.20µm) |
- |
Through Hole |
Closed Frame |
- |
0.100" (2.54mm) |
Gold |
8µin (0.20µm) |
- |
- |
- |
||
3M |
CONN SOCKET SIP 14POS GOLD
|
Package: - |
Stock6,732 |
|
- |
300 |
SIP |
14 (1 x 14) |
0.100" (2.54mm) |
Gold |
8µin (0.20µm) |
- |
Through Hole |
Closed Frame |
- |
0.100" (2.54mm) |
Gold |
8µin (0.20µm) |
- |
- |
- |
||
3M |
CONN IC DIP SOCKET 28POS GOLD
|
Package: - |
Stock3,096 |
|
- |
100 |
DIP, 0.3" (7.62mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Gold |
8µin (0.20µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Gold |
Flash |
Brass |
Polyphenylene Sulfide (PPS), Glass Filled |
-65°C ~ 125°C |
||
3M |
CONN IC DIP SOCKET 24POS GOLD
|
Package: - |
Stock8,622 |
|
- |
100 |
DIP, 0.3" (7.62mm) Row Spacing |
24 (2 x 12) |
0.100" (2.54mm) |
Gold |
8µin (0.20µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Gold |
Flash |
Brass |
Polyphenylene Sulfide (PPS), Glass Filled |
-65°C ~ 125°C |
||
3M |
CONN IC DIP SOCKET 24POS GOLD
|
Package: - |
Stock2,412 |
|
- |
100 |
DIP, 0.4" (10.16mm) Row Spacing |
24 (2 x 12) |
0.100" (2.54mm) |
Gold |
8µin (0.20µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Gold |
Flash |
Brass |
Polyphenylene Sulfide (PPS), Glass Filled |
-65°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN SOCKET PQFP 100POS TIN-LEAD
|
Package: - |
Stock2,412 |
|
- |
- |
QFP |
100 (4 x 25) |
0.050" (1.27mm) |
Tin-Lead |
200µin (5.08µm) |
Phosphor Bronze |
Through Hole |
Closed Frame |
Solder |
0.050" (1.27mm) |
Tin-Lead |
200µin (5.08µm) |
Phosphor Bronze |
Liquid Crystal Polymer (LCP) |
- |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 28POS GOLD
|
Package: - |
Stock7,992 |
|
- |
Diplomate DL |
DIP, 0.6" (15.24mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Gold |
15µin (0.38µm) |
Phosphor Bronze |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Gold |
15µin (0.38µm) |
Phosphor Bronze |
Thermoplastic, Glass Filled |
-55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 32POS GOLD
|
Package: - |
Stock8,712 |
|
- |
Diplomate DL |
DIP, 0.6" (15.24mm) Row Spacing |
32 (2 x 16) |
0.100" (2.54mm) |
Gold |
15µin (0.38µm) |
Phosphor Bronze |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Gold |
15µin (0.38µm) |
Phosphor Bronze |
Thermoplastic, Glass Filled |
-55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 40POS GOLD
|
Package: - |
Stock3,852 |
|
- |
Diplomate DL |
DIP, 0.6" (15.24mm) Row Spacing |
40 (2 x 20) |
0.100" (2.54mm) |
Gold |
15µin (0.38µm) |
Phosphor Bronze |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Gold |
15µin (0.38µm) |
Phosphor Bronze |
Thermoplastic, Glass Filled |
-55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 24POS GOLD
|
Package: - |
Stock6,876 |
|
- |
Diplomate DL |
DIP, 0.6" (15.24mm) Row Spacing |
24 (2 x 12) |
0.100" (2.54mm) |
Gold |
15µin (0.38µm) |
Phosphor Bronze |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Gold |
15µin (0.38µm) |
Phosphor Bronze |
Thermoplastic, Glass Filled |
-55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 16POS GOLD
|
Package: - |
Stock5,706 |
|
- |
Diplomate DL |
DIP, 0.3" (7.62mm) Row Spacing |
16 (2 x 8) |
0.100" (2.54mm) |
Gold |
15µin (0.38µm) |
Phosphor Bronze |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Gold |
15µin (0.38µm) |
Phosphor Bronze |
Thermoplastic, Glass Filled |
-55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 24POS GOLD
|
Package: - |
Stock4,374 |
|
- |
Diplomate DL |
DIP, 0.6" (15.24mm) Row Spacing |
24 (2 x 12) |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Gold |
30µin (0.76µm) |
Beryllium Copper |
Thermoplastic, Glass Filled |
-55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 14POS GOLD
|
Package: - |
Stock4,860 |
|
- |
800 |
DIP, 0.3" (7.62mm) Row Spacing |
14 (2 x 7) |
0.100" (2.54mm) |
Gold |
25µin (0.63µm) |
Copper Alloy |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
- |
- |
- |
Polyester |
-55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 20POS GOLD
|
Package: - |
Stock3,490 |
|
- |
800 |
DIP, 0.3" (7.62mm) Row Spacing |
20 (2 x 10) |
0.100" (2.54mm) |
Gold |
25µin (0.63µm) |
Copper Alloy |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
- |
- |
- |
Polyester |
-55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 36POS GOLD
|
Package: - |
Stock7,938 |
|
- |
500 |
DIP, 0.6" (15.24mm) Row Spacing |
36 (2 x 18) |
0.100" (2.54mm) |
Gold |
25µin (0.63µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
- |
- |
Brass |
- |
-55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN SOCKET SIP 23POS TIN
|
Package: - |
Stock7,884 |
|
- |
Diplomate DL |
SIP |
23 (1 x 23) |
0.100" (2.54mm) |
Tin |
- |
Phosphor Bronze |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Phosphor Bronze |
Thermoplastic, Glass Filled |
-55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN SOCKET SIP 11POS TIN
|
Package: - |
Stock8,730 |
|
- |
Diplomate DL |
SIP |
11 (1 x 11) |
0.100" (2.54mm) |
Tin |
- |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Beryllium Copper |
Thermoplastic, Glass Filled |
-55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN SOCKET SIP 10POS TIN
|
Package: - |
Stock5,094 |
|
- |
Diplomate DL |
SIP |
10 (1 x 10) |
0.100" (2.54mm) |
Tin |
- |
Phosphor Bronze |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Phosphor Bronze |
Thermoplastic, Glass Filled |
-55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 16POS GOLD
|
Package: - |
Stock6,300 |
|
- |
800 |
DIP, 0.3" (7.62mm) Row Spacing |
16 (2 x 8) |
0.100" (2.54mm) |
Gold |
25µin (0.63µm) |
Copper Alloy |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
- |
- |
- |
Polyester |
-55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 64POS TIN
|
Package: - |
Stock8,658 |
|
- |
800 |
DIP, 0.9" (22.86mm) Row Spacing |
64 (2 x 32) |
0.100" (2.54mm) |
Tin |
- |
Copper Alloy |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
- |
- |
- |
Polyester |
-55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 16POS TIN
|
Package: - |
Stock8,982 |
|
- |
500 |
DIP, 0.3" (7.62mm) Row Spacing |
16 (2 x 8) |
0.100" (2.54mm) |
Tin |
- |
Copper Alloy |
Through Hole |
Closed Frame |
Wire Wrap |
0.100" (2.54mm) |
Tin |
- |
Copper Alloy |
- |
-55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN SOCKET SIP 3POS GOLD
|
Package: - |
Stock2,412 |
|
- |
500 |
SIP |
3 (1 x 3) |
0.100" (2.54mm) |
Gold |
- |
Beryllium Copper |
Through Hole |
- |
Solder |
0.100" (2.54mm) |
Gold |
- |
Beryllium Copper |
Thermoplastic |
- |
||
TE Connectivity AMP Connectors |
CONN TRANSIST TO-3 3POS GOLD
|
Package: - |
Stock5,904 |
|
- |
8060 |
Transistor, TO-3 |
3 (Oval) |
- |
Gold |
- |
Beryllium Copper |
Chassis Mount |
Closed Frame |
Solder |
- |
Gold |
- |
Beryllium Copper |
Polytetrafluoroethylene (PTFE) |
-55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN SOCKET SIP 16POS GOLD
|
Package: - |
Stock6,210 |
|
- |
500 |
SIP |
16 (1 x 16) |
0.100" (2.54mm) |
Gold |
- |
Beryllium Copper |
Through Hole |
- |
Solder |
0.100" (2.54mm) |
Gold |
- |
Beryllium Copper |
Thermoplastic |
- |
||
TE Connectivity AMP Connectors |
CONN TRANSIST TO-3 3POS TIN
|
Package: - |
Stock2,214 |
|
- |
8060 |
Transistor, TO-3 |
3 (Oval) |
- |
Tin |
- |
Beryllium Copper |
Chassis Mount |
Closed Frame |
Solder |
- |
Tin |
- |
Beryllium Copper |
Polytetrafluoroethylene (PTFE) |
-55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 20POS TIN
|
Package: - |
Stock8,622 |
|
- |
Diplomate DL |
DIP, 0.3" (7.62mm) Row Spacing |
20 (2 x 10) |
0.100" (2.54mm) |
Tin |
- |
Phosphor Bronze |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Phosphor Bronze |
Thermoplastic, Glass Filled |
-55°C ~ 105°C |