* Please refer to the English Version as our Official Version.
Image |
Part Number |
Manufacturer |
Description |
Package |
Stock |
Quantity |
Package |
Series |
Applications |
Current - Supply |
Voltage - Supply |
Operating Temperature |
Mounting Type |
Package / Case |
Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
POWER MANAGEMENT IC I.MX7 PRE-
|
Package: 48-VFQFN Exposed Pad |
Stock4,048 |
|
48-VFQFN Exposed Pad |
- |
LS1 Communication Processors |
450µA |
2.8 V ~ 4.5 V |
-40°C ~ 105°C (TA) |
Surface Mount |
48-VFQFN Exposed Pad |
48-QFN (7x7) |
||
NXP |
POWER MANAGEMENT IC I.MX7 PRE-
|
Package: 48-VFQFN Exposed Pad |
Stock4,832 |
|
48-VFQFN Exposed Pad |
- |
LS1 Communication Processors |
450µA |
2.8 V ~ 4.5 V |
-40°C ~ 105°C (TA) |
Surface Mount |
48-VFQFN Exposed Pad |
48-QFN (7x7) |
||
NXP |
POWER MANAGEMENT IC I.MX7 PRE-
|
Package: 48-VFQFN Exposed Pad |
Stock6,208 |
|
48-VFQFN Exposed Pad |
- |
LS1 Communication Processors |
450µA |
2.8 V ~ 4.5 V |
-40°C ~ 105°C (TA) |
Surface Mount |
48-VFQFN Exposed Pad |
48-QFN (7x7) |
||
NXP |
BUCK/BOOST HS-CAN/DUAL LIN SYSTE
|
Package: - |
Stock5,056 |
|
- |
* |
- |
- |
- |
- |
- |
- |
- |
||
NXP |
BUCK/BOOST HS-CAN/DUAL LIN SYSTE
|
Package: - |
Stock6,416 |
|
- |
* |
- |
- |
- |
- |
- |
- |
- |
||
NXP |
POWER MANAGEMENT IC I.MX7 PRE-
|
Package: 48-VFQFN Exposed Pad |
Stock5,104 |
|
48-VFQFN Exposed Pad |
- |
Processor |
- |
2.8 V ~ 5.5 V |
-40°C ~ 85°C |
Surface Mount |
48-VFQFN Exposed Pad |
48-QFN (7x7) |
||
NXP |
POWER MANAGEMENT IC I.MX7 PRE-
|
Package: 48-VFQFN Exposed Pad |
Stock5,856 |
|
48-VFQFN Exposed Pad |
- |
Processor |
- |
2.8 V ~ 5.5 V |
-40°C ~ 85°C |
Surface Mount |
48-VFQFN Exposed Pad |
48-QFN (7x7) |
||
NXP |
IC TRANSCEIVER
|
Package: - |
Stock4,576 |
|
- |
* |
- |
- |
- |
- |
- |
- |
- |
||
NXP |
IC TRANSCEIVER
|
Package: - |
Stock7,088 |
|
- |
* |
- |
- |
- |
- |
- |
- |
- |
||
NXP |
IC TRANSCEIVER
|
Package: - |
Stock6,576 |
|
- |
* |
- |
- |
- |
- |
- |
- |
- |
||
NXP |
IC TRANSCEIVER
|
Package: - |
Stock5,648 |
|
- |
* |
- |
- |
- |
- |
- |
- |
- |
||
NXP |
PF1510
|
Package: 40-VFQFN Exposed Pad |
Stock2,640 |
|
40-VFQFN Exposed Pad |
- |
Embedded Systems, Low-Power IoT, Mobile/Wearable Devices |
- |
3.8 V ~ 7 V |
-40°C ~ 105°C |
Surface Mount |
40-VFQFN Exposed Pad |
40-QFN (5x5) |
||
NXP |
PF1510
|
Package: 40-VFQFN Exposed Pad |
Stock4,624 |
|
40-VFQFN Exposed Pad |
- |
Embedded Systems, Low-Power IoT, Mobile/Wearable Devices |
- |
3.8 V ~ 7 V |
-40°C ~ 105°C |
Surface Mount |
40-VFQFN Exposed Pad |
40-QFN (5x5) |
||
NXP |
PF1510
|
Package: 40-VFQFN Exposed Pad |
Stock5,312 |
|
40-VFQFN Exposed Pad |
- |
Embedded Systems, Low-Power IoT, Mobile/Wearable Devices |
- |
3.8 V ~ 7 V |
-40°C ~ 105°C |
Surface Mount |
40-VFQFN Exposed Pad |
40-QFN (5x5) |
||
NXP |
PF1510
|
Package: 40-VFQFN Exposed Pad |
Stock5,408 |
|
40-VFQFN Exposed Pad |
- |
Embedded Systems, Low-Power IoT, Mobile/Wearable Devices |
- |
3.8 V ~ 7 V |
-40°C ~ 105°C |
Surface Mount |
40-VFQFN Exposed Pad |
40-QFN (5x5) |
||
NXP |
PF1510
|
Package: 40-VFQFN Exposed Pad |
Stock6,704 |
|
40-VFQFN Exposed Pad |
- |
Embedded Systems, Low-Power IoT, Mobile/Wearable Devices |
- |
3.8 V ~ 7 V |
-40°C ~ 105°C |
Surface Mount |
40-VFQFN Exposed Pad |
40-QFN (5x5) |
||
NXP |
PF1510
|
Package: 40-VFQFN Exposed Pad |
Stock3,472 |
|
40-VFQFN Exposed Pad |
- |
Embedded Systems, Low-Power IoT, Mobile/Wearable Devices |
- |
3.8 V ~ 7 V |
-40°C ~ 105°C |
Surface Mount |
40-VFQFN Exposed Pad |
40-QFN (5x5) |
||
NXP |
PF1510
|
Package: 40-VFQFN Exposed Pad |
Stock3,024 |
|
40-VFQFN Exposed Pad |
- |
Embedded Systems, Low-Power IoT, Mobile/Wearable Devices |
- |
3.8 V ~ 7 V |
-40°C ~ 105°C |
Surface Mount |
40-VFQFN Exposed Pad |
40-QFN (5x5) |
||
NXP |
BUCK/BOOST HS-CAN/DUAL LIN SYSTE
|
Package: - |
Stock2,960 |
|
- |
* |
- |
- |
- |
- |
- |
- |
- |
||
NXP |
BUCK/BOOST HS-CAN/DUAL LIN SYSTE
|
Package: - |
Stock3,904 |
|
- |
* |
- |
- |
- |
- |
- |
- |
- |
||
NXP |
IC TRANSCEIVER
|
Package: - |
Stock7,120 |
|
- |
* |
- |
- |
- |
- |
- |
- |
- |
||
NXP |
IC TRANSCEIVER
|
Package: - |
Stock5,408 |
|
- |
* |
- |
- |
- |
- |
- |
- |
- |
||
NXP |
POWER MANAGEMENT IC I.MX7 PRE-
|
Package: 48-VFQFN Exposed Pad |
Stock4,752 |
|
48-VFQFN Exposed Pad |
- |
i.MX Processors |
- |
2.8 V ~ 5.5 V |
-40°C ~ 85°C |
Surface Mount |
48-VFQFN Exposed Pad |
48-QFN (7x7) |
||
NXP |
POWER MANAGEMENT IC I.MX7 PRE-
|
Package: 48-VFQFN Exposed Pad |
Stock7,632 |
|
48-VFQFN Exposed Pad |
- |
i.MX Processors |
- |
2.8 V ~ 5.5 V |
-40°C ~ 85°C |
Surface Mount |
48-VFQFN Exposed Pad |
48-QFN (7x7) |
||
NXP |
POWER MANAGEMENT IC I.MX7 PRE-
|
Package: 48-VFQFN Exposed Pad |
Stock6,080 |
|
48-VFQFN Exposed Pad |
- |
i.MX Processors |
- |
2.8 V ~ 5.5 V |
-40°C ~ 85°C |
Surface Mount |
48-VFQFN Exposed Pad |
48-QFN (7x7) |
||
NXP |
POWER MANAGEMENT IC I.MX7 PRE-
|
Package: 48-VFQFN Exposed Pad |
Stock5,520 |
|
48-VFQFN Exposed Pad |
- |
i.MX Processors |
- |
2.8 V ~ 5.5 V |
-40°C ~ 85°C |
Surface Mount |
48-VFQFN Exposed Pad |
48-QFN (7x7) |
||
NXP |
POWER MANAGEMENT IC I.MX7 PRE-
|
Package: 48-VFQFN Exposed Pad |
Stock2,944 |
|
48-VFQFN Exposed Pad |
- |
i.MX Processors |
- |
2.8 V ~ 5.5 V |
-40°C ~ 85°C |
Surface Mount |
48-VFQFN Exposed Pad |
48-QFN (7x7) |
||
NXP |
POWER MANAGEMENT IC I.MX7 PRE-
|
Package: 48-VFQFN Exposed Pad |
Stock4,832 |
|
48-VFQFN Exposed Pad |
- |
i.MX Processors |
- |
2.8 V ~ 5.5 V |
-40°C ~ 85°C |
Surface Mount |
48-VFQFN Exposed Pad |
48-QFN (7x7) |
||
NXP |
POWER MANAGEMENT IC I.MX7 PRE-
|
Package: 48-VFQFN Exposed Pad |
Stock4,048 |
|
48-VFQFN Exposed Pad |
- |
i.MX Processors |
- |
2.8 V ~ 5.5 V |
-40°C ~ 85°C |
Surface Mount |
48-VFQFN Exposed Pad |
48-QFN (7x7) |
||
NXP |
POWER MANAGEMENT IC I.MX7 PRE-
|
Package: 48-VFQFN Exposed Pad |
Stock5,232 |
|
48-VFQFN Exposed Pad |
- |
i.MX Processors |
- |
2.8 V ~ 5.5 V |
-40°C ~ 85°C |
Surface Mount |
48-VFQFN Exposed Pad |
48-QFN (7x7) |