* Please refer to the English Version as our Official Version.
Image |
Part Number |
Manufacturer |
Description |
Package |
Stock |
Quantity |
Package |
Series |
Applications |
Current - Supply |
Voltage - Supply |
Operating Temperature |
Mounting Type |
Package / Case |
Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
SYSTEM BASIS CHIP DCDC 0.8A VCO
|
Package: 48-LQFP Exposed Pad |
Stock5,376 |
|
48-LQFP Exposed Pad |
- |
System Basis Chip |
- |
-1.0 V ~ 40 V |
-40°C ~ 150°C (TA) |
Surface Mount |
48-LQFP Exposed Pad |
48-LQFP (7x7) |
||
NXP |
SYSTEM BASIS CHIP DCDC 0.8A VCO
|
Package: 48-LQFP Exposed Pad |
Stock7,568 |
|
48-LQFP Exposed Pad |
- |
System Basis Chip |
- |
-1.0 V ~ 40 V |
-40°C ~ 125°C (TA) |
Surface Mount |
48-LQFP Exposed Pad |
48-LQFP (7x7) |
||
NXP |
FS4500
|
Package: 48-LQFP Exposed Pad |
Stock5,136 |
|
48-LQFP Exposed Pad |
- |
System Basis Chip |
- |
-1.0 V ~ 40 V |
-40°C ~ 150°C (TA) |
Surface Mount |
48-LQFP Exposed Pad |
48-LQFP (7x7) |
||
NXP |
SYSTEM BASIS CHIP DCDC 2.2A VCO
|
Package: 48-LQFP Exposed Pad |
Stock6,080 |
|
48-LQFP Exposed Pad |
- |
System Basis Chip |
- |
-1.0 V ~ 40 V |
-40°C ~ 125°C (TA) |
Surface Mount |
48-LQFP Exposed Pad |
48-LQFP (7x7) |
||
NXP |
SYSTEM BASIS CHIP LINEAR 0.5A V
|
Package: 48-LQFP Exposed Pad |
Stock5,696 |
|
48-LQFP Exposed Pad |
- |
System Basis Chip |
- |
-1.0 V ~ 40 V |
-40°C ~ 125°C (TA) |
Surface Mount |
48-LQFP Exposed Pad |
48-LQFP (7x7) |
||
NXP |
15W SINGLE-COIL CONSUMER STAND
|
Package: - |
Stock4,256 |
|
- |
* |
- |
- |
- |
- |
- |
- |
- |
||
NXP |
REGULATOR BUCK QUAD WITH UP TO
|
Package: 56-VFQFN Exposed Pad |
Stock6,336 |
|
56-VFQFN Exposed Pad |
Automotive, AEC-Q100 |
QorlQ LS1/T1 Communications Processors |
250µA |
2.8 V ~ 4.5 V |
-40°C ~ 105°C (TA) |
Surface Mount |
56-VFQFN Exposed Pad |
56-QFN-EP (8x8) |
||
NXP |
REGULATOR BUCK QUAD WITH UP TO
|
Package: 56-VFQFN Exposed Pad |
Stock4,656 |
|
56-VFQFN Exposed Pad |
Automotive, AEC-Q100 |
QorlQ LS1/T1 Communications Processors |
250µA |
2.8 V ~ 4.5 V |
-40°C ~ 105°C (TA) |
Surface Mount |
56-VFQFN Exposed Pad |
56-QFN-EP (8x8) |
||
NXP |
REGULATOR BUCK QUAD WITH UP TO
|
Package: 56-VFQFN Exposed Pad |
Stock5,856 |
|
56-VFQFN Exposed Pad |
Automotive, AEC-Q100 |
QorlQ LS1/T1 Communications Processors |
250µA |
2.8 V ~ 4.5 V |
-40°C ~ 105°C (TA) |
Surface Mount |
56-VFQFN Exposed Pad |
56-QFN-EP (8x8) |
||
NXP |
REGULATOR BUCK QUAD WITH UP TO
|
Package: 56-VFQFN Exposed Pad |
Stock3,904 |
|
56-VFQFN Exposed Pad |
Automotive, AEC-Q100 |
QorlQ LS1/T1 Communications Processors |
250µA |
2.8 V ~ 4.5 V |
-40°C ~ 105°C (TA) |
Surface Mount |
56-VFQFN Exposed Pad |
56-QFN-EP (8x8) |
||
NXP |
REGULATOR BUCK QUAD WITH UP TO
|
Package: 56-VFQFN Exposed Pad |
Stock7,328 |
|
56-VFQFN Exposed Pad |
Automotive, AEC-Q100 |
QorlQ LS1/T1 Communications Processors |
250µA |
2.8 V ~ 4.5 V |
-40°C ~ 105°C (TA) |
Surface Mount |
56-VFQFN Exposed Pad |
56-QFN-EP (8x8) |
||
NXP |
FS6500
|
Package: 48-LQFP Exposed Pad |
Stock4,400 |
|
48-LQFP Exposed Pad |
- |
System Basis Chip |
- |
-1.0 V ~ 40 V |
-40°C ~ 150°C (TA) |
Surface Mount |
48-LQFP Exposed Pad |
48-LQFP (7x7) |
||
NXP |
SYSTEM BASIS CHIP DCDC 1.5A VCO
|
Package: 48-LQFP Exposed Pad |
Stock5,616 |
|
48-LQFP Exposed Pad |
- |
System Basis Chip |
- |
-1.0 V ~ 40 V |
-40°C ~ 125°C (TA) |
Surface Mount |
48-LQFP Exposed Pad |
48-LQFP (7x7) |
||
NXP |
FS6500
|
Package: 48-LQFP Exposed Pad |
Stock4,160 |
|
48-LQFP Exposed Pad |
- |
System Basis Chip |
- |
-1.0 V ~ 40 V |
-40°C ~ 150°C (TA) |
Surface Mount |
48-LQFP Exposed Pad |
48-LQFP (7x7) |
||
NXP |
SYSTEM BASIS CHIP DCDC 0.8A VCO
|
Package: 48-LQFP Exposed Pad |
Stock5,504 |
|
48-LQFP Exposed Pad |
- |
System Basis Chip |
- |
-1.0 V ~ 40 V |
-40°C ~ 125°C (TA) |
Surface Mount |
48-LQFP Exposed Pad |
48-LQFP (7x7) |
||
NXP |
SYSTEM BASIS CHIP CAN 5V 1.5
|
Package: 48-LQFP Exposed Pad |
Stock5,040 |
|
48-LQFP Exposed Pad |
- |
System Basis Chip |
13mA |
2.7 V ~ 36 V |
-40°C ~ 125°C |
Surface Mount |
48-LQFP Exposed Pad |
48-LQFP (7x7) |
||
NXP |
FS4500
|
Package: 48-LQFP Exposed Pad |
Stock7,136 |
|
48-LQFP Exposed Pad |
- |
System Basis Chip |
- |
-1.0 V ~ 40 V |
-40°C ~ 150°C (TA) |
Surface Mount |
48-LQFP Exposed Pad |
48-LQFP (7x7) |
||
NXP |
POWER MANAGEMENT IC I.MX7 PRE-
|
Package: 48-VFQFN Exposed Pad |
Stock4,944 |
|
48-VFQFN Exposed Pad |
- |
i.MX Processors |
- |
2.8 V ~ 5.5 V |
-40°C ~ 105°C |
Surface Mount |
48-VFQFN Exposed Pad |
48-QFN (7x7) |
||
NXP |
POWER MANAGEMENT IC I.MX7 PRE-
|
Package: 48-VFQFN Exposed Pad |
Stock6,784 |
|
48-VFQFN Exposed Pad |
- |
i.MX Processors |
- |
2.8 V ~ 5.5 V |
-40°C ~ 105°C |
Surface Mount |
48-VFQFN Exposed Pad |
48-QFN (7x7) |
||
NXP |
POWER MANAGEMENT IC I.MX7 PRE-
|
Package: 48-VFQFN Exposed Pad |
Stock6,144 |
|
48-VFQFN Exposed Pad |
- |
i.MX Processors |
- |
2.8 V ~ 5.5 V |
-40°C ~ 105°C |
Surface Mount |
48-VFQFN Exposed Pad |
48-QFN (7x7) |
||
NXP |
POWER MANAGEMENT IC I.MX7 PRE-
|
Package: 48-VFQFN Exposed Pad |
Stock5,552 |
|
48-VFQFN Exposed Pad |
- |
i.MX Processors |
- |
2.8 V ~ 5.5 V |
-40°C ~ 105°C |
Surface Mount |
48-VFQFN Exposed Pad |
48-QFN (7x7) |
||
NXP |
POWER MANAGEMENT IC I.MX7 PRE-
|
Package: 48-VFQFN Exposed Pad |
Stock6,736 |
|
48-VFQFN Exposed Pad |
- |
i.MX Processors |
- |
2.8 V ~ 5.5 V |
-40°C ~ 105°C |
Surface Mount |
48-VFQFN Exposed Pad |
48-QFN (7x7) |
||
NXP |
SYSTEM BASIS CHIP LINEAR 0.5A V
|
Package: 48-LQFP Exposed Pad |
Stock2,144 |
|
48-LQFP Exposed Pad |
- |
System Basis Chip |
- |
-1.0 V ~ 40 V |
-40°C ~ 125°C (TA) |
Surface Mount |
48-LQFP Exposed Pad |
48-LQFP (7x7) |
||
NXP |
SYSTEM BASIS CHIP CAN 5V 0.7
|
Package: 48-LQFP Exposed Pad |
Stock5,536 |
|
48-LQFP Exposed Pad |
- |
System Basis Chip |
13mA |
2.7 V ~ 36 V |
-40°C ~ 125°C |
Surface Mount |
48-LQFP Exposed Pad |
48-LQFP (7x7) |
||
NXP |
POWER MANAGEMENT IC I.MX7 PRE-
|
Package: 48-VFQFN Exposed Pad |
Stock7,616 |
|
48-VFQFN Exposed Pad |
- |
i.MX Processors |
- |
2.8 V ~ 5.5 V |
-40°C ~ 105°C |
Surface Mount |
48-VFQFN Exposed Pad |
48-QFN (7x7) |
||
NXP |
TRANSFORMER PHYSICAL LAYER
|
Package: 16-SOIC (0.154", 3.90mm Width) |
Stock4,128 |
|
16-SOIC (0.154", 3.90mm Width) |
- |
Isolated Communications Interface |
40mA |
4.5 V ~ 7 V |
-40°C ~ 125°C (TA) |
Surface Mount |
16-SOIC (0.154", 3.90mm Width) |
16-SOIC |
||
NXP |
POWER MANAGEMENT IC I.MX7 PRE-
|
Package: 48-VFQFN Exposed Pad |
Stock5,056 |
|
48-VFQFN Exposed Pad |
- |
i.MX Processors |
- |
2.8 V ~ 5.5 V |
-40°C ~ 85°C |
Surface Mount |
48-VFQFN Exposed Pad |
48-QFN (7x7) |
||
NXP |
POWER MANAGEMENT IC I.MX7 PRE-
|
Package: 48-VFQFN Exposed Pad |
Stock3,232 |
|
48-VFQFN Exposed Pad |
- |
i.MX Processors |
- |
2.8 V ~ 5.5 V |
-40°C ~ 85°C |
Surface Mount |
48-VFQFN Exposed Pad |
48-QFN (7x7) |
||
NXP |
PF1550
|
Package: 40-VFQFN Exposed Pad |
Stock4,912 |
|
40-VFQFN Exposed Pad |
- |
Embedded Systems, Low-Power IoT, Mobile/Wearable Devices |
- |
3.8 V ~ 7 V |
-40°C ~ 105°C |
Surface Mount |
40-VFQFN Exposed Pad |
40-QFN (5x5) |
||
NXP |
PF1550
|
Package: 40-VFQFN Exposed Pad |
Stock5,696 |
|
40-VFQFN Exposed Pad |
- |
Embedded Systems, Low-Power IoT, Mobile/Wearable Devices |
- |
3.8 V ~ 7 V |
-40°C ~ 105°C |
Surface Mount |
40-VFQFN Exposed Pad |
40-QFN (5x5) |