* Please refer to the English Version as our Official Version.
Image |
Part Number |
Manufacturer |
Description |
Package |
Stock |
Quantity |
Package |
Series |
Type |
Number of Elements |
Output Type |
Voltage - Supply, Single/Dual (±) |
Voltage - Input Offset (Max) |
Current - Input Bias (Max) |
Current - Output (Typ) |
Current - Quiescent (Max) |
CMRR, PSRR (Typ) |
Propagation Delay (Max) |
Hysteresis |
Operating Temperature |
Package / Case |
Mounting Type |
Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC COMP OPENDRN 1.6V DUAL 8-MSOP
|
Package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock200,328 |
|
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
- |
General Purpose |
2 |
CMOS, Open-Drain, Rail-to-Rail, TTL |
1.6 V ~ 5.5 V |
7mV @ 5.5V |
1pA @ 5.5V |
30mA |
1µA |
70dB CMRR, 80dB PSRR |
8µs |
6.5mV |
-40°C ~ 85°C |
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Surface Mount |
8-MSOP |
||
Microchip Technology |
IC COMP PUSHPULL 1.6V DUAL 8-DIP
|
Package: 8-DIP (0.300", 7.62mm) |
Stock17,436 |
|
8-DIP (0.300", 7.62mm) |
- |
General Purpose |
2 |
CMOS, Push-Pull, Rail-to-Rail, TTL |
1.6 V ~ 5.5 V |
7mV @ 5.5V |
1pA @ 5.5V |
- |
1µA |
70dB CMRR, 80dB PSRR |
8µs |
6.5mV |
-40°C ~ 85°C |
8-DIP (0.300", 7.62mm) |
Through Hole |
8-PDIP |
||
Microchip Technology |
IC COMP OPENDRN 1.6V DUAL 8-DIP
|
Package: 8-DIP (0.300", 7.62mm) |
Stock3,136 |
|
8-DIP (0.300", 7.62mm) |
- |
General Purpose |
2 |
CMOS, Open-Drain, Rail-to-Rail, TTL |
1.6 V ~ 5.5 V |
7mV @ 5.5V |
1pA @ 5.5V |
30mA |
1µA |
70dB CMRR, 80dB PSRR |
8µs |
6.5mV |
-40°C ~ 85°C |
8-DIP (0.300", 7.62mm) |
Through Hole |
8-PDIP |
||
Microchip Technology |
IC COMP PUSHPULL 1.6V DUAL 8MSOP
|
Package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock32,904 |
|
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
- |
General Purpose |
2 |
CMOS, Push-Pull, Rail-to-Rail, TTL |
1.6 V ~ 5.5 V |
7mV @ 5.5V |
1pA @ 5.5V |
- |
1µA |
70dB CMRR, 80dB PSRR |
8µs |
6.5mV |
-40°C ~ 85°C |
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Surface Mount |
8-MSOP |
||
Microchip Technology |
IC COMP OPENDRN 1.6V DUAL 8-MSOP
|
Package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock235,908 |
|
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
- |
General Purpose |
2 |
CMOS, Open-Drain, Rail-to-Rail, TTL |
1.6 V ~ 5.5 V |
7mV @ 5.5V |
1pA @ 5.5V |
30mA |
1µA |
70dB CMRR, 80dB PSRR |
8µs |
6.5mV |
-40°C ~ 85°C |
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Surface Mount |
8-MSOP |
||
Microchip Technology |
IC COMP SNGL W/REF SC70-5
|
Package: 5-TSSOP, SC-70-5, SOT-353 |
Stock6,192 |
|
5-TSSOP, SC-70-5, SOT-353 |
Teeny? |
with Voltage Reference |
1 |
Open Drain |
1.5 V ~ 5.5 V |
- |
- |
20mA |
3µA |
- |
12µs |
20mV |
-40°C ~ 85°C |
5-TSSOP, SC-70-5, SOT-353 |
Surface Mount |
SC-70-5 |
||
Microchip Technology |
IC COMP 1.6V SGL P-P W/CS 8-SOIC
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock2,496 |
|
8-SOIC (0.154", 3.90mm Width) |
- |
General Purpose |
1 |
CMOS, Push-Pull, Rail-to-Rail, TTL |
1.6 V ~ 5.5 V |
7mV @ 5.5V |
1pA @ 5.5V |
- |
1µA |
70dB CMRR, 80dB PSRR |
8µs |
6.5mV |
-40°C ~ 125°C |
8-SOIC (0.154", 3.90mm Width) |
Surface Mount |
8-SOIC |
||
Microchip Technology |
IC COMP 1.6V SNGL P-P W/CS 8MSOP
|
Package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock2,384 |
|
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
- |
General Purpose |
1 |
CMOS, Push-Pull, Rail-to-Rail, TTL |
1.6 V ~ 5.5 V |
7mV @ 5.5V |
1pA @ 5.5V |
- |
1µA |
70dB CMRR, 80dB PSRR |
8µs |
6.5mV |
-40°C ~ 125°C |
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Surface Mount |
8-MSOP |
||
Microchip Technology |
IC COMP 1.6V SNGL P-P W/CS 8MSOP
|
Package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock19,188 |
|
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
- |
General Purpose |
1 |
CMOS, Push-Pull, Rail-to-Rail, TTL |
1.6 V ~ 5.5 V |
7mV @ 5.5V |
1pA @ 5.5V |
- |
1µA |
70dB CMRR, 80dB PSRR |
8µs |
6.5mV |
-40°C ~ 125°C |
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Surface Mount |
8-MSOP |
||
Microchip Technology |
IC COMP 1.6V SNGL O-D W/CS 8MSOP
|
Package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock6,944 |
|
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
- |
General Purpose |
1 |
CMOS, Open-Drain, Rail-to-Rail, TTL |
1.6 V ~ 5.5 V |
7mV @ 5.5V |
1pA @ 5.5V |
30mA |
1µA |
70dB CMRR, 80dB PSRR |
8µs |
6.5mV |
-40°C ~ 125°C |
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Surface Mount |
8-MSOP |
||
Microchip Technology |
IC COMP 1.6V SGL O-D W/CS 8MSOP
|
Package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock5,072 |
|
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
- |
General Purpose |
1 |
CMOS, Open-Drain, Rail-to-Rail, TTL |
1.6 V ~ 5.5 V |
7mV @ 5.5V |
1pA @ 5.5V |
30mA |
1µA |
70dB CMRR, 80dB PSRR |
8µs |
6.5mV |
-40°C ~ 125°C |
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Surface Mount |
8-MSOP |
||
Microchip Technology |
IC COMP 1.6V SNGL P-P W/CS 8SOIC
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock17,700 |
|
8-SOIC (0.154", 3.90mm Width) |
- |
General Purpose |
1 |
CMOS, Push-Pull, Rail-to-Rail, TTL |
1.6 V ~ 5.5 V |
7mV @ 5.5V |
1pA @ 5.5V |
- |
1µA |
70dB CMRR, 80dB PSRR |
8µs |
6.5mV |
-40°C ~ 125°C |
8-SOIC (0.154", 3.90mm Width) |
Surface Mount |
8-SOIC |
||
Microchip Technology |
IC COMP 1.6V SNGL P-P W/CS 8DIP
|
Package: 8-DIP (0.300", 7.62mm) |
Stock4,304 |
|
8-DIP (0.300", 7.62mm) |
- |
General Purpose |
1 |
CMOS, Push-Pull, Rail-to-Rail, TTL |
1.6 V ~ 5.5 V |
7mV @ 5.5V |
1pA @ 5.5V |
- |
1µA |
70dB CMRR, 80dB PSRR |
8µs |
6.5mV |
-40°C ~ 125°C |
8-DIP (0.300", 7.62mm) |
Through Hole |
8-PDIP |
||
Microchip Technology |
IC COMP 1.6V SGL O-D W/CS 8SOIC
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock2,352 |
|
8-SOIC (0.154", 3.90mm Width) |
- |
General Purpose |
1 |
CMOS, Open-Drain, Rail-to-Rail, TTL |
1.6 V ~ 5.5 V |
7mV @ 5.5V |
1pA @ 5.5V |
30mA |
1µA |
70dB CMRR, 80dB PSRR |
8µs |
6.5mV |
-40°C ~ 125°C |
8-SOIC (0.154", 3.90mm Width) |
Surface Mount |
8-SOIC |
||
Microchip Technology |
IC COMP 1.6V SNGL O-D W/CS 8SOIC
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock5,392 |
|
8-SOIC (0.154", 3.90mm Width) |
- |
General Purpose |
1 |
CMOS, Open-Drain, Rail-to-Rail, TTL |
1.6 V ~ 5.5 V |
7mV @ 5.5V |
1pA @ 5.5V |
30mA |
1µA |
70dB CMRR, 80dB PSRR |
8µs |
6.5mV |
-40°C ~ 125°C |
8-SOIC (0.154", 3.90mm Width) |
Surface Mount |
8-SOIC |
||
Microchip Technology |
IC COMP OPENDRN 1.6V SNGL 8-SOIC
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock7,872 |
|
8-SOIC (0.154", 3.90mm Width) |
- |
General Purpose |
1 |
CMOS, Open-Drain, Rail-to-Rail, TTL |
1.6 V ~ 5.5 V |
7mV @ 5.5V |
1pA @ 5.5V |
30mA |
1µA |
70dB CMRR, 80dB PSRR |
8µs |
6.5mV |
-40°C ~ 85°C |
8-SOIC (0.154", 3.90mm Width) |
Surface Mount |
8-SOIC |
||
Microchip Technology |
IC COMP PP I/O SNGL 1.6V 8SOIC
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock3,840 |
|
8-SOIC (0.154", 3.90mm Width) |
- |
General Purpose |
1 |
CMOS, Push-Pull, Rail-to-Rail, TTL |
1.6 V ~ 5.5 V |
7mV @ 5.5V |
1pA @ 5.5V |
- |
1µA |
70dB CMRR, 80dB PSRR |
8µs |
6.5mV |
-40°C ~ 85°C |
8-SOIC (0.154", 3.90mm Width) |
Surface Mount |
8-SOIC |
||
Microchip Technology |
IC COMP PP I/O SNGL 1.6V 8MSOP
|
Package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock6,640 |
|
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
- |
General Purpose |
1 |
CMOS, Push-Pull, Rail-to-Rail, TTL |
1.6 V ~ 5.5 V |
7mV @ 5.5V |
1pA @ 5.5V |
- |
1µA |
70dB CMRR, 80dB PSRR |
8µs |
6.5mV |
-40°C ~ 85°C |
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Surface Mount |
8-MSOP |
||
Microchip Technology |
IC COMP OPENDRN 1.6V SNGL 8-MSOP
|
Package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock7,776 |
|
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
- |
General Purpose |
1 |
CMOS, Open-Drain, Rail-to-Rail, TTL |
1.6 V ~ 5.5 V |
7mV @ 5.5V |
1pA @ 5.5V |
30mA |
1µA |
70dB CMRR, 80dB PSRR |
8µs |
6.5mV |
-40°C ~ 85°C |
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Surface Mount |
8-MSOP |
||
Microchip Technology |
IC COMP OPENDRN 1.6V SNGL 8-SOIC
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock12,132 |
|
8-SOIC (0.154", 3.90mm Width) |
- |
General Purpose |
1 |
CMOS, Open-Drain, Rail-to-Rail, TTL |
1.6 V ~ 5.5 V |
7mV @ 5.5V |
1pA @ 5.5V |
30mA |
1µA |
70dB CMRR, 80dB PSRR |
8µs |
6.5mV |
-40°C ~ 85°C |
8-SOIC (0.154", 3.90mm Width) |
Surface Mount |
8-SOIC |
||
Microchip Technology |
IC COMP PP I/O SNGL 1.6V 8SOIC
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock31,272 |
|
8-SOIC (0.154", 3.90mm Width) |
- |
General Purpose |
1 |
CMOS, Push-Pull, Rail-to-Rail, TTL |
1.6 V ~ 5.5 V |
7mV @ 5.5V |
1pA @ 5.5V |
- |
1µA |
70dB CMRR, 80dB PSRR |
8µs |
6.5mV |
-40°C ~ 85°C |
8-SOIC (0.154", 3.90mm Width) |
Surface Mount |
8-SOIC |
||
Microchip Technology |
IC COMP OPENDRN 1.6V SNGL 8-DIP
|
Package: 8-DIP (0.300", 7.62mm) |
Stock3,776 |
|
8-DIP (0.300", 7.62mm) |
- |
General Purpose |
1 |
CMOS, Open-Drain, Rail-to-Rail, TTL |
1.6 V ~ 5.5 V |
7mV @ 5.5V |
1pA @ 5.5V |
30mA |
1µA |
70dB CMRR, 80dB PSRR |
8µs |
6.5mV |
-40°C ~ 85°C |
8-DIP (0.300", 7.62mm) |
Through Hole |
8-PDIP |
||
Microchip Technology |
IC COMP PP I/O SNGL 1.6V 8DIP
|
Package: 8-DIP (0.300", 7.62mm) |
Stock5,088 |
|
8-DIP (0.300", 7.62mm) |
- |
General Purpose |
1 |
CMOS, Push-Pull, Rail-to-Rail, TTL |
1.6 V ~ 5.5 V |
7mV @ 5.5V |
1pA @ 5.5V |
- |
1µA |
70dB CMRR, 80dB PSRR |
8µs |
6.5mV |
-40°C ~ 85°C |
8-DIP (0.300", 7.62mm) |
Through Hole |
8-PDIP |
||
Microchip Technology |
IC COMP PP I/O SNGL 1.6V 8MSOP
|
Package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock5,056 |
|
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
- |
General Purpose |
1 |
CMOS, Push-Pull, Rail-to-Rail, TTL |
1.6 V ~ 5.5 V |
7mV @ 5.5V |
1pA @ 5.5V |
- |
1µA |
70dB CMRR, 80dB PSRR |
8µs |
6.5mV |
-40°C ~ 85°C |
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Surface Mount |
8-MSOP |
||
Microchip Technology |
IC COMP 1.6V SNGL O-D 8DIP
|
Package: 8-DIP (0.300", 7.62mm) |
Stock7,664 |
|
8-DIP (0.300", 7.62mm) |
- |
General Purpose |
1 |
CMOS, Open-Drain, Rail-to-Rail, TTL |
1.6 V ~ 5.5 V |
7mV @ 5.5V |
1pA @ 5.5V |
30mA |
1µA |
70dB CMRR, 80dB PSRR |
8µs |
6.5mV |
-40°C ~ 125°C |
8-DIP (0.300", 7.62mm) |
Through Hole |
8-PDIP |
||
Microchip Technology |
IC COMP 1.6V SGL P-P 8-MSOP
|
Package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock4,384 |
|
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
- |
General Purpose |
1 |
CMOS, Push-Pull, Rail-to-Rail, TTL |
1.6 V ~ 5.5 V |
7mV @ 5.5V |
1pA @ 5.5V |
- |
1µA |
70dB CMRR, 80dB PSRR |
8µs |
6.5mV |
-40°C ~ 125°C |
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Surface Mount |
8-MSOP |
||
Microchip Technology |
IC COMP 1.6V SNGL O-D 8MSOP
|
Package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock6,304 |
|
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
- |
General Purpose |
1 |
CMOS, Open-Drain, Rail-to-Rail, TTL |
1.6 V ~ 5.5 V |
7mV @ 5.5V |
1pA @ 5.5V |
30mA |
1µA |
70dB CMRR, 80dB PSRR |
8µs |
6.5mV |
-40°C ~ 125°C |
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Surface Mount |
8-MSOP |
||
Microchip Technology |
IC COMP 1.6V SNGL P-P 8MSOP
|
Package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock6,272 |
|
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
- |
General Purpose |
1 |
CMOS, Push-Pull, Rail-to-Rail, TTL |
1.6 V ~ 5.5 V |
7mV @ 5.5V |
1pA @ 5.5V |
- |
1µA |
70dB CMRR, 80dB PSRR |
8µs |
6.5mV |
-40°C ~ 125°C |
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Surface Mount |
8-MSOP |
||
Microchip Technology |
IC COMP 1.6V SNGL O-D 8SOIC
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock7,232 |
|
8-SOIC (0.154", 3.90mm Width) |
- |
General Purpose |
1 |
CMOS, Open-Drain, Rail-to-Rail, TTL |
1.6 V ~ 5.5 V |
7mV @ 5.5V |
1pA @ 5.5V |
30mA |
1µA |
70dB CMRR, 80dB PSRR |
8µs |
6.5mV |
-40°C ~ 125°C |
8-SOIC (0.154", 3.90mm Width) |
Surface Mount |
8-SOIC |
||
Microchip Technology |
IC COMP 1.6V SNGL O-D 8SOIC
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock4,976 |
|
8-SOIC (0.154", 3.90mm Width) |
- |
General Purpose |
1 |
CMOS, Open-Drain, Rail-to-Rail, TTL |
1.6 V ~ 5.5 V |
7mV @ 5.5V |
1pA @ 5.5V |
30mA |
1µA |
70dB CMRR, 80dB PSRR |
8µs |
6.5mV |
-40°C ~ 125°C |
8-SOIC (0.154", 3.90mm Width) |
Surface Mount |
8-SOIC |