* Please refer to the English Version as our Official Version.
Image |
Part Number |
Manufacturer |
Description |
Package |
Stock |
Quantity |
Package |
Series |
Type |
Number of Elements |
Output Type |
Voltage - Supply, Single/Dual (±) |
Voltage - Input Offset (Max) |
Current - Input Bias (Max) |
Current - Output (Typ) |
Current - Quiescent (Max) |
CMRR, PSRR (Typ) |
Propagation Delay (Max) |
Hysteresis |
Operating Temperature |
Package / Case |
Mounting Type |
Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC COMP PP I/O QUAD 1.6V 14DIP
|
Package: 14-DIP (0.300", 7.62mm) |
Stock35,268 |
|
14-DIP (0.300", 7.62mm) |
- |
General Purpose |
4 |
CMOS, Push-Pull, Rail-to-Rail, TTL |
1.6 V ~ 5.5 V |
7mV @ 5.5V |
1pA @ 5.5V |
- |
1µA |
70dB CMRR, 80dB PSRR |
8µs |
6.5mV |
-40°C ~ 85°C |
14-DIP (0.300", 7.62mm) |
Through Hole |
14-PDIP |
||
Microchip Technology |
IC COMP OPENDRN 1.6V QUAD 14-DIP
|
Package: 14-DIP (0.300", 7.62mm) |
Stock5,440 |
|
14-DIP (0.300", 7.62mm) |
- |
General Purpose |
4 |
CMOS, Open-Drain, Rail-to-Rail, TTL |
1.6 V ~ 5.5 V |
7mV @ 5.5V |
1pA @ 5.5V |
30mA |
1µA |
70dB CMRR, 80dB PSRR |
8µs |
6.5mV |
-40°C ~ 85°C |
14-DIP (0.300", 7.62mm) |
Through Hole |
14-PDIP |
||
Microchip Technology |
IC COMP 1.6V QUAD O-D 14SOIC
|
Package: 14-SOIC (0.154", 3.90mm Width) |
Stock2,384 |
|
14-SOIC (0.154", 3.90mm Width) |
- |
General Purpose |
4 |
CMOS, Open-Drain, Rail-to-Rail, TTL |
1.6 V ~ 5.5 V |
7mV @ 5.5V |
1pA @ 5.5V |
30mA |
1µA |
70dB CMRR, 80dB PSRR |
8µs |
6.5mV |
-40°C ~ 125°C |
14-SOIC (0.154", 3.90mm Width) |
Surface Mount |
14-SOIC |
||
Microchip Technology |
IC COMP 1.6V QUAD O-D 14DIP
|
Package: 14-DIP (0.300", 7.62mm) |
Stock5,568 |
|
14-DIP (0.300", 7.62mm) |
- |
General Purpose |
4 |
CMOS, Open-Drain, Rail-to-Rail, TTL |
1.6 V ~ 5.5 V |
7mV @ 5.5V |
1pA @ 5.5V |
30mA |
1µA |
70dB CMRR, 80dB PSRR |
8µs |
6.5mV |
-40°C ~ 125°C |
14-DIP (0.300", 7.62mm) |
Through Hole |
14-PDIP |
||
Microchip Technology |
IC COMP QUAD 1.8V OD 14-TSSOP
|
Package: 14-TSSOP (0.173", 4.40mm Width) |
Stock7,520 |
|
14-TSSOP (0.173", 4.40mm Width) |
- |
General Purpose |
4 |
CMOS, Open-Drain |
1.8 V ~ 5.5 V |
10mV @ 5.5V |
1pA @ 5.5V |
50mA |
130µA |
66dB CMRR, 70dB PSRR |
80ns |
5mV |
-40°C ~ 125°C |
14-TSSOP (0.173", 4.40mm Width) |
Surface Mount |
14-TSSOP |
||
Microchip Technology |
IC COMP QUAD 1.8V OD 14-SOIC
|
Package: 14-SOIC (0.154", 3.90mm Width) |
Stock7,040 |
|
14-SOIC (0.154", 3.90mm Width) |
- |
General Purpose |
4 |
CMOS, Open-Drain |
1.8 V ~ 5.5 V |
10mV @ 5.5V |
1pA @ 5.5V |
50mA |
130µA |
66dB CMRR, 70dB PSRR |
80ns |
5mV |
-40°C ~ 125°C |
14-SOIC (0.154", 3.90mm Width) |
Surface Mount |
14-SOIC |
||
Microchip Technology |
IC COMP QUAD 1.8V PP 14-TSSOP
|
Package: 14-TSSOP (0.173", 4.40mm Width) |
Stock5,936 |
|
14-TSSOP (0.173", 4.40mm Width) |
- |
General Purpose |
4 |
CMOS, Push-Pull, Rail-to-Rail, TTL |
1.8 V ~ 5.5 V |
10mV @ 5.5V |
1pA @ 5.5V |
50mA |
130µA |
66dB CMRR, 70dB PSRR |
80ns |
5mV |
-40°C ~ 125°C |
14-TSSOP (0.173", 4.40mm Width) |
Surface Mount |
14-TSSOP |
||
Microchip Technology |
IC COMP QUAD 1.8V PP 14-SOIC
|
Package: 14-SOIC (0.154", 3.90mm Width) |
Stock6,912 |
|
14-SOIC (0.154", 3.90mm Width) |
- |
General Purpose |
4 |
CMOS, Push-Pull, Rail-to-Rail, TTL |
1.8 V ~ 5.5 V |
10mV @ 5.5V |
1pA @ 5.5V |
50mA |
130µA |
66dB CMRR, 70dB PSRR |
80ns |
5mV |
-40°C ~ 125°C |
14-SOIC (0.154", 3.90mm Width) |
Surface Mount |
14-SOIC |
||
Microchip Technology |
IC COMPARATOR MICROPWR 4MLF
|
Package: 4-UFDFN Exposed Pad |
Stock4,688 |
|
4-UFDFN Exposed Pad |
Teeny? |
with Voltage Reference |
1 |
Open Drain |
1.5 V ~ 5.5 V |
- |
- |
20mA |
3µA |
- |
12µs |
20mV |
-40°C ~ 85°C |
4-UFDFN Exposed Pad |
Surface Mount |
4-TDFN (1.2x1.6) |
||
Microchip Technology |
IC COMPARATOR MICROPWR 4MLF
|
Package: 4-UFDFN Exposed Pad |
Stock3,184 |
|
4-UFDFN Exposed Pad |
Teeny? |
with Voltage Reference |
1 |
Push-Pull |
1.5 V ~ 5.5 V |
- |
- |
20mA |
3µA |
- |
12µs |
20mV |
-40°C ~ 85°C |
4-UFDFN Exposed Pad |
Surface Mount |
4-TDFN (1.2x1.6) |
||
Microchip Technology |
IC COMP DUAL 1.8V OD 8-SOIC
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock6,000 |
|
8-SOIC (0.154", 3.90mm Width) |
- |
General Purpose |
2 |
CMOS, Open-Drain |
1.8 V ~ 5.5 V |
10mV @ 5.5V |
1pA @ 5.5V |
50mA |
130µA |
66dB CMRR, 70dB PSRR |
80ns |
5mV |
-40°C ~ 125°C |
8-SOIC (0.154", 3.90mm Width) |
Surface Mount |
8-SOIC |
||
Microchip Technology |
IC COMP DUAL 1.8V OD 8-MSOP
|
Package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock4,976 |
|
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
- |
General Purpose |
2 |
CMOS, Open-Drain |
1.8 V ~ 5.5 V |
10mV @ 5.5V |
1pA @ 5.5V |
50mA |
130µA |
66dB CMRR, 70dB PSRR |
80ns |
5mV |
-40°C ~ 125°C |
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Surface Mount |
8-MSOP |
||
Microchip Technology |
IC COMP DUAL 1.8V PP 8-SOIC
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock4,896 |
|
8-SOIC (0.154", 3.90mm Width) |
- |
General Purpose |
2 |
CMOS, Push-Pull, Rail-to-Rail, TTL |
1.8 V ~ 5.5 V |
10mV @ 5.5V |
1pA @ 5.5V |
50mA |
130µA |
66dB CMRR, 70dB PSRR |
80ns |
5mV |
-40°C ~ 125°C |
8-SOIC (0.154", 3.90mm Width) |
Surface Mount |
8-SOIC |
||
Microchip Technology |
IC COMPARATOR MICROPWR 6MLF
|
Package: 4-UFDFN Exposed Pad |
Stock2,784 |
|
4-UFDFN Exposed Pad |
Teeny? |
with Voltage Reference |
1 |
Push-Pull |
1.5 V ~ 5.5 V |
- |
- |
20mA |
3µA |
- |
12µs |
20mV |
-40°C ~ 85°C |
4-UFDFN Exposed Pad |
Surface Mount |
4-TDFN (1.2x1.6) |
||
Microchip Technology |
IC COMPARATOR MICROPWR 4TDFN
|
Package: 4-UFDFN Exposed Pad |
Stock4,624 |
|
4-UFDFN Exposed Pad |
Teeny? |
with Voltage Reference |
1 |
Open Drain |
1.5 V ~ 5.5 V |
- |
- |
20mA |
3µA |
- |
12µs |
20mV |
-40°C ~ 85°C |
4-UFDFN Exposed Pad |
Surface Mount |
4-TDFN (1.2x1.6) |
||
Microchip Technology |
IC COMPARATOR MICROPWR 4TDFN
|
Package: 4-UFDFN Exposed Pad |
Stock6,272 |
|
4-UFDFN Exposed Pad |
Teeny? |
with Voltage Reference |
1 |
Push-Pull |
1.5 V ~ 5.5 V |
- |
- |
20mA |
3µA |
- |
12µs |
20mV |
-40°C ~ 85°C |
4-UFDFN Exposed Pad |
Surface Mount |
4-TDFN (1.2x1.6) |
||
Microchip Technology |
IC COMPARATOR MICROPWR 4TDFN
|
Package: 4-UFDFN Exposed Pad |
Stock5,184 |
|
4-UFDFN Exposed Pad |
Teeny? |
with Voltage Reference |
1 |
Push-Pull |
1.5 V ~ 5.5 V |
- |
- |
20mA |
3µA |
- |
12µs |
20mV |
-40°C ~ 85°C |
4-UFDFN Exposed Pad |
Surface Mount |
4-TDFN (1.2x1.6) |
||
Microchip Technology |
IC COMP OPENDRN 1.6V SNGL 8-MSOP
|
Package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock6,228 |
|
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
- |
General Purpose |
1 |
CMOS, Open-Drain, Rail-to-Rail, TTL |
1.6 V ~ 5.5 V |
7mV @ 5.5V |
1pA @ 5.5V |
30mA |
1µA |
70dB CMRR, 80dB PSRR |
8µs |
6.5mV |
-40°C ~ 85°C |
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Surface Mount |
8-MSOP |
||
Microchip Technology |
IC COMP 1.6V SNGL O-D W/CS 8DIP
|
Package: 8-DIP (0.300", 7.62mm) |
Stock7,392 |
|
8-DIP (0.300", 7.62mm) |
- |
General Purpose |
1 |
CMOS, Open-Drain, Rail-to-Rail, TTL |
1.6 V ~ 5.5 V |
7mV @ 5.5V |
1pA @ 5.5V |
30mA |
1µA |
70dB CMRR, 80dB PSRR |
8µs |
6.5mV |
-40°C ~ 125°C |
8-DIP (0.300", 7.62mm) |
Through Hole |
8-PDIP |
||
Microchip Technology |
IC COMPARATOR MICROPWR 6MLF
|
Package: 6-UFDFN Exposed Pad |
Stock7,984 |
|
6-UFDFN Exposed Pad |
Teeny? |
with Voltage Reference |
1 |
Open Drain |
1.5 V ~ 5.5 V |
- |
- |
20mA |
3µA |
- |
12µs |
20mV |
-40°C ~ 85°C |
6-UFDFN Exposed Pad |
Surface Mount |
6-TDFN (1.6x1.6) |
||
Microchip Technology |
IC COMPARATOR MICROPWR 6MLF
|
Package: 6-UFDFN Exposed Pad |
Stock6,704 |
|
6-UFDFN Exposed Pad |
Teeny? |
with Voltage Reference |
1 |
Push-Pull |
1.5 V ~ 5.5 V |
- |
- |
20mA |
3µA |
- |
12µs |
20mV |
-40°C ~ 85°C |
6-UFDFN Exposed Pad |
Surface Mount |
6-TDFN (1.6x1.6) |
||
Microchip Technology |
IC COMPARATOR MICROPWR 6MLF
|
Package: 6-UFDFN Exposed Pad |
Stock2,096 |
|
6-UFDFN Exposed Pad |
Teeny? |
with Voltage Reference |
1 |
Push-Pull |
1.5 V ~ 5.5 V |
- |
- |
20mA |
3µA |
- |
12µs |
20mV |
-40°C ~ 85°C |
6-UFDFN Exposed Pad |
Surface Mount |
6-TDFN (1.6x1.6) |
||
Microchip Technology |
IC COMPARATOR MICROPWR 6TDFN
|
Package: 6-UFDFN Exposed Pad |
Stock3,920 |
|
6-UFDFN Exposed Pad |
Teeny? |
with Voltage Reference |
1 |
Open Drain |
1.5 V ~ 5.5 V |
- |
- |
20mA |
3µA |
- |
12µs |
20mV |
-40°C ~ 85°C |
6-UFDFN Exposed Pad |
Surface Mount |
6-TDFN (1.6x1.6) |
||
Microchip Technology |
IC COMP 1.6V SNGL O-D 8MSOP
|
Package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock4,512 |
|
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
- |
General Purpose |
1 |
CMOS, Open-Drain, Rail-to-Rail, TTL |
1.6 V ~ 5.5 V |
7mV @ 5.5V |
1pA @ 5.5V |
30mA |
1µA |
70dB CMRR, 80dB PSRR |
8µs |
6.5mV |
-40°C ~ 125°C |
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Surface Mount |
8-MSOP |
||
Microchip Technology |
IC COMP OPENDRN 1.6V SNGL 8-MSOP
|
Package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock7,504 |
|
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
- |
General Purpose |
1 |
CMOS, Open-Drain, Rail-to-Rail, TTL |
1.6 V ~ 5.5 V |
7mV @ 5.5V |
1pA @ 5.5V |
30mA |
1µA |
70dB CMRR, 80dB PSRR |
8µs |
6.5mV |
-40°C ~ 85°C |
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Surface Mount |
8-MSOP |
||
Microchip Technology |
IC COMP 1.6V DUAL P-P 8MSOP
|
Package: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock3,920 |
|
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
- |
General Purpose |
2 |
CMOS, Push-Pull, Rail-to-Rail, TTL |
1.6 V ~ 5.5 V |
7mV @ 5.5V |
1pA @ 5.5V |
- |
1µA |
70dB CMRR, 80dB PSRR |
8µs |
6.5mV |
-40°C ~ 125°C |
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Surface Mount |
8-MSOP |
||
Microchip Technology |
IC COMP 1.6V DUAL O-D 8SOIC
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock4,944 |
|
8-SOIC (0.154", 3.90mm Width) |
- |
General Purpose |
2 |
CMOS, Open-Drain, Rail-to-Rail, TTL |
1.6 V ~ 5.5 V |
7mV @ 5.5V |
1pA @ 5.5V |
30mA |
1µA |
70dB CMRR, 80dB PSRR |
8µs |
6.5mV |
-40°C ~ 125°C |
8-SOIC (0.154", 3.90mm Width) |
Surface Mount |
8-SOIC |
||
Microchip Technology |
IC COMP 1.6V DUAL P-P 8SOIC
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock2,272 |
|
8-SOIC (0.154", 3.90mm Width) |
- |
General Purpose |
2 |
CMOS, Push-Pull, Rail-to-Rail, TTL |
1.6 V ~ 5.5 V |
7mV @ 5.5V |
1pA @ 5.5V |
- |
1µA |
70dB CMRR, 80dB PSRR |
8µs |
6.5mV |
-40°C ~ 125°C |
8-SOIC (0.154", 3.90mm Width) |
Surface Mount |
8-SOIC |
||
Microchip Technology |
IC COMP 1.6V DUAL O-D 8DIP
|
Package: 8-DIP (0.300", 7.62mm) |
Stock2,320 |
|
8-DIP (0.300", 7.62mm) |
- |
General Purpose |
2 |
CMOS, Open-Drain, Rail-to-Rail, TTL |
1.6 V ~ 5.5 V |
7mV @ 5.5V |
1pA @ 5.5V |
30mA |
1µA |
70dB CMRR, 80dB PSRR |
8µs |
6.5mV |
-40°C ~ 125°C |
8-DIP (0.300", 7.62mm) |
Through Hole |
8-PDIP |
||
Microchip Technology |
IC COMP OPENDRN 1.6V DUAL 8-SOIC
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock29,580 |
|
8-SOIC (0.154", 3.90mm Width) |
- |
General Purpose |
2 |
CMOS, Open-Drain, Rail-to-Rail, TTL |
1.6 V ~ 5.5 V |
7mV @ 5.5V |
1pA @ 5.5V |
30mA |
1µA |
70dB CMRR, 80dB PSRR |
8µs |
6.5mV |
-40°C ~ 85°C |
8-SOIC (0.154", 3.90mm Width) |
Surface Mount |
8-SOIC |