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Solicitação de cotação

Sockets for ICs, Transistors

Records 159
Page  1/6
Image
Part Number
Manufacturer
Description
Package
Stock
Quantity
Package
Series
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
Harwin Inc.
CONN SOCKET
Package: -
Stock7,290
-
*
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Harwin Inc.
CONN SOCKET
Package: -
Stock3,708
-
*
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Harwin Inc.
CONN SOCKET
Package: -
Stock4,824
-
*
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Harwin Inc.
CONN SOCKET
Package: -
Stock6,714
-
*
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Harwin Inc.
CONN SOCKET
Package: -
Stock8,208
-
*
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Harwin Inc.
CONN SOCKET
Package: -
Stock7,524
-
*
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Harwin Inc.
CONN SOCKET
Package: -
Stock4,122
-
*
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Harwin Inc.
CONN SOCKET
Package: -
Stock3,330
-
*
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Harwin Inc.
CONN SOCKET
Package: -
Stock2,322
-
*
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Harwin Inc.
CONN SOCKET
Package: -
Stock5,058
-
*
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Harwin Inc.
CONN SOCKET
Package: -
Stock2,106
-
*
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Harwin Inc.
CONN SOCKET
Package: -
Stock4,572
-
*
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Harwin Inc.
CONN SOCKET
Package: -
Stock7,740
-
*
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Harwin Inc.
CONN SOCKET
Package: -
Stock7,272
-
*
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Harwin Inc.
CONN IC DIP SOCKET 8POS GOLD
Package: -
Stock5,526
-
D0
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Wire Wrap
0.100" (2.54mm)
Tin
196.8µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
Harwin Inc.
CONN IC DIP SOCKET 6POS GOLD
Package: -
Stock4,284
-
D0
DIP, 0.3" (7.62mm) Row Spacing
6 (2 x 3)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Wire Wrap
0.100" (2.54mm)
Tin
196.8µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
Harwin Inc.
CONN IC DIP SOCKET 24POS GOLD
Package: -
Stock7,596
-
D0
DIP, 0.4" (10.16mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Wire Wrap
0.100" (2.54mm)
Tin
196.8µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
Harwin Inc.
CONN SOCKET SIP 32POS GOLD
Package: -
Stock6,516
-
D01-950
SIP
32 (1 x 32)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
Harwin Inc.
CONN SOCKET SIP 20POS GOLD
Package: -
Stock2,430
-
D01-950
SIP
20 (1 x 20)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
Harwin Inc.
CONN SOCKET SIP 18POS GOLD
Package: -
Stock3,960
-
D01-950
SIP
18 (1 x 18)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
Harwin Inc.
CONN SOCKET SIP 16POS GOLD
Package: -
Stock2,466
-
D01-950
SIP
16 (1 x 16)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
Harwin Inc.
CONN SOCKET SIP 14POS GOLD
Package: -
Stock2,682
-
D01-950
SIP
14 (1 x 14)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
Harwin Inc.
CONN SOCKET SIP 12POS GOLD
Package: -
Stock5,670
-
D01-950
SIP
12 (1 x 12)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
Harwin Inc.
CONN SOCKET SIP 10POS GOLD
Package: -
Stock5,454
-
D01-950
SIP
10 (1 x 10)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
Harwin Inc.
CONN SOCKET SIP 9POS GOLD
Package: -
Stock5,832
-
D01-950
SIP
9 (1 x 9)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
Harwin Inc.
CONN SOCKET SIP 8POS GOLD
Package: -
Stock8,892
-
D01-950
SIP
8 (1 x 8)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
Harwin Inc.
CONN SOCKET SIP 7POS GOLD
Package: -
Stock7,380
-
D01-950
SIP
7 (1 x 7)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
Harwin Inc.
CONN SOCKET SIP 6POS GOLD
Package: -
Stock7,416
-
D01-950
SIP
6 (1 x 6)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
Harwin Inc.
CONN SOCKET SIP 5POS GOLD
Package: -
Stock5,526
-
D01-950
SIP
5 (1 x 5)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
Harwin Inc.
CONN SOCKET SIP 4POS GOLD
Package: -
Stock2,304
-
D01-950
SIP
4 (1 x 4)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C