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Sockets for ICs, Transistors

Records 159
Page  2/6
Image
Part Number
Manufacturer
Description
Package
Stock
Quantity
Package
Series
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
Harwin Inc.
CONN SOCKET PLCC 84POS TIN
Package: -
Stock2,556
-
D830
PLCC
84 (4 x 21)
0.050" (1.27mm)
Tin
-
Phosphor Bronze
Surface Mount
Board Guide, Closed Frame
Solder
0.050" (1.27mm)
Tin
-
Phosphor Bronze
Polyphenylene Sulfide (PPS)
-50°C ~ 105°C
Harwin Inc.
CONN SOCKET PLCC 84POS TIN
Package: -
Stock4,878
-
D830
PLCC
84 (4 x 21)
0.050" (1.27mm)
Tin
-
Phosphor Bronze
Surface Mount
Board Guide, Closed Frame
Solder
0.050" (1.27mm)
Tin
-
Phosphor Bronze
Polyphenylene Sulfide (PPS)
-50°C ~ 105°C
Harwin Inc.
CONN SOCKET PLCC 68POS TIN
Package: -
Stock8,604
-
D830
PLCC
68 (4 x 17)
0.050" (1.27mm)
Tin
-
Phosphor Bronze
Surface Mount
Board Guide, Closed Frame
Solder
0.050" (1.27mm)
Tin
-
Phosphor Bronze
Polyphenylene Sulfide (PPS)
-50°C ~ 105°C
Harwin Inc.
CONN SOCKET PLCC 68POS TIN
Package: -
Stock8,766
-
D830
PLCC
68 (4 x 17)
0.050" (1.27mm)
Tin
-
Phosphor Bronze
Surface Mount
Board Guide, Closed Frame
Solder
0.050" (1.27mm)
Tin
-
Phosphor Bronze
Polyphenylene Sulfide (PPS)
-50°C ~ 105°C
Harwin Inc.
CONN SOCKET PLCC 52POS TIN
Package: -
Stock7,470
-
D830
PLCC
52 (4 x 13)
0.050" (1.27mm)
Tin
-
Phosphor Bronze
Surface Mount
Board Guide, Closed Frame
Solder
0.050" (1.27mm)
Tin
-
Phosphor Bronze
Polyphenylene Sulfide (PPS)
-50°C ~ 105°C
Harwin Inc.
CONN SOCKET PLCC 52POS TIN
Package: -
Stock7,686
-
D830
PLCC
52 (4 x 13)
0.050" (1.27mm)
Tin
-
Phosphor Bronze
Surface Mount
Board Guide, Closed Frame
Solder
0.050" (1.27mm)
Tin
-
Phosphor Bronze
Polyphenylene Sulfide (PPS)
-50°C ~ 105°C
Harwin Inc.
CONN SOCKET PLCC 44POS TIN
Package: -
Stock2,520
-
D830
PLCC
44 (4 x 11)
0.050" (1.27mm)
Tin
-
Phosphor Bronze
Surface Mount
Board Guide, Closed Frame
Solder
0.050" (1.27mm)
Tin
-
Phosphor Bronze
Polyphenylene Sulfide (PPS)
-50°C ~ 105°C
Harwin Inc.
CONN SOCKET PLCC 44POS TIN
Package: -
Stock3,204
-
D830
PLCC
44 (4 x 11)
0.050" (1.27mm)
Tin
-
Phosphor Bronze
Surface Mount
Board Guide, Closed Frame
Solder
0.050" (1.27mm)
Tin
-
Phosphor Bronze
Polyphenylene Sulfide (PPS)
-50°C ~ 105°C
Harwin Inc.
CONN SOCKET PLCC 32POS TIN
Package: -
Stock8,766
-
D830
PLCC
32 (4 x 8)
0.050" (1.27mm)
Tin
-
Phosphor Bronze
Surface Mount
Board Guide, Closed Frame
Solder
0.050" (1.27mm)
Tin
-
Phosphor Bronze
Polyphenylene Sulfide (PPS)
-50°C ~ 105°C
Harwin Inc.
CONN SOCKET PLCC 32POS TIN
Package: -
Stock6,138
-
D830
PLCC
32 (4 x 8)
0.050" (1.27mm)
Tin
-
Phosphor Bronze
Surface Mount
Board Guide, Closed Frame
Solder
0.050" (1.27mm)
Tin
-
Phosphor Bronze
Polyphenylene Sulfide (PPS)
-50°C ~ 105°C
Harwin Inc.
CONN SOCKET PLCC 28POS TIN
Package: -
Stock3,816
-
D830
PLCC
28 (4 x 7)
0.050" (1.27mm)
Tin
-
Phosphor Bronze
Surface Mount
Board Guide, Closed Frame
Solder
0.050" (1.27mm)
Tin
-
Phosphor Bronze
Polyphenylene Sulfide (PPS)
-50°C ~ 105°C
Harwin Inc.
CONN SOCKET PLCC 28POS TIN
Package: -
Stock8,838
-
D830
PLCC
28 (4 x 7)
0.050" (1.27mm)
Tin
-
Phosphor Bronze
Surface Mount
Board Guide, Closed Frame
Solder
0.050" (1.27mm)
Tin
-
Phosphor Bronze
Polyphenylene Sulfide (PPS)
-50°C ~ 105°C
Harwin Inc.
CONN SOCKET PLCC 20POS TIN
Package: -
Stock3,418
-
D830
PLCC
20 (4 x 5)
0.050" (1.27mm)
Tin
-
Phosphor Bronze
Through Hole
Board Guide, Closed Frame
Solder
0.050" (1.27mm)
Tin
-
Phosphor Bronze
Polyphenylene Sulfide (PPS)
-50°C ~ 105°C
Harwin Inc.
CONN SOCKET PLCC 20POS TIN
Package: -
Stock7,686
-
D830
PLCC
20 (4 x 5)
0.050" (1.27mm)
Tin
-
Phosphor Bronze
Surface Mount
Board Guide, Closed Frame
Solder
0.050" (1.27mm)
Tin
-
Phosphor Bronze
Polyphenylene Sulfide (PPS)
-50°C ~ 105°C
Harwin Inc.
CONN IC DIP SOCKET 24POS GOLD
Package: -
Stock5,328
-
D0
DIP, 0.6" (15.24mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Wire Wrap
0.100" (2.54mm)
Tin
196.8µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
Harwin Inc.
CONN IC DIP SOCKET 22POS GOLD
Package: -
Stock8,712
-
D0
DIP, 0.4" (10.16mm) Row Spacing
22 (2 x 11)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Wire Wrap
0.100" (2.54mm)
Tin
196.8µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
Harwin Inc.
CONN IC DIP SOCKET 20POS GOLD
Package: -
Stock4,860
-
D0
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Wire Wrap
0.100" (2.54mm)
Tin
196.8µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
Harwin Inc.
CONN IC DIP SOCKET 18POS GOLD
Package: -
Stock4,662
-
D0
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Wire Wrap
0.100" (2.54mm)
Tin
196.8µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
Harwin Inc.
CONN IC DIP SOCKET 16POS GOLD
Package: -
Stock5,256
-
D0
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Wire Wrap
0.100" (2.54mm)
Tin
196.8µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
Harwin Inc.
CONN IC DIP SOCKET 14POS GOLD
Package: -
Stock5,292
-
D0
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Wire Wrap
0.100" (2.54mm)
Tin
196.8µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
Harwin Inc.
CONN IC DIP SOCKET 64POS GOLD
Package: -
Stock4,392
-
D8864
DIP, 0.75" (19.05mm) Row Spacing
64 (2 x 32)
0.070" (1.78mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.070" (1.78mm)
Tin
196.8µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
Harwin Inc.
CONN IC DIP SOCKET 64POS GOLD
Package: -
Stock7,326
-
D73064
DIP, Staggered
64 (2 x 32)
0.050" (1.27mm)
Gold
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.050" (1.27mm)
Tin
196.8µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
Harwin Inc.
CONN IC DIP SOCKET 28POS GOLD
Package: -
Stock8,028
-
D95
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
196.8µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
Harwin Inc.
CONN IC DIP SOCKET 42POS GOLD
Package: -
Stock8,028
-
D95
DIP, 0.6" (15.24mm) Row Spacing
42 (2 x 21)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
196.8µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
Harwin Inc.
CONN IC DIP SOCKET 48POS GOLD
Package: -
Stock4,590
-
D0
DIP, 0.6" (15.24mm) Row Spacing
48 (2 x 24)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Wire Wrap
0.100" (2.54mm)
Tin
196.8µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
Harwin Inc.
CONN IC DIP SOCKET 48POS GOLD
Package: -
Stock2,016
-
D95
DIP, 0.6" (15.24mm) Row Spacing
48 (2 x 24)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
196.8µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
Harwin Inc.
CONN IC DIP SOCKET 24POS GOLD
Package: -
Stock7,398
-
D39
DIP, 0.3" (7.62mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole, Right Angle, Horizontal
Closed Frame
Solder
0.100" (2.54mm)
Tin
196.8µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
Harwin Inc.
CONN IC DIP SOCKET 18POS GOLD
Package: -
Stock2,358
-
D39
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole, Right Angle, Horizontal
Closed Frame
Solder
0.100" (2.54mm)
Tin
196.8µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
Harwin Inc.
CONN IC DIP SOCKET 20POS GOLD
Package: -
Stock5,580
-
D39
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole, Right Angle, Horizontal
Closed Frame
Solder
0.100" (2.54mm)
Tin
196.8µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
Harwin Inc.
CONN IC DIP SOCKET 40POS GOLD
Package: -
Stock4,176
-
D26
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Press-Fit
0.100" (2.54mm)
Tin
196.8µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C