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Sockets for ICs, Transistors

Records 11083
Page  32/370
Image
Part Number
Manufacturer
Description
Package
Stock
Quantity
Package
Series
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
Assmann WSW Components
CONN IC DIP SOCKET 8POS GOLD
Package: -
Stock6,066
-
-
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
-
-
Through Hole
Open Frame
-
0.100" (2.54mm)
Gold
-
-
-
-
Assmann WSW Components
CONN IC DIP SOCKET 6POS GOLD
Package: -
Stock7,326
-
-
DIP, 0.3" (7.62mm) Row Spacing
6 (2 x 3)
0.100" (2.54mm)
Gold
-
-
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
-
-
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
Aries Electronics
CONN IC DIP SOCKET ZIF 28POS TIN
Package: -
Stock8,982
-
516
DIP, ZIF (ZIP)
28 (2 x 14)
0.100" (2.54mm)
Tin
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
10µin (0.25µm)
Beryllium Copper
Polyamide (PA46), Nylon 4/6, Glass Filled
-
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 40POS GOLD
Package: -
Stock7,254
-
Diplomate DL
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Thermoplastic, Glass Filled
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 28POS GOLD
Package: -
Stock3,474
-
Diplomate DL
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Thermoplastic, Glass Filled
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 24POS GOLD
Package: -
Stock4,644
-
Diplomate DL
DIP, 0.6" (15.24mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
15µin (0.38µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
15µin (0.38µm)
Beryllium Copper
Thermoplastic
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 20POS GOLD
Package: -
Stock3,618
-
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Thermoplastic, Glass Filled
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 18POS GOLD
Package: -
Stock5,328
-
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Thermoplastic
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 16POS GOLD
Package: -
Stock2,088
-
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Thermoplastic, Glass Filled
-55°C ~ 105°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 14POS GOLD
Package: -
Stock2,862
-
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Thermoplastic, Glass Filled
-55°C ~ 105°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 8POS GOLD
Package: -
Stock4,950
-
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Thermoplastic, Glass Filled
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 6POS GOLD
Package: -
Stock4,518
-
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
6 (2 x 3)
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Thermoplastic, Glass Filled
-55°C ~ 125°C
Aries Electronics
CONN IC DIP SOCKET ZIF 24POS TIN
Package: -
Stock4,824
-
516
DIP, ZIF (ZIP)
24 (2 x 12)
0.100" (2.54mm)
Tin
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
10µin (0.25µm)
Beryllium Copper
Polyamide (PA46), Nylon 4/6, Glass Filled
-
Aries Electronics
CONN IC DIP SOCKET ZIF 40POS TIN
Package: -
Stock8,802
-
516
DIP, ZIF (ZIP)
40 (2 x 20)
0.100" (2.54mm)
Tin
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
10µin (0.25µm)
Beryllium Copper
Polyamide (PA46), Nylon 4/6, Glass Filled
-
Aries Electronics
CONN IC DIP SOCKET 40POS GOLD
Package: -
Stock5,688
-
Edge-Grip?, C91
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Phosphor Bronze
Through Hole
Closed Frame
Wire Wrap
0.100" (2.54mm)
Gold
10µin (0.25µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 125°C
Aries Electronics
CONN IC DIP SOCKET 28POS GOLD
Package: -
Stock8,514
-
Edge-Grip?, C91
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Phosphor Bronze
Through Hole
Closed Frame
Wire Wrap
0.100" (2.54mm)
Gold
10µin (0.25µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 125°C
Aries Electronics
CONN IC DIP SOCKET 24POS GOLD
Package: -
Stock8,460
-
Edge-Grip?, C91
DIP, 0.6" (15.24mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Phosphor Bronze
Through Hole
Closed Frame
Wire Wrap
0.100" (2.54mm)
Gold
10µin (0.25µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 125°C
Aries Electronics
CONN IC DIP SOCKET 22POS GOLD
Package: -
Stock4,410
-
Edge-Grip?, C91
DIP, 0.4" (10.16mm) Row Spacing
22 (2 x 11)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Phosphor Bronze
Through Hole
Closed Frame
Wire Wrap
0.100" (2.54mm)
Gold
10µin (0.25µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 125°C
Aries Electronics
CONN IC DIP SOCKET 20POS GOLD
Package: -
Stock4,734
-
Edge-Grip?, C91
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Phosphor Bronze
Through Hole
Closed Frame
Wire Wrap
0.100" (2.54mm)
Gold
10µin (0.25µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 125°C
Aries Electronics
CONN IC DIP SOCKET 18POS GOLD
Package: -
Stock8,838
-
Edge-Grip?, C91
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Phosphor Bronze
Through Hole
Closed Frame
Wire Wrap
0.100" (2.54mm)
Gold
10µin (0.25µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 125°C
Aries Electronics
CONN IC DIP SOCKET 16POS GOLD
Package: -
Stock3,006
-
Edge-Grip?, C91
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Phosphor Bronze
Through Hole
Closed Frame
Wire Wrap
0.100" (2.54mm)
Gold
10µin (0.25µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 125°C
Aries Electronics
CONN IC DIP SOCKET 14POS GOLD
Package: -
Stock5,598
-
Edge-Grip?, C91
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Phosphor Bronze
Through Hole
Closed Frame
Wire Wrap
0.100" (2.54mm)
Gold
10µin (0.25µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 125°C
Aries Electronics
CONN IC DIP SOCKET 8POS GOLD
Package: -
Stock3,420
-
Edge-Grip?, C91
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Phosphor Bronze
Through Hole
Closed Frame
Wire Wrap
0.100" (2.54mm)
Gold
10µin (0.25µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 125°C
Aries Electronics
CONN IC DIP SOCKET 40POS TIN
Package: -
Stock3,708
-
Edge-Grip?, C81
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Tin
200µin (5.08µm)
Phosphor Bronze
Through Hole
Closed Frame
Wire Wrap
0.100" (2.54mm)
Tin
200µin (5.08µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
Aries Electronics
CONN IC DIP SOCKET 28POS TIN
Package: -
Stock8,838
-
Edge-Grip?, C81
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Tin
200µin (5.08µm)
Phosphor Bronze
Through Hole
Closed Frame
Wire Wrap
0.100" (2.54mm)
Tin
200µin (5.08µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
Aries Electronics
CONN IC DIP SOCKET 24POS TIN
Package: -
Stock6,336
-
Edge-Grip?, C81
DIP, 0.6" (15.24mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Tin
200µin (5.08µm)
Phosphor Bronze
Through Hole
Closed Frame
Wire Wrap
0.100" (2.54mm)
Tin
200µin (5.08µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
Aries Electronics
CONN IC DIP SOCKET 22POS TIN
Package: -
Stock5,526
-
Edge-Grip?, C81
DIP, 0.4" (10.16mm) Row Spacing
22 (2 x 11)
0.100" (2.54mm)
Tin
200µin (5.08µm)
Phosphor Bronze
Through Hole
Closed Frame
Wire Wrap
0.100" (2.54mm)
Tin
200µin (5.08µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
Aries Electronics
CONN IC DIP SOCKET 20POS TIN
Package: -
Stock3,526
-
Edge-Grip?, C81
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Tin
200µin (5.08µm)
Phosphor Bronze
Through Hole
Closed Frame
Wire Wrap
0.100" (2.54mm)
Tin
200µin (5.08µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
Aries Electronics
CONN IC DIP SOCKET 18POS TIN
Package: -
Stock3,402
-
Edge-Grip?, C81
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Tin
200µin (5.08µm)
Phosphor Bronze
Through Hole
Closed Frame
Wire Wrap
0.100" (2.54mm)
Tin
200µin (5.08µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
Aries Electronics
CONN IC DIP SOCKET 16POS TIN
Package: -
Stock8,676
-
Edge-Grip?, C81
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Tin
200µin (5.08µm)
Phosphor Bronze
Through Hole
Closed Frame
Wire Wrap
0.100" (2.54mm)
Tin
200µin (5.08µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C