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Sockets for ICs, Transistors

Records 52
Page  2/2
Image
Part Number
Manufacturer
Description
Package
Stock
Quantity
Package
Series
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
Omron Electronics Inc-EMC Div
CONN IC DIP SOCKET 16POS GOLD
Package: -
Stock8,424
-
XR2
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Omron Electronics Inc-EMC Div
CONN SOCKET SIP 26POS GOLD
Package: -
Stock4,374
-
XR2
SIP
26 (1 x 26)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Threaded
-
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Brass
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Omron Electronics Inc-EMC Div
CONN IC DIP SOCKET 14POS GOLD
Package: -
Stock7,092
-
XR2
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Omron Electronics Inc-EMC Div
CONN SOCKET SIP 10POS GOLD
Package: -
Stock7,344
-
XR2
SIP
10 (1 x 10)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Threaded
-
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Brass
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Omron Electronics Inc-EMC Div
CONN ZIG-ZAG 16POS GOLD
Package: -
Stock6,858
-
XR2
Zig-Zag
16 (2 x 8)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Omron Electronics Inc-EMC Div
CONN IC DIP SOCKET 18POS GOLD
Package: -
Stock4,608
-
XR2
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Omron Electronics Inc-EMC Div
CONN SOCKET SIP 15POS GOLD
Package: -
Stock2,304
-
XR2
SIP
15 (1 x 15)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Omron Electronics Inc-EMC Div
CONN SOCKET SIP 20POS GOLD
Package: -
Stock5,202
-
XR2
SIP
20 (1 x 20)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Omron Electronics Inc-EMC Div
CONN SOCKET SIP 15POS GOLD
Package: -
Stock2,754
-
XR2
SIP
15 (1 x 15)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Omron Electronics Inc-EMC Div
CONN IC DIP SOCKET 14POS GOLD
Package: -
Stock5,274
-
XR2
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Omron Electronics Inc-EMC Div
CONN SOCKET SIP 16POS GOLD
Package: -
Stock7,974
-
XR2
SIP
16 (1 x 16)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Omron Electronics Inc-EMC Div
CONN IC DIP SOCKET 8POS GOLD
Package: -
Stock5,742
-
XR2
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Omron Electronics Inc-EMC Div
CONN SOCKET SIP 10POS GOLD
Package: -
Stock3,436
-
XR2
SIP
10 (1 x 10)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Threaded
-
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Brass
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Omron Electronics Inc-EMC Div
CONN IC DIP SOCKET 8POS GOLD
Package: -
Stock7,704
-
XR2
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Threaded
Open Frame
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Brass
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Omron Electronics Inc-EMC Div
CONN IC DIP SOCKET 8POS GOLD
Package: -
Stock6,660
-
XR2
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Omron Electronics Inc-EMC Div
CONN SOCKET SIP 3POS GOLD
Package: -
Stock6,912
-
XR2
SIP
3 (1 x 3)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Omron Electronics Inc-EMC Div
CONN IC SOCKET 32POS
Package: -
Stock8,082
-
XR2
Housing
32 (1 x 32)
0.100" (2.54mm)
-
-
Beryllium Copper
Through Hole
Closed Frame
Wire Wrap
0.100" (2.54mm)
-
-
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Omron Electronics Inc-EMC Div
CONN IC SOCKET 20POS
Package: -
Stock8,532
-
XR2
Housing
20 (1 x 20)
0.100" (2.54mm)
-
-
Beryllium Copper
-
Closed Frame
Solder
0.100" (2.54mm)
-
-
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Omron Electronics Inc-EMC Div
CONN IC DIP SOCKET 8POS GOLD
Package: -
Stock8,910
-
XR2
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Open Frame
Wire Wrap
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Omron Electronics Inc-EMC Div
CONN IC DIP SOCKET 14POS GOLD
Package: -
Stock14,460
-
XR2
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Omron Electronics Inc-EMC Div
CONN IC DIP SOCKET 16POS GOLD
Package: -
Stock9,108
-
XR2
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Omron Electronics Inc-EMC Div
CONN IC DIP SOCKET 24POS GOLD
Package: -
Stock7,068
-
XR2
DIP, 0.6" (15.24mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C