* Please refer to the English Version as our Official Version.
Image |
Part Number |
Manufacturer |
Description |
Package |
Stock |
Quantity |
Package |
Series |
Core Processor |
Core Size |
Speed |
Connectivity |
Peripherals |
Number of I/O |
Program Memory Size |
Program Memory Type |
EEPROM Size |
RAM Size |
Voltage - Supply (Vcc/Vdd) |
Data Converters |
Oscillator Type |
Operating Temperature |
Mounting Type |
Package / Case |
Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC MCU 8BIT 1.5KB FLASH 20DIP
|
Package: 20-DIP (0.300", 7.62mm) |
Stock8,676 |
|
20-DIP (0.300", 7.62mm) |
HC08 |
HC08 |
8-Bit |
8MHz |
- |
LED, LVD, POR, PWM |
15 |
1.5KB (1.5K x 8) |
FLASH |
- |
128 x 8 |
2.7 V ~ 3.3 V |
A/D 12x8b |
External |
-40°C ~ 85°C (TA) |
- |
20-DIP (0.300", 7.62mm) |
20-DIP |
||
NXP |
IC MCU 8BIT 1.5KB FLASH 20SOIC
|
Package: 20-SOIC (0.295", 7.50mm Width) |
Stock12,108 |
|
20-SOIC (0.295", 7.50mm Width) |
HC08 |
HC08 |
8-Bit |
8MHz |
- |
LED, LVD, POR, PWM |
15 |
1.5KB (1.5K x 8) |
FLASH |
- |
128 x 8 |
2.7 V ~ 3.3 V |
A/D 12x8b |
External |
-40°C ~ 85°C (TA) |
- |
20-SOIC (0.295", 7.50mm Width) |
20-SOIC |
||
NXP |
IC MCU 8BIT 8KB FLASH 20DIP
|
Package: 20-DIP (0.300", 7.62mm) |
Stock108,336 |
|
20-DIP (0.300", 7.62mm) |
HC08 |
HC08 |
8-Bit |
3MHz |
USB |
LVD, POR, PWM |
13 |
8KB (8K x 8) |
FLASH |
- |
256 x 8 |
4 V ~ 5.5 V |
- |
Internal |
0°C ~ 70°C (TA) |
- |
20-DIP (0.300", 7.62mm) |
20-DIP |
||
NXP |
IC MCU 8BIT 7.5KB FLASH 28DIP
|
Package: 28-DIP (0.600", 15.24mm) |
Stock18,156 |
|
28-DIP (0.600", 15.24mm) |
HC08 |
HC08 |
8-Bit |
8MHz |
SCI, SPI |
LVD, POR, PWM |
17 |
7.5KB (7.5K x 8) |
FLASH |
- |
384 x 8 |
2.7 V ~ 5.5 V |
A/D 6x8b |
Internal |
-40°C ~ 85°C (TA) |
- |
28-DIP (0.600", 15.24mm) |
28-PDIP |
||
NXP |
IC MCU 8BIT 7.5KB FLASH 32LQFP
|
Package: 32-LQFP |
Stock3,824 |
|
32-LQFP |
HC08 |
HC08 |
8-Bit |
8MHz |
SCI, SPI |
LVD, POR, PWM |
21 |
7.5KB (7.5K x 8) |
FLASH |
- |
384 x 8 |
2.7 V ~ 5.5 V |
A/D 6x8b |
Internal |
-40°C ~ 85°C (TA) |
- |
32-LQFP |
32-LQFP (7x7) |
||
NXP |
IC MCU 8BIT 6KB OTP 28SOIC
|
Package: 28-SOIC (0.295", 7.50mm Width) |
Stock147,792 |
|
28-SOIC (0.295", 7.50mm Width) |
HC05 |
HC05 |
8-Bit |
2.1MHz |
SIO |
POR, Temp Sensor, WDT |
22 |
6KB (6K x 8) |
OTP |
- |
224 x 8 |
2.7 V ~ 5.5 V |
A/D 4x12b |
Internal |
-40°C ~ 85°C (TA) |
- |
28-SOIC (0.295", 7.50mm Width) |
28-SOIC |
||
NXP |
IC MCU 8BIT 6KB OTP 20SOIC
|
Package: 20-SOIC (0.295", 7.50mm Width) |
Stock3,312 |
|
20-SOIC (0.295", 7.50mm Width) |
HC05 |
HC05 |
8-Bit |
2.1MHz |
SIO |
POR, Temp Sensor, WDT |
14 |
6KB (6K x 8) |
OTP |
- |
224 x 8 |
2.7 V ~ 5.5 V |
A/D 4x12b |
Internal |
-40°C ~ 85°C (TA) |
- |
20-SOIC (0.295", 7.50mm Width) |
20-SOIC |
||
NXP |
IC MCU 32BIT ROMLESS 160QFP
|
Package: 160-BQFP |
Stock7,824 |
|
160-BQFP |
M683xx |
CPU32 |
32-Bit |
20MHz |
CAN, EBI/EMI, SCI, SPI |
POR, PWM, WDT |
18 |
- |
ROMless |
- |
7.5K x 8 |
4.75 V ~ 5.25 V |
A/D 16x10b |
External |
-40°C ~ 85°C (TA) |
- |
160-BQFP |
160-QFP (28x28) |
||
NXP |
IC MCU 32BIT ROMLESS 160QFP
|
Package: 160-BQFP |
Stock6,016 |
|
160-BQFP |
M683xx |
CPU32 |
32-Bit |
20MHz |
CAN, EBI/EMI, SCI, SPI |
POR, PWM, WDT |
18 |
- |
ROMless |
- |
7.5K x 8 |
4.75 V ~ 5.25 V |
A/D 16x10b |
External |
-40°C ~ 85°C (TA) |
- |
160-BQFP |
160-QFP (28x28) |
||
NXP |
IC MCU 32BIT ROMLESS 160QFP
|
Package: 160-BQFP |
Stock3,872 |
|
160-BQFP |
M683xx |
CPU32 |
32-Bit |
20MHz |
CAN, EBI/EMI, SCI, SPI |
POR, PWM, WDT |
18 |
- |
ROMless |
- |
7.5K x 8 |
4.75 V ~ 5.25 V |
A/D 16x10b |
External |
-40°C ~ 85°C (TA) |
- |
160-BQFP |
160-QFP (28x28) |
||
NXP |
IC MCU 32BIT ROMLESS 160QFP
|
Package: 160-BQFP |
Stock7,488 |
|
160-BQFP |
M683xx |
CPU32 |
32-Bit |
20MHz |
CAN, EBI/EMI, SCI, SPI |
POR, PWM, WDT |
18 |
- |
ROMless |
- |
7.5K x 8 |
4.75 V ~ 5.25 V |
A/D 16x10b |
External |
-40°C ~ 85°C (TA) |
- |
160-BQFP |
160-QFP (28x28) |
||
NXP |
IC MCU 32BIT ROMLESS 144LQFP
|
Package: 144-LQFP |
Stock4,144 |
|
144-LQFP |
M683xx |
CPU32 |
32-Bit |
20MHz |
EBI/EMI, SCI, SPI, UART/USART |
POR, PWM, WDT |
15 |
- |
ROMless |
- |
2K x 8 |
4.5 V ~ 5.5 V |
- |
Internal |
-40°C ~ 85°C (TA) |
- |
144-LQFP |
144-LQFP (20x20) |
||
NXP |
IC MCU 32BIT ROMLESS 144LQFP
|
Package: 144-LQFP |
Stock12,156 |
|
144-LQFP |
M683xx |
CPU32 |
32-Bit |
16MHz |
EBI/EMI, SCI, SPI, UART/USART |
POR, PWM, WDT |
15 |
- |
ROMless |
- |
2K x 8 |
4.5 V ~ 5.5 V |
- |
Internal |
-40°C ~ 85°C (TA) |
- |
144-LQFP |
144-LQFP (20x20) |
||
NXP |
IC MCU 32BIT ROMLESS 144LQFP
|
Package: 144-LQFP |
Stock4,208 |
|
144-LQFP |
M683xx |
CPU32 |
32-Bit |
20MHz |
EBI/EMI, SCI, SPI, UART/USART |
POR, PWM, WDT |
15 |
- |
ROMless |
- |
2K x 8 |
4.5 V ~ 5.5 V |
- |
Internal |
-40°C ~ 85°C (TA) |
- |
144-LQFP |
144-LQFP (20x20) |
||
NXP |
IC MCU 32BIT ROMLESS 144LQFP
|
Package: 144-LQFP |
Stock19,500 |
|
144-LQFP |
M683xx |
CPU32 |
32-Bit |
16MHz |
EBI/EMI, SCI, SPI, UART/USART |
POR, PWM, WDT |
15 |
- |
ROMless |
- |
2K x 8 |
4.5 V ~ 5.5 V |
- |
Internal |
-40°C ~ 85°C (TA) |
- |
144-LQFP |
144-LQFP (20x20) |
||
NXP |
IC MCU 32BIT ROMLESS 144LQFP
|
Package: 144-LQFP |
Stock18,144 |
|
144-LQFP |
M683xx |
CPU32 |
32-Bit |
16MHz |
EBI/EMI, SCI, SPI, UART/USART |
POR, PWM, WDT |
18 |
- |
ROMless |
- |
- |
4.5 V ~ 5.5 V |
- |
Internal |
-40°C ~ 85°C (TA) |
- |
144-LQFP |
144-LQFP (20x20) |
||
NXP |
IC MCU 16BIT 128KB FLASH 112LQFP
|
Package: 112-LQFP |
Stock8,232 |
|
112-LQFP |
HC12 |
CPU12 |
16-Bit |
8MHz |
CAN, I2C, SCI, SPI |
POR, PWM, WDT |
67 |
128KB (128K x 8) |
FLASH |
2K x 8 |
8K x 8 |
4.5 V ~ 5.5 V |
A/D 16x8/10b |
Internal |
-40°C ~ 85°C (TA) |
- |
112-LQFP |
112-LQFP (20x20) |
||
NXP |
IC MCU 16BIT 120KB FLASH 160BGA
|
Package: 160-BGA |
Stock2,400 |
|
160-BGA |
56F8xx |
56800 |
16-Bit |
80MHz |
CAN, EBI/EMI, SCI, SPI |
POR, PWM, WDT |
32 |
120KB (60K x 16) |
FLASH |
- |
4K x 16 |
3 V ~ 3.6 V |
A/D 16x12b |
External |
-40°C ~ 85°C (TA) |
- |
160-BGA |
160-MAPBGA (15x15) |
||
NXP |
IC MCU 8BIT 12KB FLASH 48LQFP
|
Package: 48-LQFP |
Stock3,856 |
|
48-LQFP |
HC08 |
HC08 |
8-Bit |
8MHz |
I2C, SCI |
LVD, POR, PWM, Temp Sensor |
31 |
12KB (12K x 8) |
FLASH |
- |
512 x 8 |
2.7 V ~ 5.5 V |
A/D 14x10b |
Internal |
-40°C ~ 85°C (TA) |
- |
48-LQFP |
48-LQFP (7x7) |
||
NXP |
IC MCU 16BIT ROMLESS 144LQFP
|
Package: 144-LQFP |
Stock3,360 |
|
144-LQFP |
HC16 |
CPU16 |
16-Bit |
25MHz |
EBI/EMI, SCI, SPI |
POR, PWM, WDT |
16 |
- |
ROMless |
- |
1K x 8 |
2.7 V ~ 5.5 V |
A/D 8x10b |
Internal |
-40°C ~ 85°C (TA) |
- |
144-LQFP |
144-LQFP (20x20) |
||
NXP |
IC MCU 8BIT ROMLESS 52PLCC
|
Package: 52-LCC (J-Lead) |
Stock7,920 |
|
52-LCC (J-Lead) |
HC11 |
HC11 |
8-Bit |
2MHz |
SCI, SPI |
POR, WDT |
38 |
- |
ROMless |
- |
512 x 8 |
4.5 V ~ 5.5 V |
A/D 8x8b |
Internal |
-40°C ~ 85°C (TA) |
- |
52-LCC (J-Lead) |
52-PLCC (19.1x19.1) |
||
NXP |
IC MCU 8BIT 12KB OTP 52PLCC
|
Package: 52-LCC (J-Lead) |
Stock123,012 |
|
52-LCC (J-Lead) |
HC11 |
HC11 |
8-Bit |
2MHz |
SCI, SPI |
POR, WDT |
38 |
12KB (12K x 8) |
OTP |
512 x 8 |
512 x 8 |
4.5 V ~ 5.5 V |
A/D 8x8b |
Internal |
-40°C ~ 85°C (TA) |
- |
52-LCC (J-Lead) |
52-PLCC (19.1x19.1) |
||
NXP |
IC MCU 8BIT ROMLESS 68PLCC
|
Package: 68-LCC (J-Lead) |
Stock7,728 |
|
68-LCC (J-Lead) |
HC11 |
HC11 |
8-Bit |
2MHz |
SCI, SPI |
POR, WDT |
30 |
- |
ROMless |
512 x 8 |
1K x 8 |
4.75 V ~ 5.25 V |
A/D 8x8b |
Internal |
-40°C ~ 85°C (TA) |
- |
68-LCC (J-Lead) |
68-PLCC (25x25) |
||
NXP |
IC MCU 8BIT ROMLESS 68PLCC
|
Package: 68-LCC (J-Lead) |
Stock50,820 |
|
68-LCC (J-Lead) |
HC11 |
HC11 |
8-Bit |
3MHz |
SCI, SPI |
POR, WDT |
30 |
- |
ROMless |
512 x 8 |
1K x 8 |
4.75 V ~ 5.25 V |
A/D 8x8b |
Internal |
-40°C ~ 85°C (TA) |
- |
68-LCC (J-Lead) |
68-PLCC (25x25) |
||
NXP |
IC MCU 8BIT ROMLESS 68PLCC
|
Package: 68-LCC (J-Lead) |
Stock17,520 |
|
68-LCC (J-Lead) |
HC11 |
HC11 |
8-Bit |
4MHz |
SCI, SPI |
POR, WDT |
30 |
- |
ROMless |
512 x 8 |
1K x 8 |
4.75 V ~ 5.25 V |
A/D 8x8b |
Internal |
-40°C ~ 85°C (TA) |
- |
68-LCC (J-Lead) |
68-PLCC (25x25) |
||
NXP |
IC MCU 8BIT 12KB OTP 52PLCC
|
Package: 52-LCC (J-Lead) |
Stock24,096 |
|
52-LCC (J-Lead) |
HC11 |
HC11 |
8-Bit |
2MHz |
SCI, SPI |
POR, WDT |
38 |
12KB (12K x 8) |
OTP |
512 x 8 |
512 x 8 |
4.5 V ~ 5.5 V |
A/D 8x8b |
External |
-40°C ~ 85°C (TA) |
- |
52-LCC (J-Lead) |
52-PLCC (19.1x19.1) |
||
NXP |
IC MCU 8BIT ROMLESS 80LQFP
|
Package: 80-LQFP |
Stock9,372 |
|
80-LQFP |
HC11 |
HC11 |
8-Bit |
4MHz |
SCI, SPI |
POR, WDT |
30 |
- |
ROMless |
512 x 8 |
1K x 8 |
4.75 V ~ 5.25 V |
A/D 8x8b |
Internal |
-40°C ~ 85°C (TA) |
- |
80-LQFP |
80-LQFP (14x14) |
||
NXP |
IC MCU 8BIT 4KB FLASH 20SOIC
|
Package: 20-SOIC (0.295", 7.50mm Width) |
Stock2,162,952 |
|
20-SOIC (0.295", 7.50mm Width) |
HC08 |
HC08 |
8-Bit |
8MHz |
- |
LED, LVD, POR, PWM |
15 |
4KB (4K x 8) |
FLASH |
- |
128 x 8 |
2.7 V ~ 3.3 V |
A/D 12x8b |
External |
-40°C ~ 85°C (TA) |
- |
20-SOIC (0.295", 7.50mm Width) |
20-SOIC |
||
NXP |
IC MCU 8BIT 3.75KB OTP 40DIP
|
Package: 40-DIP (0.600", 15.24mm) |
Stock5,136 |
|
40-DIP (0.600", 15.24mm) |
HC05 |
HC05 |
8-Bit |
4MHz |
- |
LED, POR |
32 |
3.75KB (3.75K x 8) |
OTP |
- |
192 x 8 |
3 V ~ 5.5 V |
A/D 4x8b |
Internal |
-40°C ~ 85°C (TA) |
- |
40-DIP (0.600", 15.24mm) |
40-PDIP |
||
NXP |
IC MCU 8BIT 24KB OTP 80QFP
|
Package: 80-QFP |
Stock5,536 |
|
80-QFP |
HC11 |
HC11 |
8-Bit |
4MHz |
SCI, SPI |
POR, PWM, WDT |
62 |
24KB (24K x 8) |
OTP |
640 x 8 |
768 x 8 |
4.5 V ~ 5.5 V |
A/D 8x8b |
Internal |
-40°C ~ 85°C (TA) |
- |
80-QFP |
80-QFP (14x14) |