* Please refer to the English Version as our Official Version.
Image |
Part Number |
Manufacturer |
Description |
Package |
Stock |
Quantity |
Package |
Series |
Core Processor |
Core Size |
Speed |
Connectivity |
Peripherals |
Number of I/O |
Program Memory Size |
Program Memory Type |
EEPROM Size |
RAM Size |
Voltage - Supply (Vcc/Vdd) |
Data Converters |
Oscillator Type |
Operating Temperature |
Mounting Type |
Package / Case |
Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC MCU 8BIT 4KB FLASH 20DIP
|
Package: 20-DIP (0.300", 7.62mm) |
Stock6,400 |
|
20-DIP (0.300", 7.62mm) |
HC08 |
HC08 |
8-Bit |
8MHz |
- |
LED, LVD, POR, PWM |
15 |
4KB (4K x 8) |
FLASH |
- |
128 x 8 |
2.7 V ~ 3.3 V |
A/D 12x8b |
External |
-40°C ~ 85°C (TA) |
- |
20-DIP (0.300", 7.62mm) |
20-DIP |
||
NXP |
IC MCU 8BIT 1.5KB FLASH 20DIP
|
Package: 20-DIP (0.300", 7.62mm) |
Stock3,472 |
|
20-DIP (0.300", 7.62mm) |
HC08 |
HC08 |
8-Bit |
8MHz |
- |
LED, LVD, POR, PWM |
14 |
1.5KB (1.5K x 8) |
FLASH |
- |
128 x 8 |
2.7 V ~ 3.3 V |
A/D 12x8b |
External |
-40°C ~ 85°C (TA) |
- |
20-DIP (0.300", 7.62mm) |
20-DIP |
||
NXP |
IC MCU 8BIT 1.2KB OTP 16SOIC
|
Package: 16-SOIC (0.295", 7.50mm Width) |
Stock2,704 |
|
16-SOIC (0.295", 7.50mm Width) |
HC05 |
HC05 |
8-Bit |
4MHz |
- |
POR, WDT |
10 |
1.2KB (1.2K x 8) |
OTP |
- |
64 x 8 |
3 V ~ 5.5 V |
- |
Internal |
-40°C ~ 85°C (TA) |
- |
16-SOIC (0.295", 7.50mm Width) |
16-SOIC |
||
NXP |
IC MCU 8BIT ROMLESS 52PLCC
|
Package: 52-LCC (J-Lead) |
Stock4,112 |
|
52-LCC (J-Lead) |
HC11 |
HC11 |
8-Bit |
2MHz |
SCI, SPI |
POR, WDT |
38 |
- |
ROMless |
512 x 8 |
512 x 8 |
3 V ~ 5.5 V |
A/D 8x8b |
Internal |
-40°C ~ 85°C (TA) |
- |
52-LCC (J-Lead) |
52-PLCC (19.1x19.1) |
||
NXP |
IC MCU 8BIT 6KB OTP 20DIP
|
Package: 20-DIP (0.300", 7.62mm) |
Stock4,384 |
|
20-DIP (0.300", 7.62mm) |
HC05 |
HC05 |
8-Bit |
2.1MHz |
SIO |
POR, Temp Sensor, WDT |
14 |
6KB (6K x 8) |
OTP |
- |
224 x 8 |
2.7 V ~ 5.5 V |
A/D 4x12b |
Internal |
-40°C ~ 85°C (TA) |
- |
20-DIP (0.300", 7.62mm) |
20-DIP |
||
NXP |
IC MCU 8BIT ROMLESS 52PLCC
|
Package: 52-LCC (J-Lead) |
Stock5,712 |
|
52-LCC (J-Lead) |
HC11 |
HC11 |
8-Bit |
2MHz |
SCI, SPI |
POR, WDT |
38 |
- |
ROMless |
- |
512 x 8 |
3 V ~ 5.5 V |
A/D 8x8b |
Internal |
0°C ~ 70°C (TA) |
- |
52-LCC (J-Lead) |
52-PLCC (19.1x19.1) |
||
NXP |
IC MCU 8BIT 1.2KB OTP 16SOIC
|
Package: 16-SOIC (0.295", 7.50mm Width) |
Stock3,824 |
|
16-SOIC (0.295", 7.50mm Width) |
HC05 |
HC05 |
8-Bit |
4MHz |
- |
POR, WDT |
10 |
1.2KB (1.2K x 8) |
OTP |
- |
64 x 8 |
3 V ~ 5.5 V |
- |
Internal |
-40°C ~ 85°C (TA) |
- |
16-SOIC (0.295", 7.50mm Width) |
16-SOIC |
||
NXP |
IC MCU 8BIT ROMLESS 44PLCC
|
Package: 44-LCC (J-Lead) |
Stock2,080 |
|
44-LCC (J-Lead) |
HC11 |
HC11 |
8-Bit |
2MHz |
SCI, SPI |
POR, WDT |
26 |
- |
ROMless |
- |
192 x 8 |
3 V ~ 5.5 V |
- |
Internal |
0°C ~ 70°C (TA) |
- |
44-LCC (J-Lead) |
44-PLCC (17.525x17.525) |
||
NXP |
IC MCU 8BIT 4KB FLASH 20DIP
|
Package: 20-DIP (0.300", 7.62mm) |
Stock6,352 |
|
20-DIP (0.300", 7.62mm) |
HC08 |
HC08 |
8-Bit |
8MHz |
- |
LED, LVD, POR, PWM |
15 |
4KB (4K x 8) |
FLASH |
- |
128 x 8 |
2.7 V ~ 3.3 V |
A/D 12x8b |
External |
-40°C ~ 85°C (TA) |
- |
20-DIP (0.300", 7.62mm) |
20-DIP |
||
NXP |
IC MCU 8BIT ROMLESS 44QFP
|
Package: 44-QFP |
Stock5,360 |
|
44-QFP |
HC11 |
HC11 |
8-Bit |
2MHz |
SCI, SPI |
POR, WDT |
26 |
- |
ROMless |
- |
192 x 8 |
3 V ~ 5.5 V |
- |
Internal |
-40°C ~ 85°C (TA) |
- |
44-QFP |
44-QFP (10x10) |
||
NXP |
IC MCU 8BIT 1.5KB FLASH 20DIP
|
Package: 20-DIP (0.300", 7.62mm) |
Stock4,896 |
|
20-DIP (0.300", 7.62mm) |
HC08 |
HC08 |
8-Bit |
8MHz |
- |
LED, LVD, POR, PWM |
14 |
1.5KB (1.5K x 8) |
FLASH |
- |
128 x 8 |
4.5 V ~ 5.5 V |
A/D 12x8b |
External |
-40°C ~ 125°C (TA) |
- |
20-DIP (0.300", 7.62mm) |
20-DIP |
||
NXP |
IC MCU 8BIT 1.2KB OTP 20DIP
|
Package: 20-DIP (0.300", 7.62mm) |
Stock4,528 |
|
20-DIP (0.300", 7.62mm) |
HC05 |
HC05 |
8-Bit |
4MHz |
- |
POR, WDT |
14 |
1.2KB (1.2K x 8) |
OTP |
- |
64 x 8 |
3 V ~ 5.5 V |
- |
Internal |
-40°C ~ 85°C (TA) |
- |
20-DIP (0.300", 7.62mm) |
20-DIP |
||
NXP |
IC MCU 8BIT 1.5KB FLASH 20DIP
|
Package: 20-DIP (0.300", 7.62mm) |
Stock5,888 |
|
20-DIP (0.300", 7.62mm) |
HC08 |
HC08 |
8-Bit |
8MHz |
- |
LED, LVD, POR, PWM |
14 |
1.5KB (1.5K x 8) |
FLASH |
- |
128 x 8 |
2.7 V ~ 3.3 V |
A/D 12x8b |
External |
-40°C ~ 85°C (TA) |
- |
20-DIP (0.300", 7.62mm) |
20-DIP |
||
NXP |
IC MCU 8BIT 1.2KB OTP 20DIP
|
Package: 20-DIP (0.300", 7.62mm) |
Stock6,928 |
|
20-DIP (0.300", 7.62mm) |
HC05 |
HC05 |
8-Bit |
4MHz |
- |
POR, WDT |
14 |
1.2KB (1.2K x 8) |
OTP |
- |
64 x 8 |
3 V ~ 5.5 V |
- |
Internal |
-40°C ~ 85°C (TA) |
- |
20-DIP (0.300", 7.62mm) |
20-DIP |
||
NXP |
IC MCU 8BIT 32KB OTP 68PLCC
|
Package: 68-LCC (J-Lead) |
Stock7,520 |
|
68-LCC (J-Lead) |
HC11 |
HC11 |
8-Bit |
3MHz |
SCI, SPI |
POR, PWM, WDT |
51 |
32KB (32K x 8) |
OTP |
640 x 8 |
1K x 8 |
4.5 V ~ 5.5 V |
A/D 8x8b |
Internal |
-40°C ~ 105°C (TA) |
- |
68-LCC (J-Lead) |
68-PLCC (25x25) |
||
NXP |
IC MCU 8BIT 12KB OTP 52PLCC
|
Package: 52-LCC (J-Lead) |
Stock5,120 |
|
52-LCC (J-Lead) |
HC11 |
HC11 |
8-Bit |
2MHz |
SCI, SPI |
POR, WDT |
38 |
12KB (12K x 8) |
OTP |
512 x 8 |
512 x 8 |
4.5 V ~ 5.5 V |
A/D 8x8b |
Internal |
-40°C ~ 105°C (TA) |
- |
52-LCC (J-Lead) |
52-PLCC (19.1x19.1) |
||
NXP |
IC MCU 8BIT 32KB OTP 68PLCC
|
Package: 68-LCC (J-Lead) |
Stock7,136 |
|
68-LCC (J-Lead) |
HC11 |
HC11 |
8-Bit |
4MHz |
SCI, SPI |
POR, PWM, WDT |
51 |
32KB (32K x 8) |
OTP |
640 x 8 |
1K x 8 |
4.5 V ~ 5.5 V |
A/D 8x8b |
Internal |
-40°C ~ 125°C (TA) |
- |
68-LCC (J-Lead) |
68-PLCC (25x25) |
||
NXP |
IC MCU 8BIT 12KB OTP 52PLCC
|
Package: 52-LCC (J-Lead) |
Stock6,224 |
|
52-LCC (J-Lead) |
HC11 |
HC11 |
8-Bit |
2MHz |
SCI, SPI |
POR, WDT |
38 |
12KB (12K x 8) |
OTP |
512 x 8 |
512 x 8 |
4.5 V ~ 5.5 V |
A/D 8x8b |
Internal |
-40°C ~ 125°C (TA) |
- |
52-LCC (J-Lead) |
52-PLCC (19.1x19.1) |
||
NXP |
IC MCU 8BIT 32KB OTP 68PLCC
|
Package: 68-LCC (J-Lead) |
Stock5,328 |
|
68-LCC (J-Lead) |
HC11 |
HC11 |
8-Bit |
4MHz |
SCI, SPI |
POR, PWM, WDT |
51 |
32KB (32K x 8) |
OTP |
640 x 8 |
1K x 8 |
4.5 V ~ 5.5 V |
A/D 8x8b |
Internal |
-40°C ~ 85°C (TA) |
- |
68-LCC (J-Lead) |
68-PLCC (25x25) |
||
NXP |
IC MCU 8BIT 12KB OTP 52PLCC
|
Package: 52-LCC (J-Lead) |
Stock5,376 |
|
52-LCC (J-Lead) |
HC11 |
HC11 |
8-Bit |
3MHz |
SCI, SPI |
POR, WDT |
38 |
12KB (12K x 8) |
OTP |
512 x 8 |
512 x 8 |
4.5 V ~ 5.5 V |
A/D 8x8b |
Internal |
-40°C ~ 85°C (TA) |
- |
52-LCC (J-Lead) |
52-PLCC (19.1x19.1) |
||
NXP |
IC MCU 8BIT 32KB OTP 68PLCC
|
Package: 68-LCC (J-Lead) |
Stock10,284 |
|
68-LCC (J-Lead) |
HC11 |
HC11 |
8-Bit |
3MHz |
SCI, SPI |
POR, PWM, WDT |
51 |
32KB (32K x 8) |
OTP |
640 x 8 |
1K x 8 |
4.5 V ~ 5.5 V |
A/D 8x8b |
Internal |
-40°C ~ 85°C (TA) |
- |
68-LCC (J-Lead) |
68-PLCC (25x25) |
||
NXP |
IC MCU 8BIT 12KB OTP 52PLCC
|
Package: 52-LCC (J-Lead) |
Stock157,188 |
|
52-LCC (J-Lead) |
HC11 |
HC11 |
8-Bit |
2MHz |
SCI, SPI |
POR, WDT |
38 |
12KB (12K x 8) |
OTP |
512 x 8 |
512 x 8 |
4.5 V ~ 5.5 V |
A/D 8x8b |
Internal |
-40°C ~ 85°C (TA) |
- |
52-LCC (J-Lead) |
52-PLCC (19.1x19.1) |
||
NXP |
IC MCU 8BIT 1.2KB OTP 16DIP
|
Package: 16-DIP (0.300", 7.62mm) |
Stock9,912 |
|
16-DIP (0.300", 7.62mm) |
HC05 |
HC05 |
8-Bit |
4MHz |
- |
POR, WDT |
10 |
1.2KB (1.2K x 8) |
OTP |
- |
64 x 8 |
3 V ~ 5.5 V |
- |
Internal |
-40°C ~ 85°C (TA) |
- |
16-DIP (0.300", 7.62mm) |
16-DIP |
||
NXP |
IC MCU 8BIT 4KB OTP 44PLCC
|
Package: 44-LCC (J-Lead) |
Stock12,972 |
|
44-LCC (J-Lead) |
HC11 |
HC11 |
8-Bit |
3MHz |
SCI, SPI |
POR, WDT |
26 |
4KB (4K x 8) |
OTP |
- |
192 x 8 |
4.5 V ~ 5.5 V |
- |
Internal |
-40°C ~ 85°C (TA) |
- |
44-LCC (J-Lead) |
44-PLCC (17.525x17.525) |
||
NXP |
IC MCU 8BIT 1.2KB OTP 16SOIC
|
Package: 16-SOIC (0.295", 7.50mm Width) |
Stock4,032 |
|
16-SOIC (0.295", 7.50mm Width) |
HC05 |
HC05 |
8-Bit |
4MHz |
- |
POR, WDT |
10 |
1.2KB (1.2K x 8) |
OTP |
- |
64 x 8 |
3 V ~ 5.5 V |
- |
Internal |
-40°C ~ 85°C (TA) |
- |
16-SOIC (0.295", 7.50mm Width) |
16-SOIC |
||
NXP |
IC MCU 8BIT 4KB OTP 44PLCC
|
Package: 44-LCC (J-Lead) |
Stock14,928 |
|
44-LCC (J-Lead) |
HC11 |
HC11 |
8-Bit |
2MHz |
SCI, SPI |
POR, WDT |
26 |
4KB (4K x 8) |
OTP |
- |
192 x 8 |
4.5 V ~ 5.5 V |
- |
Internal |
-40°C ~ 85°C (TA) |
- |
44-LCC (J-Lead) |
44-PLCC (17.525x17.525) |
||
NXP |
IC MCU 8BIT 6KB OTP 28SOIC
|
Package: 28-SOIC (0.295", 7.50mm Width) |
Stock6,496 |
|
28-SOIC (0.295", 7.50mm Width) |
HC05 |
HC05 |
8-Bit |
2.1MHz |
SIO |
POR, Temp Sensor, WDT |
22 |
6KB (6K x 8) |
OTP |
- |
224 x 8 |
2.7 V ~ 5.5 V |
A/D 4x12b |
Internal |
-40°C ~ 85°C (TA) |
- |
28-SOIC (0.295", 7.50mm Width) |
28-SOIC |
||
NXP |
IC MCU 8BIT 16KB OTP 44PLCC
|
Package: 44-LCC (J-Lead) |
Stock5,344 |
|
44-LCC (J-Lead) |
HC05 |
HC05 |
8-Bit |
2.1MHz |
SCI, SPI |
POR, WDT |
24 |
16KB (16K x 8) |
OTP |
- |
352 x 8 |
3 V ~ 5.5 V |
- |
Internal |
-40°C ~ 105°C (TA) |
- |
44-LCC (J-Lead) |
44-PLCC (17.525x17.525) |
||
NXP |
IC MCU 8BIT 6KB OTP 20DIP
|
Package: 20-DIP (0.300", 7.62mm) |
Stock5,424 |
|
20-DIP (0.300", 7.62mm) |
HC05 |
HC05 |
8-Bit |
2.1MHz |
SIO |
POR, Temp Sensor, WDT |
14 |
6KB (6K x 8) |
OTP |
- |
224 x 8 |
2.7 V ~ 5.5 V |
A/D 4x12b |
Internal |
-40°C ~ 85°C (TA) |
- |
20-DIP (0.300", 7.62mm) |
20-DIP |
||
NXP |
IC MCU 8BIT ROMLESS 44PLCC
|
Package: 44-LCC (J-Lead) |
Stock5,152 |
|
44-LCC (J-Lead) |
HC11 |
HC11 |
8-Bit |
3MHz |
SCI, SPI |
POR, WDT |
26 |
- |
ROMless |
- |
192 x 8 |
4.5 V ~ 5.5 V |
- |
Internal |
-40°C ~ 85°C (TA) |
- |
44-LCC (J-Lead) |
44-PLCC (17.525x17.525) |