* Please refer to the English Version as our Official Version.
Image |
Part Number |
Manufacturer |
Description |
Package |
Stock |
Quantity |
Package |
Series |
Core Processor |
Core Size |
Speed |
Connectivity |
Peripherals |
Number of I/O |
Program Memory Size |
Program Memory Type |
EEPROM Size |
RAM Size |
Voltage - Supply (Vcc/Vdd) |
Data Converters |
Oscillator Type |
Operating Temperature |
Mounting Type |
Package / Case |
Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
8-BIT MCU S08 CORE 4KB FLASH
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock6,368 |
|
8-SOIC (0.154", 3.90mm Width) |
S08 |
S08 |
8-Bit |
16MHz |
- |
LVD, POR, PWM, WDT |
4 |
4KB (4K x 8) |
FLASH |
- |
256 x 8 |
2.7 V ~ 5.5 V |
A/D 4x10b |
Internal |
-40°C ~ 85°C (TA) |
- |
8-SOIC (0.154", 3.90mm Width) |
8-SOIC |
||
NXP |
32-BIT ARM CORTEX-M0+
|
Package: 32-VFQFN Exposed Pad |
Stock7,104 |
|
32-VFQFN Exposed Pad |
LPC80xM |
ARM® Cortex®-M0+ |
32-Bit |
15MHz |
I²C, SPI, UART/USART |
Brown-out Detect/Reset, POR, PWM, WDT |
17 |
16KB (16K x 8) |
FLASH |
- |
2K x 8 |
1.71 V ~ 3.6 V |
A/D 12x12b |
Internal |
-40°C ~ 105°C (TA) |
- |
32-VFQFN Exposed Pad |
33-HVQFN (5x5) |
||
NXP |
KINETIS KE04: 48MHZ CORTEX-M0+ 5
|
Package: 16-LSSOP (0.173", 4.40mm Width) |
Stock5,904 |
|
16-LSSOP (0.173", 4.40mm Width) |
Kinetis KE04 |
ARM® Cortex®-M0+ |
32-Bit |
48MHz |
I²C, SPI, UART/USART |
LVD, PWM, WDT |
14 |
8KB (8K x 8) |
FLASH |
- |
1K x 8 |
2.7 V ~ 5.5 V |
A/D 6x12b, D/A 2x6b |
Internal |
-40°C ~ 105°C (TA) |
- |
16-LSSOP (0.173", 4.40mm Width) |
16-SOP |
||
NXP |
S08PA 8-BIT MCU S08 CORE 4KB F
|
Package: 16-TSSOP (0.173", 4.40mm Width) |
Stock6,336 |
|
16-TSSOP (0.173", 4.40mm Width) |
S08 |
S08 |
8-Bit |
20MHz |
LINbus, SPI, UART/USART |
LVD, POR, PWM, WDT |
14 |
4KB (4K x 8) |
FLASH |
128 x 8 |
512 x 8 |
2.7 V ~ 5.5 V |
A/D 8x12b |
Internal |
-40°C ~ 105°C (TA) |
- |
16-TSSOP (0.173", 4.40mm Width) |
16-TSSOP |
||
NXP |
IC SRAM 2M FLASH 257MAPBGA
|
Package: 257-LFBGA |
Stock4,112 |
|
257-LFBGA |
S32R |
e200z4, e200z7 (2) |
32-Bit Tri-Core |
180MHz, 240MHz |
CANbus, Ethernet, FlexRay, I²C, LINbus, SPI, ZipWire |
POR, PWM, WDT |
- |
2MB (2M x 8) |
FLASH |
64K x 8 |
1.5M x 8 |
1.19 V ~ 5.5 V |
A/D 16x12b SAR, 4x12 Sigma, D/A 1x12b |
Internal |
-40°C ~ 125°C (TA) |
- |
257-LFBGA |
257-MAPBGA (14x14) |
||
NXP |
NXP 32 BIT MCU 2M FLASH 1.5MB
|
Package: 257-LFBGA |
Stock5,568 |
|
257-LFBGA |
S32R |
e200z4, e200z7 (2) |
32-Bit Tri-Core |
180MHz, 240MHz |
CANbus, Ethernet, FlexRay, I²C, LINbus, SPI, ZipWire |
POR, PWM, WDT |
- |
2MB (2M x 8) |
FLASH |
64K x 8 |
1.5M x 8 |
1.19 V ~ 5.5 V |
A/D 16x12b SAR, 4x12 Sigma, D/A 1x12b |
Internal |
-40°C ~ 125°C (TA) |
- |
257-LFBGA |
257-MAPBGA (14x14) |
||
NXP |
8-BIT MCU S08 CORE 2KB FLASH
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock5,088 |
|
8-SOIC (0.154", 3.90mm Width) |
S08 |
S08 |
8-Bit |
16MHz |
- |
LVD, POR, PWM, WDT |
4 |
2KB (2K x 8) |
FLASH |
- |
128 x 8 |
2.7 V ~ 5.5 V |
A/D 4x10b |
Internal |
-40°C ~ 105°C (TA) |
- |
8-SOIC (0.154", 3.90mm Width) |
8-SOIC |
||
NXP |
S08PA 8-BIT MCU S08 CORE 16KB
|
Package: 32-LQFP |
Stock6,576 |
|
32-LQFP |
S08 |
S08 |
8-Bit |
20MHz |
I²C, LINbus, SPI, UART/USART |
LVD, POR, PWM, WDT |
28 |
16KB (16K x 8) |
FLASH |
256 x 8 |
2K x 8 |
2.7 V ~ 5.5 V |
A/D 12x12b |
Internal |
-40°C ~ 105°C (TA) |
- |
32-LQFP |
32-LQFP (7x7) |
||
NXP |
S08PA 8-BIT MCU S08 CORE 8KB F
|
Package: 44-LQFP |
Stock5,824 |
|
44-LQFP |
S08 |
S08 |
8-Bit |
20MHz |
I²C, LINbus, SPI, UART/USART |
LVD, POR, PWM, WDT |
37 |
8KB (8K x 8) |
FLASH |
256 x 8 |
2K x 8 |
2.7 V ~ 5.5 V |
A/D 12x12b |
Internal |
-40°C ~ 105°C (TA) |
- |
44-LQFP |
44-LQFP (10x10) |
||
NXP |
8-BIT MCU S08 CORE 2KB FLASH
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock2,832 |
|
8-SOIC (0.154", 3.90mm Width) |
S08 |
S08 |
8-Bit |
16MHz |
- |
LVD, POR, PWM, WDT |
4 |
2KB (2K x 8) |
FLASH |
- |
128 x 8 |
2.7 V ~ 5.5 V |
A/D 4x10b |
Internal |
-40°C ~ 85°C (TA) |
- |
8-SOIC (0.154", 3.90mm Width) |
8-SOIC |
||
NXP |
S08QD 8-BIT MCU S08 CORE 2KB F
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock2,400 |
|
8-SOIC (0.154", 3.90mm Width) |
S08 |
S08 |
8-Bit |
16MHz |
- |
LVD, POR, PWM, WDT |
4 |
2KB (2K x 8) |
FLASH |
- |
128 x 8 |
2.7 V ~ 5.5 V |
A/D 4x10b |
Internal |
-40°C ~ 105°C (TA) |
- |
8-SOIC (0.154", 3.90mm Width) |
8-SOIC |
||
NXP |
KINETIS KL03: 48MHZ CORTEX-M0+ U
|
Package: 24-VFQFN Exposed Pad |
Stock4,160 |
|
24-VFQFN Exposed Pad |
Kinetis KL03 |
ARM® Cortex®-M0+ |
32-Bit |
48MHz |
I²C, SPI, UART/USART |
Brown-out Detect/Reset, LVD, POR, PWM, WDT |
22 |
32KB (32K x 8) |
FLASH |
- |
2K x 8 |
1.71 V ~ 3.6 V |
A/D 7x12b |
Internal |
-40°C ~ 105°C (TA) |
- |
24-VFQFN Exposed Pad |
24-QFN (4x4) |
||
NXP |
KINETIS KE02: 20MHZ CORTEX-M0+ 5
|
Package: 32-LQFP |
Stock3,472 |
|
32-LQFP |
Kinetis KE02 |
ARM® Cortex®-M0+ |
32-Bit |
20MHz |
I²C, SPI, UART/USART |
LVD, PWM, WDT |
28 |
16KB (16K x 8) |
FLASH |
256 x 8 |
2K x 8 |
2.7 V ~ 5.5 V |
A/D 16x12b, D/A 2x6b |
Internal |
-40°C ~ 105°C (TA) |
- |
32-LQFP |
32-LQFP (7x7) |
||
NXP |
S08PT 8-BIT MCU S08 CORE 16KB
|
Package: 16-TSSOP (0.173", 4.40mm Width) |
Stock5,760 |
|
16-TSSOP (0.173", 4.40mm Width) |
S08 |
S08 |
8-Bit |
20MHz |
I²C, LINbus, SPI, UART/USART |
LVD, POR, PWM, WDT |
14 |
16KB (16K x 8) |
FLASH |
256 x 8 |
2K x 8 |
2.7 V ~ 5.5 V |
A/D 12x12b |
Internal |
-40°C ~ 105°C (TA) |
- |
16-TSSOP (0.173", 4.40mm Width) |
16-TSSOP |
||
NXP |
KINETIS KL03: 48MHZ CORTEX-M0+ U
|
Package: 16-WQFN Exposed Pad |
Stock7,744 |
|
16-WQFN Exposed Pad |
Kinetis KL03 |
ARM® Cortex®-M0+ |
32-Bit |
48MHz |
I²C, SPI, UART/USART |
Brown-out Detect/Reset, LVD, POR, PWM, WDT |
14 |
32KB (32K x 8) |
FLASH |
- |
2K x 8 |
1.71 V ~ 3.6 V |
A/D 7x12b |
Internal |
-40°C ~ 105°C (TA) |
- |
16-WQFN Exposed Pad |
16-QFN (3x3) |
||
NXP |
S08PA 8-BIT MCU S08 CORE 16 KB
|
Package: 20-TSSOP (0.173", 4.40mm Width) |
Stock5,664 |
|
20-TSSOP (0.173", 4.40mm Width) |
S08 |
S08 |
8-Bit |
20MHz |
I²C, LINbus, SPI, UART/USART |
LVD, POR, PWM, WDT |
18 |
16KB (16K x 8) |
FLASH |
256 x 8 |
2K x 8 |
2.7 V ~ 5.5 V |
A/D 12x12b |
Internal |
-40°C ~ 105°C (TA) |
- |
20-TSSOP (0.173", 4.40mm Width) |
20-TSSOP |
||
NXP |
KINETIS E 32-BIT MCU ARM CORTEX
|
Package: 24-VFQFN Exposed Pad |
Stock4,128 |
|
24-VFQFN Exposed Pad |
Kinetis KEA |
ARM® Cortex®-M0+ |
32-Bit |
48MHz |
I²C, LINbus, SPI, UART/USART |
LVD, POR, PWM, WDT |
22 |
8KB (8K x 8) |
FLASH |
- |
1K x 8 |
2.7 V ~ 5.5 V |
A/D 12x12b |
Internal |
-40°C ~ 125°C (TA) |
- |
24-VFQFN Exposed Pad |
24-QFN (4x4) |
||
NXP |
KINETIS KE04: 48MHZ CORTEX-M0+ 5
|
Package: 20-SOIC (0.295", 7.50mm Width) |
Stock2,624 |
|
20-SOIC (0.295", 7.50mm Width) |
Kinetis KE04 |
ARM® Cortex®-M0+ |
32-Bit |
48MHz |
I²C, SPI, UART/USART |
LVD, PWM, WDT |
18 |
8KB (8K x 8) |
FLASH |
- |
1K x 8 |
2.7 V ~ 5.5 V |
A/D 10x12b, D/A 2x6b |
Internal |
-40°C ~ 105°C (TA) |
- |
20-SOIC (0.295", 7.50mm Width) |
20-SOIC |
||
NXP |
S08PA 8-BIT MCU S08 CORE 8KB F
|
Package: 20-SOIC (0.295", 7.50mm Width) |
Stock3,616 |
|
20-SOIC (0.295", 7.50mm Width) |
S08 |
S08 |
8-Bit |
20MHz |
I²C, LINbus, SPI, UART/USART |
LVD, POR, PWM, WDT |
18 |
8KB (8K x 8) |
FLASH |
256 x 8 |
2K x 8 |
2.7 V ~ 5.5 V |
A/D 12x12b |
Internal |
-40°C ~ 105°C (TA) |
- |
20-SOIC (0.295", 7.50mm Width) |
20-SOIC |
||
NXP |
S08PA 8-BIT MCU S08 CORE 16KB
|
Package: 16-TSSOP (0.173", 4.40mm Width) |
Stock4,096 |
|
16-TSSOP (0.173", 4.40mm Width) |
S08 |
S08 |
8-Bit |
20MHz |
I²C, LINbus, SPI, UART/USART |
LVD, POR, PWM, WDT |
14 |
16KB (16K x 8) |
FLASH |
256 x 8 |
2K x 8 |
2.7 V ~ 5.5 V |
A/D 12x12b |
Internal |
-40°C ~ 105°C (TA) |
- |
16-TSSOP (0.173", 4.40mm Width) |
16-TSSOP |
||
NXP |
KINETIS E 32-BIT MCU ARM CORTEX
|
Package: 24-VFQFN Exposed Pad |
Stock4,576 |
|
24-VFQFN Exposed Pad |
Kinetis KEA |
ARM® Cortex®-M0+ |
32-Bit |
48MHz |
I²C, LINbus, SPI, UART/USART |
LVD, POR, PWM, WDT |
22 |
8KB (8K x 8) |
FLASH |
- |
1K x 8 |
2.7 V ~ 5.5 V |
A/D 12x12b |
Internal |
-40°C ~ 105°C (TA) |
- |
24-VFQFN Exposed Pad |
24-QFN (4x4) |
||
NXP |
S08PA 8-BIT MCU S08 CORE 8KB F
|
Package: 20-TSSOP (0.173", 4.40mm Width) |
Stock5,632 |
|
20-TSSOP (0.173", 4.40mm Width) |
S08 |
S08 |
8-Bit |
20MHz |
I²C, LINbus, SPI, UART/USART |
LVD, POR, PWM, WDT |
18 |
8KB (8K x 8) |
FLASH |
256 x 8 |
2K x 8 |
2.7 V ~ 5.5 V |
A/D 12x12b |
Internal |
-40°C ~ 105°C (TA) |
- |
20-TSSOP (0.173", 4.40mm Width) |
20-TSSOP |
||
NXP |
KINETIS E 32-BIT MCU ARM CORTEX
|
Package: 24-VFQFN Exposed Pad |
Stock6,288 |
|
24-VFQFN Exposed Pad |
Kinetis KEA |
ARM® Cortex®-M0+ |
32-Bit |
48MHz |
I²C, LINbus, SPI, UART/USART |
LVD, POR, PWM, WDT |
22 |
8KB (8K x 8) |
FLASH |
- |
1K x 8 |
2.7 V ~ 5.5 V |
A/D 12x12b |
Internal |
-40°C ~ 105°C (TA) |
- |
24-VFQFN Exposed Pad |
24-QFN (4x4) |
||
NXP |
KINETIS KL03: 48MHZ CORTEX-M0+ U
|
Package: 24-VFQFN Exposed Pad |
Stock2,960 |
|
24-VFQFN Exposed Pad |
Kinetis KL03 |
ARM® Cortex®-M0+ |
32-Bit |
48MHz |
I²C, SPI, UART/USART |
Brown-out Detect/Reset, LVD, POR, PWM, WDT |
22 |
16KB (16K x 8) |
FLASH |
- |
2K x 8 |
1.71 V ~ 3.6 V |
A/D 7x12b |
Internal |
-40°C ~ 105°C (TA) |
- |
24-VFQFN Exposed Pad |
24-QFN (4x4) |
||
NXP |
FINISHED GOOD
|
Package: 16-TSSOP (0.173", 4.40mm Width) |
Stock4,208 |
|
16-TSSOP (0.173", 4.40mm Width) |
RS08 |
RS08 |
8-Bit |
20MHz |
I²C |
LVD, POR, PWM, WDT |
14 |
8KB (8K x 8) |
FLASH |
- |
254 x 8 |
1.8 V ~ 5.5 V |
A/D 12x10b |
Internal |
-40°C ~ 85°C (TA) |
- |
16-TSSOP (0.173", 4.40mm Width) |
16-TSSOP |
||
NXP |
KINETIS L 32-BIT MCU ARM CORTEX
|
Package: 16-WFQFN Exposed Pad |
Stock4,752 |
|
16-WFQFN Exposed Pad |
Kinetis KL03 |
ARM® Cortex®-M0+ |
32-Bit |
48MHz |
I²C, SPI, UART/USART |
Brown-out Detect/Reset, LVD, POR, PWM, WDT |
14 |
16KB (16K x 8) |
FLASH |
- |
2K x 8 |
1.71 V ~ 3.6 V |
A/D 7x12b |
Internal |
-40°C ~ 105°C (TA) |
- |
16-WFQFN Exposed Pad |
16-QFN (3x3) |
||
NXP |
32-BIT ARM CORTEX-M0+ MICROCONTR
|
Package: 32-VFQFN Exposed Pad |
Stock7,104 |
|
32-VFQFN Exposed Pad |
LPC83x |
ARM® Cortex®-M0+ |
32-Bit |
30MHz |
I²C, SPI, UART/USART |
Brown-out Detect/Reset, DMA, POR, PWM, WDT |
29 |
32KB (32K x 8) |
FLASH |
- |
4K x 8 |
1.8 V ~ 3.6 V |
A/D 12x12b |
Internal |
-40°C ~ 85°C (TA) |
- |
32-VFQFN Exposed Pad |
32-HVQFN (5x5) |
||
NXP |
KINETIS E 32-BIT MCU ARM CORTEX
|
Package: 16-TSSOP (0.173", 4.40mm Width) |
Stock5,856 |
|
16-TSSOP (0.173", 4.40mm Width) |
Kinetis KEA |
ARM® Cortex®-M0+ |
32-Bit |
48MHz |
I²C, LINbus, SPI, UART/USART |
LVD, POR, PWM, WDT |
14 |
8KB (8K x 8) |
FLASH |
- |
1K x 8 |
2.7 V ~ 5.5 V |
A/D 12x12b |
Internal |
-40°C ~ 105°C (TA) |
- |
16-TSSOP (0.173", 4.40mm Width) |
16-TSSOP |
||
NXP |
KINETIS KE04: 48MHZ CORTEX-M0+ 5
|
Package: 24-VFQFN Exposed Pad |
Stock6,272 |
|
24-VFQFN Exposed Pad |
Kinetis KE04 |
ARM® Cortex®-M0+ |
32-Bit |
48MHz |
I²C, SPI, UART/USART |
LVD, PWM, WDT |
22 |
8KB (8K x 8) |
FLASH |
- |
1K x 8 |
2.7 V ~ 5.5 V |
A/D 12x12b, D/A 2x6b |
Internal |
-40°C ~ 105°C (TA) |
- |
24-VFQFN Exposed Pad |
24-QFN (4x4) |
||
NXP |
32-BIT ARM CORTEX-M0+
|
Package: 32-VFQFN Exposed Pad |
Stock2,400 |
|
32-VFQFN Exposed Pad |
LPC80xM |
ARM® Cortex®-M0+ |
32-Bit |
15MHz |
I²C, SPI, UART/USART |
Brown-out Detect/Reset, POR, PWM, WDT |
30 |
32KB (32K x 8) |
FLASH |
- |
4K x 8 |
1.71 V ~ 3.6 V |
A/D 12x12b, D/A 1x10b |
Internal |
-40°C ~ 105°C (TA) |
- |
32-VFQFN Exposed Pad |
32-HVQFN (5x5) |