* Please refer to the English Version as our Official Version.
Image |
Part Number |
Manufacturer |
Description |
Package |
Stock |
Quantity |
Package |
Series |
Memory Type |
Memory Format |
Technology |
Memory Size |
Memory Interface |
Clock Frequency |
Write Cycle Time - Word, Page |
Access Time |
Voltage - Supply |
Operating Temperature |
Mounting Type |
Package / Case |
Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC EEPROM 32K I2C 1MHZ 8TSSOP
|
Package: 8-TSSOP (0.173", 4.40mm Width) |
Stock16,026 |
|
8-TSSOP (0.173", 4.40mm Width) |
24CW |
Non-Volatile |
EEPROM |
EEPROM |
32Kb (4K x 8) |
I²C |
1MHz |
5ms |
450ns |
1.6 V ~ 5.5 V |
-40°C ~ 85°C (TA) |
Surface Mount |
8-TSSOP (0.173", 4.40mm Width) |
8-TSSOP |
||
Microchip Technology |
IC EEPROM 8K SPI 20MHZ 8UDFN
|
Package: 8-UFDFN Exposed Pad |
Stock145,920 |
|
8-UFDFN Exposed Pad |
- |
Non-Volatile |
EEPROM |
EEPROM |
8Kb (1K x 8) |
SPI |
20MHz |
5ms |
- |
1.8 V ~ 5.5 V |
-40°C ~ 85°C (TA) |
Surface Mount |
8-UFDFN Exposed Pad |
8-UDFN (2x3) |
||
Microchip Technology |
IC EEPROM 32K I2C 1MHZ 8SOIC
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock12,510 |
|
8-SOIC (0.154", 3.90mm Width) |
24CW |
Non-Volatile |
EEPROM |
EEPROM |
32Kb (4K x 8) |
I²C |
1MHz |
5ms |
450ns |
1.6 V ~ 5.5 V |
-40°C ~ 85°C (TA) |
Surface Mount |
8-SOIC (0.154", 3.90mm Width) |
8-SOIC |
||
Microchip Technology |
1.6-5.5V, 1MHZ, IND TMP, 8-UDFN
|
Package: 8-UFDFN Exposed Pad |
Stock28,356 |
|
8-UFDFN Exposed Pad |
24CW |
Non-Volatile |
EEPROM |
EEPROM |
32Kb (4K x 8) |
I²C |
1MHz |
5ms |
450ns |
1.6 V ~ 5.5 V |
-40°C ~ 85°C (TA) |
Surface Mount |
8-UFDFN Exposed Pad |
8-UDFN (2x3) |
||
Microchip Technology |
IC EEPROM 64K I2C 1MHZ 8UDFN
|
Package: 8-UFDFN Exposed Pad |
Stock142,644 |
|
8-UFDFN Exposed Pad |
- |
Non-Volatile |
EEPROM |
EEPROM |
64Kb (8K x 8) |
I²C |
1MHz |
5ms |
450ns |
1.7 V ~ 5.5 V |
-40°C ~ 85°C (TA) |
Surface Mount |
8-UFDFN Exposed Pad |
8-UDFN (2x3) |
||
Microchip Technology |
IC EEPROM 16K I2C 1MHZ 8TSSOP
|
Package: 8-TSSOP (0.173", 4.40mm Width) |
Stock13,932 |
|
8-TSSOP (0.173", 4.40mm Width) |
24CW |
Non-Volatile |
EEPROM |
EEPROM |
16Kb (2K x 8) |
I²C |
1MHz |
5ms |
450ns |
1.6 V ~ 5.5 V |
-40°C ~ 85°C (TA) |
Surface Mount |
8-TSSOP (0.173", 4.40mm Width) |
8-TSSOP |
||
Microchip Technology |
1.6-5.5V, 1MHZ, IND TMP, 8-UDFN
|
Package: 8-UFDFN Exposed Pad |
Stock29,796 |
|
8-UFDFN Exposed Pad |
24CW |
Non-Volatile |
EEPROM |
EEPROM |
16Kb (2K x 8) |
I²C |
1MHz |
5ms |
450ns |
1.6 V ~ 5.5 V |
-40°C ~ 85°C (TA) |
Surface Mount |
8-UFDFN Exposed Pad |
8-UDFN (2x3) |
||
Microchip Technology |
IC EEPROM 4K SPI 20MHZ 8UDFN
|
Package: 8-UFDFN Exposed Pad |
Stock134,550 |
|
8-UFDFN Exposed Pad |
- |
Non-Volatile |
EEPROM |
EEPROM |
4Kb (512 x 8) |
SPI |
20MHz |
5ms |
- |
1.8 V ~ 5.5 V |
-40°C ~ 85°C (TA) |
Surface Mount |
8-UFDFN Exposed Pad |
8-UDFN (2x3) |
||
Microchip Technology |
IC EEPROM 16K I2C 1MHZ 8SOIC
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock14,574 |
|
8-SOIC (0.154", 3.90mm Width) |
24CW |
Non-Volatile |
EEPROM |
EEPROM |
16Kb (2K x 8) |
I²C |
1MHz |
5ms |
450ns |
1.6 V ~ 5.5 V |
-40°C ~ 85°C (TA) |
Surface Mount |
8-SOIC (0.154", 3.90mm Width) |
8-SOIC |
||
Microchip Technology |
IC EEPROM 2K SPI 2MHZ 8UDFN
|
Package: 8-UFDFN Exposed Pad |
Stock148,272 |
|
8-UFDFN Exposed Pad |
- |
Non-Volatile |
EEPROM |
EEPROM |
2Kb (256 x 8, 128 x 16) |
SPI |
2MHz |
5ms |
- |
1.7 V ~ 5.5 V |
-40°C ~ 85°C (TA) |
Surface Mount |
8-UFDFN Exposed Pad |
8-UDFN (2x3) |
||
Microchip Technology |
IC EEPROM 2K SPI 20MHZ 8UDFN
|
Package: 8-UFDFN Exposed Pad |
Stock130,584 |
|
8-UFDFN Exposed Pad |
- |
Non-Volatile |
EEPROM |
EEPROM |
2Kb (256 x 8) |
SPI |
20MHz |
5ms |
- |
1.8 V ~ 5.5 V |
-40°C ~ 85°C (TA) |
Surface Mount |
8-UFDFN Exposed Pad |
8-UDFN (2x3) |
||
Microchip Technology |
IC EEPROM 1K SPI 20MHZ 8UDFN
|
Package: 8-UFDFN Exposed Pad |
Stock160,458 |
|
8-UFDFN Exposed Pad |
- |
Non-Volatile |
EEPROM |
EEPROM |
1Kb (128 x 8) |
SPI |
20MHz |
5ms |
900ns |
1.8 V ~ 5.5 V |
-40°C ~ 85°C (TA) |
Surface Mount |
8-UFDFN Exposed Pad |
8-UDFN (2x3) |
||
Microchip Technology |
IC EEPROM 16K I2C 1MHZ 8UDFN
|
Package: 8-UFDFN Exposed Pad |
Stock150,552 |
|
8-UFDFN Exposed Pad |
- |
Non-Volatile |
EEPROM |
EEPROM |
16Kb (2K x 8) |
I²C |
1MHz |
5ms |
550ns |
1.7 V ~ 5.5 V |
-40°C ~ 85°C (TA) |
Surface Mount |
8-UFDFN Exposed Pad |
8-UDFN (2x3) |
||
Microchip Technology |
IC EEPROM 16K I2C 1MHZ 8TSSOP
|
Package: 8-TSSOP (0.173", 4.40mm Width) |
Stock21,594 |
|
8-TSSOP (0.173", 4.40mm Width) |
24CW |
Non-Volatile |
EEPROM |
EEPROM |
16Kb (2K x 8) |
I²C |
1MHz |
5ms |
450ns |
1.6 V ~ 5.5 V |
-40°C ~ 85°C (TA) |
Surface Mount |
8-TSSOP (0.173", 4.40mm Width) |
8-TSSOP |
||
Microchip Technology |
IC EEPROM 4K SPI 2MHZ 8UDFN
|
Package: 8-UFDFN Exposed Pad |
Stock142,434 |
|
8-UFDFN Exposed Pad |
- |
Non-Volatile |
EEPROM |
EEPROM |
4Kb (512 x 8, 256 x 16) |
SPI |
2MHz |
5ms |
- |
1.7 V ~ 5.5 V |
-40°C ~ 85°C (TA) |
Surface Mount |
8-UFDFN Exposed Pad |
8-UDFN (2x3) |
||
Microchip Technology |
IC EEPROM 1K I2C 125KHZ 8SOIC
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock27,420 |
|
8-SOIC (0.154", 3.90mm Width) |
- |
Non-Volatile |
EEPROM |
EEPROM |
1Kb (128 x 8) |
I²C, Single Wire |
125kHz |
5ms |
- |
2.7 V ~ 4.5 V |
-40°C ~ 85°C (TC) |
Surface Mount |
8-SOIC (0.154", 3.90mm Width) |
8-SOIC |
||
Microchip Technology |
IC EEPROM 1K I2C 125KHZ 8SOIC
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock28,638 |
|
8-SOIC (0.154", 3.90mm Width) |
- |
Non-Volatile |
EEPROM |
EEPROM |
1Kb (128 x 8) |
I²C, Single Wire |
125kHz |
5ms |
- |
1.7 V ~ 3.6 V |
-40°C ~ 85°C (TA) |
Surface Mount |
8-SOIC (0.154", 3.90mm Width) |
8-SOIC |
||
Microchip Technology |
IC EEPROM 2K I2C 1MHZ 8UDFN
|
Package: 8-UFDFN Exposed Pad |
Stock152,508 |
|
8-UFDFN Exposed Pad |
- |
Non-Volatile |
EEPROM |
EEPROM |
2Kb (256 x 8) |
I²C |
1MHz |
5ms |
- |
1.7 V ~ 5.5 V |
-40°C ~ 85°C (TA) |
Surface Mount |
8-UFDFN Exposed Pad |
8-UDFN (2x3) |
||
Microchip Technology |
IC EEPROM 8K I2C 1MHZ 8UDFN
|
Package: 8-UFDFN Exposed Pad |
Stock137,880 |
|
8-UFDFN Exposed Pad |
- |
Non-Volatile |
EEPROM |
EEPROM |
8Kb (1K x 8) |
I²C |
1MHz |
5ms |
550ns |
1.7 V ~ 5.5 V |
-40°C ~ 85°C (TA) |
Surface Mount |
8-UFDFN Exposed Pad |
8-UDFN (2x3) |
||
Microchip Technology |
IC EEPROM 1K I2C 1MHZ 8UDFN
|
Package: 8-UFDFN Exposed Pad |
Stock143,256 |
|
8-UFDFN Exposed Pad |
- |
Non-Volatile |
EEPROM |
EEPROM |
1Kb (128 x 8) |
I²C |
1MHz |
5ms |
550ns |
1.7 V ~ 5.5 V |
-40°C ~ 85°C (TA) |
Surface Mount |
8-UFDFN Exposed Pad |
8-UDFN (2x3) |
||
Microchip Technology |
IC EEPROM 16K I2C 1MHZ 8UDFN
|
Package: 8-UFDFN Exposed Pad |
Stock126,360 |
|
8-UFDFN Exposed Pad |
- |
Non-Volatile |
EEPROM |
EEPROM |
16Kb (2K x 8) |
I²C |
1MHz |
5ms |
450ns |
1.7 V ~ 3.6 V |
-40°C ~ 85°C (TC) |
Surface Mount |
8-UFDFN Exposed Pad |
8-UDFN (2x3) |
||
Microchip Technology |
IC EEPROM 256KBIT 200NS 32PLCC
|
Package: 32-LCC (J-Lead) |
Stock3,712 |
|
32-LCC (J-Lead) |
- |
Non-Volatile |
EEPROM |
EEPROM |
256Kb (32K x 8) |
Parallel |
- |
10ms |
200ns |
4.5 V ~ 5.5 V |
0°C ~ 70°C (TC) |
Surface Mount |
32-LCC (J-Lead) |
32-PLCC |
||
Microchip Technology |
IC EEPROM 1M PARALLEL 32CDIP
|
Package: 32-CDIP (0.600", 15.24mm) Window |
Stock3,248 |
|
32-CDIP (0.600", 15.24mm) Window |
- |
Non-Volatile |
EEPROM |
EEPROM |
1Mb (128K x 8) |
Parallel |
- |
10ms |
150ns |
4.5 V ~ 5.5 V |
-55°C ~ 125°C (TC) |
Through Hole |
32-CDIP (0.600", 15.24mm) Window |
32-CDIP |
||
Microchip Technology |
IC EEPROM 1M PARALLEL 32CDIP
|
Package: 32-CDIP (0.600", 15.24mm) Window |
Stock7,728 |
|
32-CDIP (0.600", 15.24mm) Window |
- |
Non-Volatile |
EEPROM |
EEPROM |
1Mb (128K x 8) |
Parallel |
- |
10ms |
120ns |
4.5 V ~ 5.5 V |
-55°C ~ 125°C (TC) |
Through Hole |
32-CDIP (0.600", 15.24mm) Window |
32-CDIP |
||
Microchip Technology |
IC EEPROM 256K PARALLEL 28CDIP
|
Package: 28-CDIP (0.600", 15.24mm) |
Stock3,744 |
|
28-CDIP (0.600", 15.24mm) |
- |
Non-Volatile |
EEPROM |
EEPROM |
256Kb (32K x 8) |
Parallel |
- |
10ms |
150ns |
4.5 V ~ 5.5 V |
-55°C ~ 125°C (TC) |
Through Hole |
28-CDIP (0.600", 15.24mm) |
28-CDIP |
||
Microchip Technology |
IC EEPROM 1MBIT 150NS 44CLCC
|
Package: 44-CLCC |
Stock4,752 |
|
44-CLCC |
- |
Non-Volatile |
EEPROM |
EEPROM |
1Mb (128K x 8) |
Parallel |
- |
10ms |
150ns |
4.5 V ~ 5.5 V |
-55°C ~ 125°C (TC) |
Surface Mount |
44-CLCC |
44-CLCC (16.54x16.54) |
||
Microchip Technology |
IC EEPROM 1MBIT 120NS 44CLCC
|
Package: 44-CLCC |
Stock6,880 |
|
44-CLCC |
- |
Non-Volatile |
EEPROM |
EEPROM |
1Mb (128K x 8) |
Parallel |
- |
10ms |
120ns |
4.5 V ~ 5.5 V |
-55°C ~ 125°C (TC) |
Surface Mount |
44-CLCC |
44-CLCC (16.54x16.54) |
||
Microchip Technology |
IC EEPROM 1M PARALLEL 32CDIP
|
Package: 32-CDIP (0.600", 15.24mm) Window |
Stock6,752 |
|
32-CDIP (0.600", 15.24mm) Window |
- |
Non-Volatile |
EEPROM |
EEPROM |
1Mb (128K x 8) |
Parallel |
- |
10ms |
250ns |
4.5 V ~ 5.5 V |
-55°C ~ 125°C (TC) |
Through Hole |
32-CDIP (0.600", 15.24mm) Window |
32-CDIP |
||
Microchip Technology |
IC EEPROM 1M PARALLEL 32CDIP
|
Package: 32-CDIP (0.600", 15.24mm) Window |
Stock4,688 |
|
32-CDIP (0.600", 15.24mm) Window |
- |
Non-Volatile |
EEPROM |
EEPROM |
1Mb (128K x 8) |
Parallel |
- |
10ms |
200ns |
4.5 V ~ 5.5 V |
-55°C ~ 125°C (TC) |
Through Hole |
32-CDIP (0.600", 15.24mm) Window |
32-CDIP |
||
Microchip Technology |
IC EEPROM 1M PARALLEL 32CDIP
|
Package: 32-CDIP (0.600", 15.24mm) Window |
Stock4,544 |
|
32-CDIP (0.600", 15.24mm) Window |
- |
Non-Volatile |
EEPROM |
EEPROM |
1Mb (128K x 8) |
Parallel |
- |
10ms |
150ns |
4.5 V ~ 5.5 V |
-55°C ~ 125°C (TC) |
Through Hole |
32-CDIP (0.600", 15.24mm) Window |
32-CDIP |